WO2018192668A1

WO2018192668A1 - Material deposition arrangement, a method for depositing material and a material deposition chamber

Info

Publication number: WO2018192668A1
Application number: PCT/EP2017/059505
Authority: WO
Inventors: Frank Schnappenberger; Thomas Deppisch; Stefan Hein; Annabelle HOFMANN
Original assignee: Applied Materials, Inc.
Priority date: 2017-04-21
Filing date: 2017-04-21
Publication date: 2018-10-25
Also published as: TW201907031A; CN110462096A; TWI677586B

Abstract

A material deposition arrangement chamber (1000) for depositing a material on a substrate is described. The material deposition arrangement chamber comprises a vacuum generation device (1060) and a material deposition arrangement (100) having a valve element (200), configured to regulate the material flow-through of the material to be deposited.

Description

MATERIAL DEPOSITION ARRANGEMENT, A METHOD FOR

DEPOSITING MATERIAL AND A MATERIAL DEPOSITION

CHAMBER

TECHNICAL FIELD [1] Embodiments of the present disclosure relate to a material deposition arrangement including a valve element. Additionally, embodiments relate to a material deposition chamber. Furthermore, embodiments also relate to a process for the deposition of material. In particular, embodiments of the present disclosure relate to the vacuum coating of substrates as used in several technological areas with the need for evaporating different materials to form layers on substrates.

BACKGROUND

[2] An evaporation process for the deposition of material normally involves two basic processes; a hot source material evaporates and then condenses on a substrate. One way to carry out evaporation is, inter alia, the thermal method wherein e.g. metal material is either fed onto a heated semi-metal like ceramics or placed into a crucible that is e.g. electrically heated. The melted metal material evaporates into a cloud above the source and is then guided to the substrate for the formation of one or more deposition layers.

[3] Evaporation technics are, however, not limited to the evaporation of metals but can also be carried out in combination with organic materials. Organic evaporators for example, are suitable for the production of organic light-emitting diodes (OLEDs). For the function of such diodes an emissive layer of certain organic compounds is deposited on a suitable substrate. The layer then comprises a thin-film of the deposition material. OLEDs can be used in conjunction with several applications, e.g. in the manufacture of television screens, monitors, tablet, smartphone and other hand-held devices etc. Additionally, a lot of other applications are conceivable in the field of OLED technology. [4] One parameter when evaporating material is the temperature that is used to evaporate the deposition material. The temperature is not only relevant for ensuring a time efficient, undisturbed and proper change of the physical state of the material but also includes high demands on the materials and the construction design. Since the materials involved in the process are very expensive, any dissipation of material is to be avoided.

[5] Accordingly, there is a need for material deposition arrangements and processes that are suitable for the use in such conditions as described.

SUMMARY [6] In light of the above, a material deposition arrangement, a material deposition arrangement chamber and a method for depositing material on a substrate according to the independent claims are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description and the accompanying drawings. [7] According to an aspect of the present disclosure, a material deposition arrangement is provided. The material deposition arrangement includes a valve element wherein at least part of the valve element is heatable.

[8] According to an aspect of the present disclosure, a material deposition arrangement chamber is provided. The material deposition arrangement chamber includes a material deposition arrangement according to embodiments described herein and a vacuum generation device.

[9] According to an aspect of the present disclosure, a method for depositing material on a substrate is provided. The method includes directly heating a valve element. BRIEF DESCRIPTION OF THE DRAWINGS

[10] In the following, a brief description of the accompanying drawings is given. The drawings are intended to help with the detailed description of the disclosed invention following below.

FIG. 1 shows a schematic cross-sectional view of a material deposition arrangement according to some of the embodiments described herein;

FIG. 2 shows a schematic cross-sectional view of a valve element according to embodiments described herein, with the valve element being in a first position;

FIG. 3 shows a schematic cross-sectional view of the valve element according to the embodiments described with respect to FIG. 2, wherein the valve element is at a second position;

FIG. 4 shows a schematic cross-sectional view of the valve element according to embodiments described herein;

FIG. 5 shows a schematic cross-sectional view of a closure device according to embodiments described herein;

FIG. 6 shows a schematic cross-sectional view of the closure device according to embodiments described herein;

FIG. 7 shows a schematic cross-sectional view of the valve element with a driving mechanism and an actuation attached thereto according to embodiments described herein;

FIG. 8 shows a schematic cross-sectional view of the valve element with a driving mechanism according to embodiments described herein;

FIG. 9 shows a schematic cross-sectional view of the valve element according to embodiments described herein, with the valve element being in a first position; FIG. 10 shows a schematic cross-sectional view of the valve element according to embodiments described herein with respect to FIG. 9, wherein the valve element is at a second position;

FIG. 11 shows a schematic cross-sectional view of the valve element according to embodiments described herein;

FIG. 12 shows a schematic cross-sectional view of a valve element according to embodiments described herein; shows a schematic cross-sectional view of a material deposition chamber according to embodiments described herein. DETAILED DESCRIPTION OF EMBODIMENTS

[11] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations.

