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WO2018191835A1 - Système de refroidissement de boîtier de machine fermée basé sur un caloduc en boucle plate - Google Patents

Système de refroidissement de boîtier de machine fermée basé sur un caloduc en boucle plate Download PDF

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Publication number
WO2018191835A1
WO2018191835A1 PCT/CN2017/000654 CN2017000654W WO2018191835A1 WO 2018191835 A1 WO2018191835 A1 WO 2018191835A1 CN 2017000654 W CN2017000654 W CN 2017000654W WO 2018191835 A1 WO2018191835 A1 WO 2018191835A1
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WO
WIPO (PCT)
Prior art keywords
closed
heat dissipation
chassis
machine case
flat loop
Prior art date
Application number
PCT/CN2017/000654
Other languages
English (en)
Chinese (zh)
Inventor
刘东晓
张红星
满广龙
李国广
Original Assignee
北京空间飞行器总体设计部
刘东晓
张红星
满广龙
李国广
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京空间飞行器总体设计部, 刘东晓, 张红星, 满广龙, 李国广 filed Critical 北京空间飞行器总体设计部
Publication of WO2018191835A1 publication Critical patent/WO2018191835A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the invention relates to a heat dissipation system, in particular to a heat dissipation system based on a flat loop heat pipe heat transfer technology, and belongs to the technical field of heat dissipation.
  • the CPU and GPU are the core power consumption components of the computer.
  • the heat dissipation of the computer chassis is mainly based on ventilation and heat dissipation, and the ventilation and heat dissipation requires the chassis to be opened.
  • the heat dissipation method can not achieve the enclosure closure, and can not prevent the entry of dust and moisture. Therefore, the open chassis design is the core factor causing the computer failure.
  • the closed chassis design is an effective means to solve the above problems, but it is transmitted. The impact of the level of thermal technology development has not been promoted and applied.
  • the present invention provides a closed chassis heat dissipation system based on a flat loop heat pipe, and realizes a closed design of the heat dissipation chassis on the basis of solving the heat dissipation problem of the high power component.
  • the closed loop heat dissipation system based on a flat loop heat pipe, wherein the flat loop heat pipe comprises: a liquid storage device, an evaporator, a condenser, a steam pipeline, and a liquid pipeline;
  • the closed chassis heat dissipation system comprises: a closed chassis, heat dissipating fins mounted on the outside of the closed chassis, and a set of flat loop heat pipes installed inside the closed chassis; the evaporator of the flat loop heat pipe is closely attached Enclose a device in the chassis that requires heat dissipation;
  • the enclosed chassis includes: a movable side panel, a chassis frame and a heat dissipation side panel; one end of the chassis frame is closed by a movable side panel, and the other end is closed by a heat dissipation side panel; the heat dissipation fin and the flat loop heat pipe condenser
  • the heat dissipation side plate is integrated on the heat dissipation side plate.
  • the condenser of the flat loop heat pipe is integrated on one end surface of the heat dissipation side plate facing the chassis frame, and the heat dissipation fin is integrated on one end surface of the chassis frame. .
  • a flexible joint is provided on both the steam line and the liquid line of the flat loop heat pipe, and the flexible joint realizes flexible bending of the duct steam line and the liquid line.
  • the accumulator and the evaporator are integrated and integrated.
  • the heat dissipating fins are integrally formed with the heat dissipating side plates, and the condenser side plates of the flat ring heat pipes are integrated with the heat dissipating side plates by brazing or pasting.
  • the flat ring heat pipe has higher heat transfer capacity and limited heat flux heat dissipation capability, and can solve the heat dissipation problem under the condition of unforced convection of high power devices such as CPU and GPU;
  • FIG. 1 is a schematic diagram of a fully enclosed computer case based on a flat loop heat pipe
  • Figure 2 is a diagram showing the external structure of a fully enclosed computer case
  • FIG. 3 is a structural diagram of a heat dissipation side plate of a fully enclosed computer case
  • 10--closed computer case 11-active side plate, 12-chassis frame, 13-heat side plate, 13-1- side plate base, 20-heat fins, 30-plate loop heat pipe, 31-storage Liquid, 32-evaporator, 33-condenser, 34-catheter, 34-1-vapor line, 34-2-liquid line, 34-3-flexible joint.
  • the embodiment provides a closed computer cooling system based on a flat loop heat pipe, which changes the heat dissipation mode of the conventional computer chassis, and uses a flat loop heat pipe heat transfer technology to the high power device on the basis of fully sealing the computer case. Cool down.
  • the fully enclosed computer cooling system includes: a closed chassis 10 , a heat dissipating fin 20 , and a flat loop heat pipe 30 ; wherein the flat ring heat pipe 30 can be set according to the needs of the heat sink component, as shown in FIG. 1 .
  • Two sets of flat loop heat pipes 30 are disposed in the enclosed casing 10.
