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WO2018192668A1 - Agencement de dépôt de matériau, procédé de dépôt de matériau et chambre de dépôt de matériau - Google Patents

Agencement de dépôt de matériau, procédé de dépôt de matériau et chambre de dépôt de matériau Download PDF

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Publication number
WO2018192668A1
WO2018192668A1 PCT/EP2017/059505 EP2017059505W WO2018192668A1 WO 2018192668 A1 WO2018192668 A1 WO 2018192668A1 EP 2017059505 W EP2017059505 W EP 2017059505W WO 2018192668 A1 WO2018192668 A1 WO 2018192668A1
Authority
WO
WIPO (PCT)
Prior art keywords
valve element
closure device
material deposition
deposition arrangement
valve
Prior art date
Application number
PCT/EP2017/059505
Other languages
English (en)
Inventor
Frank Schnappenberger
Thomas Deppisch
Stefan Hein
Annabelle HOFMANN
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to PCT/EP2017/059505 priority Critical patent/WO2018192668A1/fr
Priority to CN201780088859.4A priority patent/CN110462096A/zh
Priority to TW107113315A priority patent/TWI677586B/zh
Publication of WO2018192668A1 publication Critical patent/WO2018192668A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561—Gas plumbing upstream of the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K49/00—Means in or on valves for heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K49/00—Means in or on valves for heating or cooling
    • F16K49/002—Electric heating means

Definitions

  • Embodiments of the present disclosure relate to a material deposition arrangement including a valve element. Additionally, embodiments relate to a material deposition chamber. Furthermore, embodiments also relate to a process for the deposition of material. In particular, embodiments of the present disclosure relate to the vacuum coating of substrates as used in several technological areas with the need for evaporating different materials to form layers on substrates.
  • An evaporation process for the deposition of material normally involves two basic processes; a hot source material evaporates and then condenses on a substrate.
  • One way to carry out evaporation is, inter alia, the thermal method wherein e.g. metal material is either fed onto a heated semi-metal like ceramics or placed into a crucible that is e.g. electrically heated. The melted metal material evaporates into a cloud above the source and is then guided to the substrate for the formation of one or more deposition layers.
  • Evaporation technics are, however, not limited to the evaporation of metals but can also be carried out in combination with organic materials.
  • Organic evaporators for example, are suitable for the production of organic light-emitting diodes (OLEDs).
  • OLEDs organic light-emitting diodes
  • an emissive layer of certain organic compounds is deposited on a suitable substrate. The layer then comprises a thin-film of the deposition material.
  • OLEDs can be used in conjunction with several applications, e.g. in the manufacture of television screens, monitors, tablet, smartphone and other hand-held devices etc. Additionally, a lot of other applications are conceivable in the field of OLED technology.
  • One parameter when evaporating material is the temperature that is used to evaporate the deposition material.
  • the temperature is not only relevant for ensuring a time efficient, undisturbed and proper change of the physical state of the material but also includes high demands on the materials and the construction design. Since the materials involved in the process are very expensive, any dissipation of material is to be avoided.
  • a material deposition arrangement includes a valve element wherein at least part of the valve element is heatable.
  • a material deposition arrangement chamber includes a material deposition arrangement according to embodiments described herein and a vacuum generation device.
  • a method for depositing material on a substrate includes directly heating a valve element.
  • FIG. 1 shows a schematic cross-sectional view of a material deposition arrangement according to some of the embodiments described herein;
  • FIG. 2 shows a schematic cross-sectional view of a valve element according to embodiments described herein, with the valve element being in a first position;
  • FIG. 3 shows a schematic cross-sectional view of the valve element according to the embodiments described with respect to FIG. 2, wherein the valve element is at a second position;
  • FIG. 4 shows a schematic cross-sectional view of the valve element according to embodiments described herein;
  • FIG. 5 shows a schematic cross-sectional view of a closure device according to embodiments described herein;
  • FIG. 6 shows a schematic cross-sectional view of the closure device according to embodiments described herein;
  • FIG. 7 shows a schematic cross-sectional view of the valve element with a driving mechanism and an actuation attached thereto according to embodiments described herein;
  • FIG. 8 shows a schematic cross-sectional view of the valve element with a driving mechanism according to embodiments described herein;
  • FIG. 9 shows a schematic cross-sectional view of the valve element according to embodiments described herein, with the valve element being in a first position
  • FIG. 10 shows a schematic cross-sectional view of the valve element according to embodiments described herein with respect to FIG. 9, wherein the valve element is at a second position
  • FIG. 11 shows a schematic cross-sectional view of the valve element according to embodiments described herein;
  • FIG. 12 shows a schematic cross-sectional view of a valve element according to embodiments described herein; shows a schematic cross-sectional view of a material deposition chamber according to embodiments described herein.