[12] Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can apply to a corresponding part or aspect in another embodiment as well.

[13] Before various embodiments of the present disclosure are described in more detail, some aspects with respect to some terms and expressions used herein are explained. [14] In the present disclosure, a "material deposition arrangement" is understood as an arrangement configured for material deposition. In particular, a "material deposition arrangement" can be understood as an arrangement configured for the deposition of materials that have been transferred into a gaseous state before they are directed to the substrate. A "material deposition arrangement" for example includes a crucible that allows for evaporation of a material which is then transferred via inlet and/or outlet tubes to a substrate and deposited thereon. [15] In the present disclosure, a "crucible" is understood as a structure that allows for the use of high temperatures inter alia of the handling of material at high temperatures. The "crucible" can be connected to a shower head, for example via an enclosure, hollow space, pipe and/or valve. A "crucible" can also be part of an evaporator where the evaporation of a material may take place. [16] In the present disclosure, a "shower head" is understood as a spray-like device that allows for the distribution of deposition material on a substrate. The "shower head" can include several openings that are connected to an enclosure, hollow space, pipe and/or valve, in which the evaporated material can be provided or guided, for example from the evaporation crucible to the substrate. The shower head may be directed in a horizontal or vertical direction or elsewhere in between a horizontal or vertical orientation.

[17] In the present disclosure, a "valve element" is understood as a valve that any material that is in a liquid or gaseous phase can flow through. The "valve element" typically connects a material origin to a material destination and allows for the control of this connection. A "valve element" as used herein may influence one or more of the following factors: The flow rate, the flow velocity and the back pressure can be regulated by regulating the "valve element". Furthermore, the "valve element" may be used to regulate the flow-through of evaporated material that is transferred from the crucible to the shower head. The "valve element" can be a single component that can be combined with or arranged between an inlet and/or an outlet tube. The "valve element" can act as a shutter. The "valve element" allows for controlling the flow through the material deposition arrangement. The "valve element" may be exchangeable. The "valve element" may be suitable for single-use applications. [18] In the present disclosure, the "flow" or "flow through" is understood as a flow of particles that can occur bi-directional. For example, evaporated material can flow from the evaporator through the valve element in the direction of the shower head. Additionally, particles can flow from the material deposition arrangement chamber in the direction of the evaporator. The valve element may control, limit and/or prevent the "flow".

[19] In the present disclosure, a "contact area" is understood as a part of a tube wall that can be in contact with another element, for example a part of an inner tube wall that is occupied by a contact element upon closing the valve element. The "contact area" may be positioned adjacent to or be a part of a valve neck.

[20] In the present disclosure, a "valve neck" is understood as a constriction of the inlet tube wall or the outlet tube wall. The "valve neck" may act as a boundary for the closure device.

[21] In the present disclosure, an "inlet tube" is understood as a tube that can act as a connection between the evaporator and the shower head. Typically, the "inlet tube" is connected to a valve element and/or an outlet tube on one side and to an evaporator on another side. The "inlet tube" can also include a valve neck. The diameter can vary in different sections of the tube. The "inlet tube" typically includes two walls, an inner and an outer tube wall. [22] In the present disclosure, an "outlet tube" is understood as a tube that can act as a connection between the evaporator and the shower head. Typically, the "outlet tube" is connected to a valve element and/or an inlet tube on one side and to a shower head on another side. The "outlet tube" can also include a valve neck. The diameter can vary in different sections of the tube. The "outlet tube" typically includes two walls, an inner and an outer tube wall.

[23] In the present disclosure, "being oriented in an inlet direction" is understood as a position of the closure device. The closure device can adopt an "inlet position" when the closure device may be oriented towards an inlet tube. When being in an "inlet position" the closure device may be in a vertical position. [24] In the present disclosure, "being oriented in an outlet direction" is understood as a position of the closure device. The closure device can adopt an "outlet position" when the closure device may be oriented towards an outlet tube. When being in an "outlet position" the closure device may be in a horizontal position. [25] In the present disclosure, "approximate" is understood as e.g. including a ± 20 % deviation, particularly a ± 15 % deviation, and more particularly ± 10 % deviation.