  • a closed loop heat pipe 30 is installed inside the closed chassis 10, and the heat dissipating fins 20 are externally mounted.
  • the flat loop heat pipe 30 collects heat of the large power consumption device, and is transmitted to the heat dissipating fins 20 through the closed chassis 10 for dissipation, and the heat dissipating fins 20 are integrated.
  • the condensing end of the flat loop heat pipe 30 is also integrated on the enclosed chassis 10.
  • the flat loop heat pipe 30 includes a reservoir 31, an evaporator 32, a condenser 33, and a conduit 34.
  • Liquid reservoir 31 and the evaporator 32 adopt an integrated integrated design.
  • the evaporator 32 is closely attached to the high-power device in the closed chassis 10.
  • the condenser 33 is integrated with the closed chassis 10 and the heat dissipating fins, and the loop working medium is used.
  • the gas-liquid two-state circulation flows along the flat-loop heat pipe 30, so that the heat of the high-power device is dissipated to the external environment of the heat-dissipating fins 20.
  • the conduit 34 includes a vapor line 34-1, a liquid line 34-2, and a flexible joint 34-3.
  • the working medium in the accumulator 31 is in a liquid state, the working medium absorbs heat in the evaporator 32, and the steam flows along the steam line 34-1 to the condenser 33.
  • the working medium is condensed and liquefied in the condenser 33, and then along the liquid line 34.
  • -2 is returned to the accumulator 31 to achieve a two-phase circulating flow of the working gas.
  • a flexible joint 34-3 is disposed on the steam line 34-1 and the liquid line 34-2.
  • the flexible joint 34-3 can realize flexible bending of the duct 34 to facilitate the installation arrangement of the flat loop heat pipe 30.
  • the enclosed computer case 10 includes a movable side panel 11, a chassis frame 12, and a heat dissipation side panel 13.
  • the chassis frame 12 has one end fixed to the movable side panel 11 and closed, and the other end is fixed after being fixed to the heat dissipation side panel 13.
  • the movable side panel 11 is connected to the chassis frame 12, which can be easily disassembled, and provides a convenient space for disassembly and assembly of the computer.
  • the chassis frame 12 and the heat dissipation side panel 13 are connected and fixed as a mounting and fixing support structure for the internal board and components of the computer.
  • the connection between the movable side panel 11 and the chassis frame 12, the heat dissipation side panel 13 and the chassis frame 12 can be sealed or even sealed according to actual environmental requirements.
  • the heat dissipation side plate 13 of the fully enclosed computer case 10 is a composite structure, and includes a side plate substrate 13-1 and a flat ring integrated on the inner surface of the heat dissipation side plate 13 (ie, an end surface located in the chassis frame 12).
  • the side plate substrate 13-1 and the heat dissipating fins 20 are integrally formed, and the side plate substrate 13-1 and the condenser 33 of the flat ring heat pipe 10 are integrated by a process such as brazing and bonding, and the integrated composite structure helps to reduce the number of The contact thermal resistance can effectively improve the heat dissipation performance of the system.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un système de refroidissement de boîtier de machine fermée basé sur un caloduc en boucle plate, apte à réaliser une conception fermée d'un boîtier de machine refroidi tout en résolvant le problème de refroidissement d'un composant de consommation d'énergie élevée. Le système de refroidissement de boîtier de machine fermée comprend : un boîtier de machine fermée, une ailette de refroidissement installée à l'extérieur du boîtier de machine fermée et un ou plusieurs ensembles de caloducs en boucle plats installés à l'intérieur du boîtier de machine fermée; un évaporateur du caloduc en boucle plate est étroitement fixé au dispositif dans le cas de machine fermée nécessitant un refroidissement. Le boîtier de machine fermée comprend : un panneau latéral mobile, un cadre de boîtier de machine et un panneau latéral de refroidissement; une extrémité du cadre de boîtier de machine est fermée au moyen du panneau latéral mobile, et une autre extrémité est fermée au moyen du panneau latéral de refroidissement; l'ailette de refroidissement et un condenseur du caloduc en boucle plat sont assemblés sur le panneau latéral de refroidissement. Le présent système de refroidissement transmet de la chaleur à l'extérieur d'un boîtier de machine à dissiper au moyen d'un caloduc en boucle plate, mettant en oeuvre une conception étanche d'un boîtier de machine, la mise en oeuvre d'une protection contre la poussière et l'étanchéité à l'humidité du boîtier de machine, et peut augmenter la durée de vie, la fiabilité et l'adaptabilité à un environnement d'utilisation complexe et difficile de l'équipement correspondant.
PCT/CN2017/000654 2017-04-19 2017-10-31 Système de refroidissement de boîtier de machine fermée basé sur un caloduc en boucle plate WO2018191835A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710257573.6 2017-04-19
CN201710257573.6A CN106909210A (zh) 2017-04-19 2017-04-19 基于平板环路热管的封闭式机箱散热系统