  • a “material deposition arrangement” is understood as an arrangement configured for material deposition.
  • a “material deposition arrangement” can be understood as an arrangement configured for the deposition of materials that have been transferred into a gaseous state before they are directed to the substrate.
  • a “material deposition arrangement” for example includes a crucible that allows for evaporation of a material which is then transferred via inlet and/or outlet tubes to a substrate and deposited thereon.
  • a "crucible” is understood as a structure that allows for the use of high temperatures inter alia of the handling of material at high temperatures.
  • the "crucible” can be connected to a shower head, for example via an enclosure, hollow space, pipe and/or valve.
  • a “crucible” can also be part of an evaporator where the evaporation of a material may take place.
  • a “shower head” is understood as a spray-like device that allows for the distribution of deposition material on a substrate.
  • the "shower head” can include several openings that are connected to an enclosure, hollow space, pipe and/or valve, in which the evaporated material can be provided or guided, for example from the evaporation crucible to the substrate.
  • the shower head may be directed in a horizontal or vertical direction or elsewhere in between a horizontal or vertical orientation.
  • a "valve element” is understood as a valve that any material that is in a liquid or gaseous phase can flow through.
  • the "valve element” typically connects a material origin to a material destination and allows for the control of this connection.
  • a “valve element” as used herein may influence one or more of the following factors: The flow rate, the flow velocity and the back pressure can be regulated by regulating the "valve element”.
  • the “valve element” may be used to regulate the flow-through of evaporated material that is transferred from the crucible to the shower head.
  • the "valve element” can be a single component that can be combined with or arranged between an inlet and/or an outlet tube.
  • the “valve element” can act as a shutter.
  • valve element allows for controlling the flow through the material deposition arrangement.
  • the “valve element” may be exchangeable.
  • the “valve element” may be suitable for single-use applications.
  • the "flow” or “flow through” is understood as a flow of particles that can occur bi-directional. For example, evaporated material can flow from the evaporator through the valve element in the direction of the shower head. Additionally, particles can flow from the material deposition arrangement chamber in the direction of the evaporator.
  • the valve element may control, limit and/or prevent the "flow”.
  • a "contact area” is understood as a part of a tube wall that can be in contact with another element, for example a part of an inner tube wall that is occupied by a contact element upon closing the valve element.
  • the "contact area” may be positioned adjacent to or be a part of a valve neck.
  • a "valve neck” is understood as a constriction of the inlet tube wall or the outlet tube wall.
  • the “valve neck” may act as a boundary for the closure device.
  • an "inlet tube” is understood as a tube that can act as a connection between the evaporator and the shower head.
  • the “inlet tube” is connected to a valve element and/or an outlet tube on one side and to an evaporator on another side.
  • the “inlet tube” can also include a valve neck.
  • the diameter can vary in different sections of the tube.
  • the “inlet tube” typically includes two walls, an inner and an outer tube wall.
  • an "outlet tube” is understood as a tube that can act as a connection between the evaporator and the shower head.
  • the "outlet tube” is connected to a valve element and/or an inlet tube on one side and to a shower head on another side.
  • the “outlet tube” can also include a valve neck.
  • the diameter can vary in different sections of the tube.
  • the “outlet tube” typically includes two walls, an inner and an outer tube wall.
  • “being oriented in an inlet direction” is understood as a position of the closure device.
  • the closure device can adopt an "inlet position” when the closure device may be oriented towards an inlet tube. When being in an “inlet position” the closure device may be in a vertical position.