[26] FIG. 1 shows a schematic cross-sectional view of a material deposition arrangement 100 according to some of the embodiments described herein. The material deposition arrangement 100 may be used, inter alia, for the coating of a substrate. The substrate may be of every group of materials that is suitable for thermal deposition coating e.g. films or foils. According to embodiments, the material deposition arrangement 100 may include an evaporator 110 and a shower head 120 but is not limited to these features. The evaporator 110 may include a crucible 112. The evaporator may be connected to an inlet tube 115.

[27] A valve element 200 may control the connection between the evaporator and/or the crucible and the shower head 120. The valve element 200 may be arranged between an inlet tube 115 and an outlet tube 116. The valve element may provide an atmospheric isolation of the evaporator and the shower head. The outlet tube 116 may be connected to the shower head 120.

[28] The crucible may be used to heat material to be deposited. The crucible may e.g. be a tub. Typical materials used for deposition processes that can be used with embodiments described herein, may be metals, organic semiconductors or materials like silicon dioxide. The materials to be deposited influence the shape of the process therein, in that the parameters for treating the material to be deposited may differ depending on the physical and chemical characteristics of the materials. The temperature of the crucible may be regulated. Temperature regulation may occur through the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy. Examples for heating mechanisms that may be applied can be: Heating wires, thermal elements, jacket tube heating, quartz radiators and/or graphite heating bodies.

[29] For example, the operating temperature of the material deposition arrangement may be in the range of 300 °C to 800 °C. The evaporator and/or the crucible may be made of thermally stable, resistant and/or inert material, inter alia, of metal, particularly of carbide, more particularly of stainless steel or titanium. The inlet tube 115 may allow for the transmission of the deposition material. According to embodiments, the inlet tube 115 and the outlet tube 116 may allow for the deposition material transmission. The inner tube may include an inner wall 111 and an outer wall 113. The outlet tube may also include an inner wall 117 and an outer wall 118. The inner walls 111, 117 may be thermal conductors whereas the outer walls 113, 118 may be thermal isolators. The gap between the inner wall and the outer wall of the inlet tube and/or the outlet tube may be used in terms of heating at least parts of the material deposition arrangement 100.

[30] According to embodiments, all parts of the material deposition arrangement may be heated. It is also possible that one part is heated and another part is not. The evaporator, the inlet tube, the outlet tube, the shower head and/or the valve element may include double walls wherein the inner walls may be thermal conductors whereas the outer walls may be thermal isolators. A controller may be configured for setting the temperatures of the heatable parts. For example, the crucible may be heated to the best suitable material deposition temperature of the material to be deposited. The temperature of the valve element 200 may be set higher than the temperature of the crucible 112. For example, the temperature may be set between 5 °C and 20 °C higher, in particular approximately 10 °C higher. The shower head 120 may be heated to a temperature that is higher than the temperature of the valve element 200. For example, the temperature may be set at least between 5 °C and 20 °C higher than the temperature of the valve element 200, in particular approximately 10 °C higher. [31] For example, the material to be deposited is heated to 450 °C. The valve element may be heated to 460 °C. In this example, the shower head could have a temperature of 470 °C.

[32] The gap between inner and outer walls may be used for the regulation of the temperature of the material deposition arrangement. Temperature regulation may occur by the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy. Examples for heating mechanisms that may be applied are: Heating wires, thermal elements, jacket tube heating, quartz radiators and/or graphite heating bodies. [33] FIG. 2 shows a schematic cross-sectional view of a valve element 200 according to embodiments described herein, with the valve element being in a closed position. The valve element is designed to allow e.g. separation of an evaporator and a shower head that may be adjacent to a substrate. In implementations, an inlet tube 115 may link the valve element 200 and the evaporator. An outlet tube 116 typically links the valve element 200 and a shower head. The valve element 200 may be arranged between the inlet tube 115 and the outlet tube 116. The valve element may include a valve chamber 222.

[34] Both, the inlet and the outlet tube, may include inner tube walls 111, 117 and outer tube walls 113, 118. The inner walls 111, 117 may be thermal conductors whereas the outer walls 113, 118 may be thermal isolators. The inlet tube and/or the outlet tube may include a valve neck 214 and/or a contact area 219.