Publications (1)

Publication Number Publication Date
WO2018191835A1 true WO2018191835A1 (fr) 2018-10-25

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CN (1) CN106909210A (fr)
WO (1) WO2018191835A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106909210A (zh) * 2017-04-19 2017-06-30 北京空间飞行器总体设计部 基于平板环路热管的封闭式机箱散热系统
CN112486286A (zh) * 2020-12-01 2021-03-12 珠海大横琴科技发展有限公司 一种大数据服务器
CN112566465B (zh) * 2020-12-08 2022-02-08 泰睿(北京)技术服务有限公司 一种基于环路热管的机箱内置式散热装置
CN113451925B (zh) * 2021-08-19 2022-11-01 浙江启明电力集团有限公司 一种高性能防爆式智能配电箱
CN115412649A (zh) * 2022-08-16 2022-11-29 常州大学 一种传真机用热管式散热系统

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CN1995897A (zh) * 2007-01-08 2007-07-11 刘海云 冷凝器箱体化热管
CN201341277Y (zh) * 2008-06-24 2009-11-04 广州中镨能源科技有限公司 封闭式散热机箱
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CN103576811A (zh) * 2013-11-06 2014-02-12 曙光信息产业(北京)有限公司 用于计算机的散热组件
CN106909210A (zh) * 2017-04-19 2017-06-30 北京空间飞行器总体设计部 基于平板环路热管的封闭式机箱散热系统

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CN101308398B (zh) * 2008-06-30 2012-08-22 中山大学 用于计算处理设备的散热系统及采用该散热系统的设备
CN102157468B (zh) * 2011-03-17 2013-01-16 北京芯铠电子散热技术有限责任公司 一种大功率环路热管散热器及其制作方法
CN104820480A (zh) * 2015-04-30 2015-08-05 天津徊达科技有限公司 台式电脑用散热防尘机箱
CN205812614U (zh) * 2016-06-14 2016-12-14 中国航空无线电电子研究所 一种液态金属散热机箱
CN105992476B (zh) * 2016-07-13 2019-01-11 西安电子工程研究所 一种具有多模块独立散热风道的密封机箱

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1995897A (zh) * 2007-01-08 2007-07-11 刘海云 冷凝器箱体化热管
CN101610662A (zh) * 2008-06-20 2009-12-23 沈国忠 热管冷却式全密封高效散热电子机箱
CN201341277Y (zh) * 2008-06-24 2009-11-04 广州中镨能源科技有限公司 封闭式散热机箱
CN103576811A (zh) * 2013-11-06 2014-02-12 曙光信息产业(北京)有限公司 用于计算机的散热组件
CN106909210A (zh) * 2017-04-19 2017-06-30 北京空间飞行器总体设计部 基于平板环路热管的封闭式机箱散热系统

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