  • “being oriented in an outlet direction” is understood as a position of the closure device.
  • the closure device can adopt an "outlet position” when the closure device may be oriented towards an outlet tube. When being in an “outlet position” the closure device may be in a horizontal position.
  • “approximate” is understood as e.g. including a ⁇ 20 % deviation, particularly a ⁇ 15 % deviation, and more particularly ⁇ 10 % deviation.
  • FIG. 1 shows a schematic cross-sectional view of a material deposition arrangement 100 according to some of the embodiments described herein.
  • the material deposition arrangement 100 may be used, inter alia, for the coating of a substrate.
  • the substrate may be of every group of materials that is suitable for thermal deposition coating e.g. films or foils.
  • the material deposition arrangement 100 may include an evaporator 110 and a shower head 120 but is not limited to these features.
  • the evaporator 110 may include a crucible 112.
  • the evaporator may be connected to an inlet tube 115.
  • a valve element 200 may control the connection between the evaporator and/or the crucible and the shower head 120.
  • the valve element 200 may be arranged between an inlet tube 115 and an outlet tube 116.
  • the valve element may provide an atmospheric isolation of the evaporator and the shower head.
  • the outlet tube 116 may be connected to the shower head 120.
  • the crucible may be used to heat material to be deposited.
  • the crucible may e.g. be a tub.
  • Typical materials used for deposition processes that can be used with embodiments described herein, may be metals, organic semiconductors or materials like silicon dioxide.
  • the materials to be deposited influence the shape of the process therein, in that the parameters for treating the material to be deposited may differ depending on the physical and chemical characteristics of the materials.
  • the temperature of the crucible may be regulated. Temperature regulation may occur through the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy. Examples for heating mechanisms that may be applied can be: Heating wires, thermal elements, jacket tube heating, quartz radiators and/or graphite heating bodies.
  • the operating temperature of the material deposition arrangement may be in the range of 300 °C to 800 °C.
  • the evaporator and/or the crucible may be made of thermally stable, resistant and/or inert material, inter alia, of metal, particularly of carbide, more particularly of stainless steel or titanium.
  • the inlet tube 115 may allow for the transmission of the deposition material.
  • the inlet tube 115 and the outlet tube 116 may allow for the deposition material transmission.
  • the inner tube may include an inner wall 111 and an outer wall 113.
  • the outlet tube may also include an inner wall 117 and an outer wall 118.
  • the inner walls 111, 117 may be thermal conductors whereas the outer walls 113, 118 may be thermal isolators.
  • the gap between the inner wall and the outer wall of the inlet tube and/or the outlet tube may be used in terms of heating at least parts of the material deposition arrangement 100.
  • all parts of the material deposition arrangement may be heated. It is also possible that one part is heated and another part is not.
  • the evaporator, the inlet tube, the outlet tube, the shower head and/or the valve element may include double walls wherein the inner walls may be thermal conductors whereas the outer walls may be thermal isolators.
  • a controller may be configured for setting the temperatures of the heatable parts.
  • the crucible may be heated to the best suitable material deposition temperature of the material to be deposited.
  • the temperature of the valve element 200 may be set higher than the temperature of the crucible 112. For example, the temperature may be set between 5 °C and 20 °C higher, in particular approximately 10 °C higher.
  • the shower head 120 may be heated to a temperature that is higher than the temperature of the valve element 200.
  • the temperature may be set at least between 5 °C and 20 °C higher than the temperature of the valve element 200, in particular approximately 10 °C higher.
  • the material to be deposited is heated to 450 °C.
  • the valve element may be heated to 460 °C.
  • the shower head could have a temperature of 470 °C.
  • FIG. 2 shows a schematic cross-sectional view of a valve element 200 according to embodiments described herein, with the valve element being in a closed position.
  • the valve element is designed to allow e.g. separation of an evaporator and a shower head that may be adjacent to a substrate.
  • an inlet tube 115 may link the valve element 200 and the evaporator.
  • An outlet tube 116 typically links the valve element 200 and a shower head.