[35] The gap between the inner walls 111, 117 and the outer walls 113, 118 may be used in terms of temperature regulation of the inlet tube 115 and outlet tube 116 of the valve element 200. Temperature regulation may occur through the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy. Examples for heating mechanisms that may be applied are: Heating wires, thermal elements, jacket tube heating, quartz radiators and/or graphite heating bodies. The outer walls of the inlet tube and the outer walls of the outlet tube may be seamlessly merged. [36] According to embodiments the valve element may include a closure device 230. The valve element may be constructed so that the closure device 230 may adopt several configurations. One configuration is the closed configuration. The closure device may include a contact element 234. The contact element 234 of the closure device may be flush with the contact area 219 of the inner inlet tube wall 111 in the closed configuration. In another embodiment, the contact element may be flush with the contact area of the inner outlet tube wall 117 in the closed configuration. The closure device and the tube wall may particularly form a metallic seal. [37] In some embodiments, the contact element 234 may include an outer ring. The outer ring may be made of a metal, particularly of a soft metal, more particularly of copper, stainless steel and/or gold. The outer ring may have a tapered rim. Through contact with the contact area 219, the ring may deform to form a seal. In another embodiment, the contact area may include a layer of material. The material may be metal, particularly a soft metal, more particularly copper, stainless steel and/or gold. Through contact with the contact element 234, the material may deform to form a seal. The seal may be exchangeable.

[38] The term "metallic seal" is understood as that a sealing is generated by the connection of two metallic elements e.g. of the contact area and the contact element. Beneficial materials may, be for example, titanium and/or stainless steel. Additionally, the "metallic seal" may include an additional sealing material element, e.g. made of metals such as copper, between the contact element and the contact area.

[39] In embodiments, the upper end 235 of the contact element may be flush with the valve neck 214. The closed configuration does not allow for material transfer from the evaporator to the shower head or vice versa. One positive effect of the closed configuration may be, that flow-through of inter alia evaporated material through the valve element may be limited or even prevented. The degree of sealing may lie in the area of about 0.1 mbar and 10 mbar. [40] During material deposition, the process may be stopped for several reasons. For example, a new substrate has to be provided adjacent to the shower head or the material deposition arrangement has to be cleaned during several applications. Generally, it may be of interest to only stop the transfer of material to be deposited to the shower head but not the whole deposition process. Thus, another benefit may be that by bringing the closure device in a closed configuration, the material deposition process may be interrupted without interrupting the transition of material into another physical state. For example, it is possible to let material evaporate in the evaporator but simultaneously prevent the transmission of evaporated material to the substrate by having the closure device in a closed configuration.

[41] FIG. 3 shows a schematic cross-sectional view of the valve element according to the embodiments described with respect to FIG. 2, wherein the valve element 200 is at an open position. FIG. 3 shows the closure device 230 in an open configuration. The contact element 230 and the inner tube walls 111, 117 at the contact area 219 may be contact- free. The upper end 235 of the contact element and the valve neck 214 may be contact- free as well. The closure device may be repositioned in the direction of the evaporator.

[42] Embodiments displayed in FIG. 4 include the side area 236 where the material deposition flow-through may pass the closure device. The side area 236 may be the cross-sectional area between an inlet tube and/or an outlet tube and the contact element. The side area may emerge when the closure device adopts an open configuration. According to embodiments, the side area may emerge when the valve element is oriented in an inlet and/or outlet direction and the closure device may adopt an open configuration.

[43] The side area 236 may approximate the valve chamber area 238. The valve chamber area 238 may be the cross-sectional area between the guidance element 234 and the inner valve chamber wall 224. This configuration protects the system from a loss of pressure. [44] All parts or at least the closure device, the valve element, the inlet tube, the outlet tube, the evaporator and the shower head of the material deposition arrangement may include or even consist of materials such as carbides, stainless steel or titanium. The material may be capable of withstanding high temperatures. The material may be chemically inert. The material may allow thermal transmission if not stated otherwise.

[45] The valve element may include or even consist of inert materials such as carbides, stainless steel or titanium. The closure device may be made from the same material than the valve element but is not limited thereto. The closure device may include or even consist of a material that allows for thermal transmission. The closure device may also include or even consist of a material that is thermally stable. The closure device may be made of an inert material.

[46] As exemplarily shown in FIG. 5, the closure device 230 may include a contact element 234 and a guidance element 232. The guidance element 232 may be made of a material that allows for thermal transmission. In embodiments, the guidance element 232 is connected to the contact element 234 e.g. the guidance element may be formed integrally with the contact element. The guidance element 232 may be used to change the configuration of the closure device 230. By acting on the guidance element 232 the contact element 234 may be repositioned. The guidance element may include a mounting part. The guidance element may include thermal insulation, in particular at the mounting part.

[47] In embodiments, the closure device may include a heating device 440. The heating device 440 may include a connection element 442. The heating device 440 may include a heatable cartridge. The heating device may be embedded in the valve element, in particular in the closure device, more particular in the guidance element and/or the contact element. The connection element 442 may connect the heating device for temperature regulation.