  • the valve element 200 may be arranged between the inlet tube 115 and the outlet tube 116.
  • the valve element may include a valve chamber 222.
  • Both, the inlet and the outlet tube may include inner tube walls 111, 117 and outer tube walls 113, 118.
  • the inner walls 111, 117 may be thermal conductors whereas the outer walls 113, 118 may be thermal isolators.
  • the inlet tube and/or the outlet tube may include a valve neck 214 and/or a contact area 219.
  • the gap between the inner walls 111, 117 and the outer walls 113, 118 may be used in terms of temperature regulation of the inlet tube 115 and outlet tube 116 of the valve element 200. Temperature regulation may occur through the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy. Examples for heating mechanisms that may be applied are: Heating wires, thermal elements, jacket tube heating, quartz radiators and/or graphite heating bodies. The outer walls of the inlet tube and the outer walls of the outlet tube may be seamlessly merged.
  • the valve element may include a closure device 230.
  • the valve element may be constructed so that the closure device 230 may adopt several configurations. One configuration is the closed configuration.
  • the closure device may include a contact element 234.
  • the contact element 234 of the closure device may be flush with the contact area 219 of the inner inlet tube wall 111 in the closed configuration. In another embodiment, the contact element may be flush with the contact area of the inner outlet tube wall 117 in the closed configuration.
  • the closure device and the tube wall may particularly form a metallic seal.
  • the contact element 234 may include an outer ring.
  • the outer ring may be made of a metal, particularly of a soft metal, more particularly of copper, stainless steel and/or gold.
  • the outer ring may have a tapered rim.
  • the contact area may include a layer of material.
  • the material may be metal, particularly a soft metal, more particularly copper, stainless steel and/or gold.
  • the material may deform to form a seal.
  • the seal may be exchangeable.
  • metal seal is understood as that a sealing is generated by the connection of two metallic elements e.g. of the contact area and the contact element.
  • Beneficial materials may, be for example, titanium and/or stainless steel.
  • the "metallic seal” may include an additional sealing material element, e.g. made of metals such as copper, between the contact element and the contact area.
  • the upper end 235 of the contact element may be flush with the valve neck 214.
  • the closed configuration does not allow for material transfer from the evaporator to the shower head or vice versa.
  • One positive effect of the closed configuration may be, that flow-through of inter alia evaporated material through the valve element may be limited or even prevented.
  • the degree of sealing may lie in the area of about 0.1 mbar and 10 mbar.
  • another benefit may be that by bringing the closure device in a closed configuration, the material deposition process may be interrupted without interrupting the transition of material into another physical state. For example, it is possible to let material evaporate in the evaporator but simultaneously prevent the transmission of evaporated material to the substrate by having the closure device in a closed configuration.
  • FIG. 3 shows a schematic cross-sectional view of the valve element according to the embodiments described with respect to FIG. 2, wherein the valve element 200 is at an open position.
  • FIG. 3 shows the closure device 230 in an open configuration.
  • the contact element 230 and the inner tube walls 111, 117 at the contact area 219 may be contact- free.
  • the upper end 235 of the contact element and the valve neck 214 may be contact- free as well.
  • the closure device may be repositioned in the direction of the evaporator.
  • Embodiments displayed in FIG. 4 include the side area 236 where the material deposition flow-through may pass the closure device.
  • the side area 236 may be the cross-sectional area between an inlet tube and/or an outlet tube and the contact element.
  • the side area may emerge when the closure device adopts an open configuration.
  • the side area may emerge when the valve element is oriented in an inlet and/or outlet direction and the closure device may adopt an open configuration.
  • the side area 236 may approximate the valve chamber area 238.
  • the valve chamber area 238 may be the cross-sectional area between the guidance element 234 and the inner valve chamber wall 224. This configuration protects the system from a loss of pressure.
  • All parts or at least the closure device, the valve element, the inlet tube, the outlet tube, the evaporator and the shower head of the material deposition arrangement may include or even consist of materials such as carbides, stainless steel or titanium.
  • the material may be capable of withstanding high temperatures.
  • the material may be chemically inert. The material may allow thermal transmission if not stated otherwise.