[48] The heating device may include several heating mechanisms. For example, the heating device 440 may be heated electrically. The temperature of the heating device 440 may generally be regulated by the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy into heat. Examples for heating mechanisms that may be applied are: Heating wires, thermal elements, quartz radiators and/or graphite heating bodies. [49] According to embodiments illustrated with respect to FIG. 5, the heating device may extend from the guidance element into the contact element. According to embodiments displayed in FIG. 6, the heating device may be included by the guidance element only. Thermal energy may be provided through the guidance element and may be transferred to the closure element via heat transfer. In another embodiment, the heating device may be included by the contact element only.

[50] The heating device may come close to the lower end 233 of the contact element so as to most effectively transfer heat energy to the lower end 233 of the contact element 234. The distance between the lower end of the heating device 440 and the lower end 233 of the contact element 234 may be less than 5 mm, in particular even equal to or less than 2 mm.

[51] Heating of the closure device provides several benefits. Normally, there is a negative temperature gradient between the evaporator and the valve element. Since the closure device may be used to limit or prevent the transmission of deposition material that may exist in a gaseous state, the negative temperature gradient promotes condensation of the vapour at the valve element. By heating the closure device of the valve element the negative temperature gradient is removed and condensation at the closure device is prevented. The negative temperature gradient may also be reversed to a positive temperature gradient. For instance, a higher temperature may be applied to the closure device in comparison to the evaporator.

[52] A controller may be used to regulate the temperature. For example, the temperature of the closing device and/or the valve element may be set 5 °C -20 °C higher, in particular 10 °C higher than the temperature of the evaporator. The shower head 120 may be heated to a temperature that is higher than the temperature of the valve element 200. For example, the temperature may be set at least between 5 °C and 20 °C higher than the temperature of the valve element 200, in particular approximately 10 °C higher.

[53] In a specific example, material is heated in the crucible 112 and evaporated. The vapour flows through the inlet tube in the direction of the outlet tube of the valve element. The closure device may be in a closed configuration as shown in FIG. 2 and the closure device may be heated to a temperature that may be at least 5 °C higher than the evaporation temperature. Particularly, the temperature may be 10 °C higher than the evaporation temperature. The vapour flow is limited by the closed configuration of the closure device.

[54] Heating of the valve element may prevent condensation at the valve element. When stopping the material deposition process without stopping the evaporation of material, the valve element may adopt a closed position. Being in a closed position may prevent the vapour from being transferred to the shower head. The vapour may accumulate at the valve element, particularly the vapour may accumulate at the closure device. Heating of the valve element and/or the closure device may prevent condensation of the material to be deposited.

[55] FIG. 7 shows a schematic cross-sectional view of the valve element 200 with a driving mechanism 560 and an optional actuation 562 attached to the driving mechanism according to embodiments described herein. Although the driving mechanism is only exemplarily shown in connection with the Figures 7-13, it shall be understood that it can be applied in all embodiments described herein.

[56] Generally, the driving mechanism may be operated mechanically, electrically, hydraulically, pneumatically, manually or in any combination thereof. In embodiments, the driving mechanism may be connected to an actuation 562. The actuation 562 may act on the driving mechanism 560 electrically, mechanically or in any combination thereof. The driving mechanism 560 may be made of a temperature resistant material. The driving mechanism may be configured to act on the closure device with a minimum of thermal loss in the valve chamber. [57] The driving mechanism 560 may be connected to at least a part of the guidance element 232 of the closure device. The driving mechanism may be connected to the mounting part of the guidance element. The guidance element may include thermal insulation, in particular at the connection and/or mounting part of the driving mechanism 560 and the guidance element 232. The insulation prevents the driving mechanism from damage due to high temperatures.

[58] FIG. 8 shows a schematic cross-sectional view of the valve element according to embodiments described herein. The driving mechanism in this embodiment includes a spring. The spring 664 may be used to regulate the configuration of the closure device 230. The spring may be made from materials that enable the spring to include flexible characteristics, inter alia, a metallic wire. The spring may be made of high temperature resistant material. For example, the material may be from the group of Cobalt-Nickel-Chromium-Molybdenum (CoNiCrMo)-alloys. The driving mechanism may be thermally isolated from the thermally conductive closure device. The spring may be moved electrically, mechanically, pneumatically, manually or in any combination thereof. The spring may be configured to act on the closure device with a minimum of thermal loss in the valve chamber.

[59] FIG. 9 shows a schematic cross-sectional view of the valve element being oriented in an inlet direction according to embodiments described herein, with the valve element being in a closed position. The closure device 230 as illustrated in FIG. 9 adopts a closed configuration. The upper end 235 of the contact element 234 and the valve neck 214 may be contact-free but the lower end 233 of the contact element 234 may be flush with the valve neck 214. The contact element 234 may contact the contact area 219 of the inner inlet tube wall 111. The closure device and the tube wall may particularly form a metallic seal.

[60] According to embodiments, the closure device may be driven by a driving mechanism 560. The driving mechanism may be operated mechanically, electrically, hydraulically, pneumatically, manually or in any combination thereof. In some embodiments, the driving mechanism may be connected to an actuation 562. The actuation 562 may act on the driving mechanism 560 electrically, mechanically or in any combination thereof. The actuation is particularly attached to the driving mechanism when the driving mechanism works upon the presence of an actuation 562. [61] According to embodiments, the closure device may include two functions. One function may be to prevent material flow from the evaporator by adapting a closed configuration. Another function may be to seal the entry site of the driving mechanism from the valve chamber by adapting an open configuration. A beneficial effect is that the driving mechanism is exceptionally protected from material particles and high temperatures during the evaporation of material when the valve element adapts to an open configuration.

[62] FIG. 10 shows a schematic cross-sectional view of the valve element illustrating such an embodiment described herein with respect to FIG. 9, wherein the valve element is at an open position in FIG. 10. Here, the closure device 230 adopts an open configuration. The upper end 235 of the contact element 234 may contact the inner valve chamber wall 224. In particular, the lower end 233 of the contact element 234 and the valve neck 214 may be contact-free in the open position.

[63] According to embodiments, when the closure device is in an open position, the upper end 235 of the closure device may contact the inner valve chamber wall 224. The contact element may be configured so that the upper end 235 may seal the entry site of the closure device. The contact element may prevent heat and particle transfer from the valve chamber to the driving mechanism.

[64] One benefit of the embodiment is that a particle transfer of the material to be deposited from the valve chamber to the driving mechanism is prevented. Thus, less material is lost during material deposition. Another benefit of the embodiment is that heat loss from the valve chamber in the direction of the driving mechanism is prevented which helps to maintain the process temperatures. Additionally, by sealing the entry side, the driving mechanism is protected against high temperatures and/or any process related influences.

[65] According to embodiments, the closure device may be driven by a driving mechanism 560. The driving mechanism may be operated mechanically, electrically, hydraulically, pneumatically or in any combination thereof. In embodiments, the driving mechanism may be connected to an actuation 562. The actuation 562 may act on the driving mechanism 560 electrically, mechanically or in any combinations thereof.

[66] According to embodiments described herein, the arrangement of the valve element may include an inlet tube 115, a valve chamber 222 and an outlet tube 116. According to embodiments, the valve element may be oriented towards the inlet tube, in particular the closure device may be oriented towards the inlet tube. The closure device of the valve element therefore may open and/or close in the direction of the inlet tube. Thus, the valve element may be oriented in an inlet direction. When being oriented in an inlet direction the closure device may be vertically oriented. According to embodiments, the valve element may be oriented towards the outlet tube, in particular the closure device may be oriented towards the outlet tube. The closure device therefore may open and/or close in the direction of the outlet tube. Thus, the valve element may be oriented in an outlet direction. When being oriented in an outlet direction the closure device may be in a horizontally oriented.

[67] According to embodiments exemplarily shown in FIG. 2, when being oriented in an inlet direction, the closure device may be in a closed configuration by the upper end 235 of the contact element 234 being flush with the valve neck 214. According to embodiments exemplarily shown in FIG 9, when being oriented in an inlet direction, the closure device may be in a closed configuration by the lower end 233 of the contact element 234 being flush with the valve neck 214. The closure device and the tube wall may particularly form a metallic seal. [68] According to embodiments exemplarily shown in FIG. 3, when being oriented in an inlet direction, the closure device may be in an open configuration through the contact element 234 being contact-free from the valve neck 214 and within the inlet tube 115. According to embodiments exemplarily shown in FIG. 10, when being oriented in an inlet direction, the closure device may be in an open configuration through the contact element 234 being contact-free from the valve neck 214 and within the valve chamber 222.

[69] FIG. 11 shows a schematic cross-sectional view of the valve element 200 with the valve element being oriented in an outlet direction according to embodiments described herein, wherein the valve element can adopt a closed and an open position. The closure device may adopt an open and a closed configuration. The closure device 230 may be moved in the direction of the outlet tube 116. The valve neck 214 may be at the outlet tube wall 116. The contact area 219 may be part of the inner outlet tube wall 117. According to embodiments which can be combined with any other embodiments described herein, the open and closed configurations may underlie similar mechanisms with regard to the embodiments described in FIGS. 2 and 3.

[70] For adopting a closed configuration, the closure device may be moved in the direction of the valve neck. For example, the closure device may be moved in the direction of the valve chamber 222. The upper end 235 of the contact element may be flush with the valve neck 214. The closure device and the tube wall 117 may particularly form a metallic seal. For adopting the open configuration, the closure device may be moved away from the valve neck. For example, the closure device may be moved towards the outlet tube 116. A driving mechanism may be present. The driving mechanism may be driven by an optional actuation 562 according to embodiments described herein.

[71] FIG. 12 shows a schematic cross-sectional view of a valve element with the valve element being oriented in an outlet direction according to embodiments described herein, wherein the valve element can adopt a closed and an open position. The closure device may adopt an open and a closed configuration. The closure device may be moved in the direction of the outlet tube 116. The valve neck 214 may be at the outlet tube wall 116. The contact area 219 may be part of the inner outlet tube wall 117. According to embodiments which can be combined with any other embodiments described herein, the open and closed configurations may be similar to the embodiments described in terms of FIGS. 9 and 10.

[72] For adopting a closed configuration, the closure device may be moved in the direction of the valve neck. For example, the closure device may be moved in the direction of the outlet tube 116. The lower end 233 of the contact element may be flush with the valve neck 214. For adopting the open configuration, the closure device may be moved away from the valve neck. For example, the closure device may be moved in the direction of the valve chamber 222. The upper end 235 of the contact element may contact the inner valve chamber wall 224. A driving mechanism may be present. The driving mechanism may be driven by an optional actuation 562 according to embodiments described herein. [73] According to embodiments, when the closure device adopts an open configuration the upper end 235 of the closure device may contact the inner valve chamber wall 224. The contact element may be configured so that the upper end 235 may seal the entry site of the closure device. The contact element may prevent material and/or heat transfer from the valve chamber to the driving mechanism according to embodiments described herein.

[74] According to embodiments exemplarily shown in FIG. 11, when the valve element is oriented in an outlet direction, the closure device may be in a closed configuration through the upper end 235 of the contact element 234 being flush with the valve neck 214. The closure device and the tube wall may particularly form a metallic seal. According to embodiments exemplarily shown in FIG. 12, when being oriented in an outlet direction, the closure device may be in a closed configuration through the lower end 233 of the contact element 234 being flush with the valve neck 214. [75] According to embodiments exemplarily shown in FIG. 11, when the valve element is oriented in an outlet direction, the closure device may be in an open configuration through the contact element 234 being contact-free from the valve neck 214 and within the outlet tube 116. According to embodiments exemplarily shown in FIG. 12, when being oriented in an outlet direction, the closure device may be in an open configuration through the contact element 234 being contact- free from the valve neck 214 and within the valve chamber 222.

[76] FIG. 13 shows a schematic cross-sectional view of a material deposition arrangement chamber 1000 according to embodiments described herein. The chamber may include a material deposition arrangement which may be run in a high vacuum environment. The chamber may include a vacuum generation device 1060. The whole process typically takes place in a high vacuum environment of pressures in the range of 10^~6 mbar but is not limited thereto. The vacuum pressure may e.g. also include pressures in the range of 10^~4 mbar. The vacuum is not only helpful for the purity of the deposition process but also for the prevention of particle collision during the deposition process.

[77] According to embodiments, vacuum may be applied to the material deposition arrangement chamber 1000 and the material deposition arrangement 100. Material to be deposited may be evaporated in the evaporator 110, particularly with the help of the crucible 112. The material vapour may be transferred through the inlet tube 115, in particular through the lumen surrounded by the inner tube wall 111. The material vapour may also be transferred through the outlet tube 118, particularly through the space delimited by the inner outlet tube 117. [78] According to embodiments, the valve element 200 may limit or prevent the transmission of the material vapour from the inlet tube 115 to the outlet tube 116 and/or from the outlet tube 116 to the shower head 120. The closure device 230 may adopt a closed configuration according to embodiments described herein. To allow the process to be started or when the substrate change or any other process that is in need of a limited vapour flow is completed, the valve element may be changed to an open configuration. In particular, the closure device may adopt an open configuration. The valve element may be driven by the driving mechanism 560 which in turn may be optionally driven by an actuation 562.

[79] For instance, the limitation of the vapour flow-through may allow for pausing the process e.g. during the change of the substrate, without needing to stop the evaporator. Another example would be that the valve element may be in a closed configuration during the preheating of the material deposition arrangement before the deposition process is started. In this context, it should be noted that the starting and stopping of the evaporation process is time consuming and slow. It takes time for the arrangement as well as the material to be deposited to reach process temperature and for the temperature decline to be advanced to stop the evaporation process. Hence, in conventional arrangements, the evaporated material continues to flow to the substrate during the start and stop of the process. Therefore, it is beneficial to have a material deposition arrangement that allows for controlling the material flow in the evaporation process. Moreover, if the interruption of the process is only short-term, the evaporated material maintains a gaseous state since the limiting valve element can be heated to prevent condensation.

[80] According to embodiments, the valve element and in particular the closure device may be heated during the process. The closure device may in particular be heated when adopting a closed configuration. Temperature regulation may occur through the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy. Examples for heating mechanisms that may be applied can be: Heating wires, thermal elements, jacket tube heating, quartz radiators and/or graphite heating bodies. As described in embodiments herein, the whole material deposition arrangement may be heated. Additionally, there may be a positive temperature gradient from the evaporator to the substrate.

[81] According to a further aspect of the present disclosure, a method for depositing material on a substrate is provided. The method may include depositing evaporated material from an evaporator 110 to a substrate. The method may include transferring material to be deposited via an inlet tube 115, a valve element 200, an outlet tube 116 and/or a shower head 120. The method may include regulating the configuration of a closure device. The method may include adopting a closed configuration and an open configuration of the closure device 230.

[82] In particular, regulating the valve element may include adopting a closed configuration and an open configuration of the closure device. By adopting a closed configuration, the method may include stopping the evaporated material to be deposited. [83] The method may include regulating the temperature of a material deposition arrangement. In particular, regulating the temperature may include heating of the evaporator, the inlet tube, the valve element, the outlet tube and/or the shower head. Heating a valve element may include heating of the closure device to prevent condensation of evaporated material in a closed configuration of the valve element. Heating a valve element may include directly heating a valve element. "Directly heating" a valve element may be understood as operating a heating device in a valve element. In particular, directly heating may be understood as operating a heating device in a closure device, more particularly operating a heating device in a guidance element and/or contact element. [84] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

[85] In particular, this written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject-matter, including making and using any devices or systems and performing any incorporated methods. While various specific embodiments have been disclosed in the foregoing, mutually non-exclusive features of the embodiments described above may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if the claims have structural elements that do not differ from the literal language of the claims, or if the claims include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

1) A material deposition arrangement (100), comprising:

a valve element (200), wherein at least part of the valve element is heatable.

2) A material deposition arrangement (100) according to claim 1, wherein the valve element (200) includes a heating device (440).

3) A material deposition arrangement (100) according to claim 2, wherein the heating device (440) is a heating cartridge.

4) A material deposition arrangement (100) according to claim 2 or 3, wherein the valve element (200) comprises a closure device (230) that includes the heating device (440).

5) A material deposition arrangement (100) according to claim 4, wherein the closure device (230) comprises a contact element (234) and a guidance element (232) that is connected to a driving mechanism (560) for driving the guidance element, wherein the driving mechanism is preferably run with an electrical and/or mechanical actuation.

6) A material deposition arrangement (100) according to any of the preceding claims, further comprising an inlet tube (115) and an outlet tube (116) that are preferably made of carbide, more preferably of stainless steel or titanium.

7) A material deposition arrangement (100) according to claim 5, wherein the driving mechanism (560) is a spring (664).

8) A material deposition arrangement (100) according to any of the preceding claims, wherein the material deposition arrangement further comprises a temperature controller that is configured to control the temperatures of the material deposition arrangement.

9) A material deposition arrangement (100) according to any of the preceding claims, further comprising one or more of an evaporator (110) and a shower head (120).

10) A material deposition arrangement (100) according to claim 7, wherein the material deposition arrangement is configured to be operated at temperatures of at least 300 °C, particularly of at least 400 °C.

11) A material deposition arrangement (100) according to any of the preceding claims, wherein the area (236) between the contact element (234) and the inlet tube or outlet tube approximates the area (238) of the inlet tube (115) and/or the outlet tube (116).

12) A material deposition arrangement chamber (1000), comprising:

a material deposition arrangement (100) according to any of the preceding claims; and

a vacuum generation device (1060).

13) A method for depositing material on a substrate, comprising:

directly heating a valve element.

14) A method for depositing material on a substrate according to claim 13, further comprising:

depositing material; and

interrupting the deposition by closing the valve element.

15) A method for depositing material on a substrate according to claim 13 or 14, further comprising: operating the closure device (230) at a temperature which is at least 5 °C higher than the temperature of the evaporator (110), particularly operating the closure device at a temperature which is at least 10 °C higher than the temperature of the evaporator.