  • the valve element may include or even consist of inert materials such as carbides, stainless steel or titanium.
  • the closure device may be made from the same material than the valve element but is not limited thereto.
  • the closure device may include or even consist of a material that allows for thermal transmission.
  • the closure device may also include or even consist of a material that is thermally stable.
  • the closure device may be made of an inert material.
  • the closure device 230 may include a contact element 234 and a guidance element 232.
  • the guidance element 232 may be made of a material that allows for thermal transmission.
  • the guidance element 232 is connected to the contact element 234 e.g. the guidance element may be formed integrally with the contact element.
  • the guidance element 232 may be used to change the configuration of the closure device 230. By acting on the guidance element 232 the contact element 234 may be repositioned.
  • the guidance element may include a mounting part.
  • the guidance element may include thermal insulation, in particular at the mounting part.
  • the closure device may include a heating device 440.
  • the heating device 440 may include a connection element 442.
  • the heating device 440 may include a heatable cartridge.
  • the heating device may be embedded in the valve element, in particular in the closure device, more particular in the guidance element and/or the contact element.
  • the connection element 442 may connect the heating device for temperature regulation.
  • the heating device may include several heating mechanisms.
  • the heating device 440 may be heated electrically.
  • the temperature of the heating device 440 may generally be regulated by the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy into heat. Examples for heating mechanisms that may be applied are: Heating wires, thermal elements, quartz radiators and/or graphite heating bodies.
  • the heating device may extend from the guidance element into the contact element. According to embodiments displayed in FIG. 6, the heating device may be included by the guidance element only. Thermal energy may be provided through the guidance element and may be transferred to the closure element via heat transfer. In another embodiment, the heating device may be included by the contact element only.
  • the heating device may come close to the lower end 233 of the contact element so as to most effectively transfer heat energy to the lower end 233 of the contact element 234.
  • the distance between the lower end of the heating device 440 and the lower end 233 of the contact element 234 may be less than 5 mm, in particular even equal to or less than 2 mm.
  • Heating of the closure device provides several benefits. Normally, there is a negative temperature gradient between the evaporator and the valve element. Since the closure device may be used to limit or prevent the transmission of deposition material that may exist in a gaseous state, the negative temperature gradient promotes condensation of the vapour at the valve element. By heating the closure device of the valve element the negative temperature gradient is removed and condensation at the closure device is prevented. The negative temperature gradient may also be reversed to a positive temperature gradient. For instance, a higher temperature may be applied to the closure device in comparison to the evaporator.
  • a controller may be used to regulate the temperature.
  • the temperature of the closing device and/or the valve element may be set 5 °C -20 °C higher, in particular 10 °C higher than the temperature of the evaporator.
  • the shower head 120 may be heated to a temperature that is higher than the temperature of the valve element 200.
  • the temperature may be set at least between 5 °C and 20 °C higher than the temperature of the valve element 200, in particular approximately 10 °C higher.
  • material is heated in the crucible 112 and evaporated.
  • the vapour flows through the inlet tube in the direction of the outlet tube of the valve element.
  • the closure device may be in a closed configuration as shown in FIG. 2 and the closure device may be heated to a temperature that may be at least 5 °C higher than the evaporation temperature. Particularly, the temperature may be 10 °C higher than the evaporation temperature.
  • the vapour flow is limited by the closed configuration of the closure device.
  • Heating of the valve element may prevent condensation at the valve element.
  • the valve element When stopping the material deposition process without stopping the evaporation of material, the valve element may adopt a closed position. Being in a closed position may prevent the vapour from being transferred to the shower head. The vapour may accumulate at the valve element, particularly the vapour may accumulate at the closure device. Heating of the valve element and/or the closure device may prevent condensation of the material to be deposited.
  • FIG. 7 shows a schematic cross-sectional view of the valve element 200 with a driving mechanism 560 and an optional actuation 562 attached to the driving mechanism according to embodiments described herein.
  • the driving mechanism is only exemplarily shown in connection with the Figures 7-13, it shall be understood that it can be applied in all embodiments described herein.
  • the driving mechanism may be operated mechanically, electrically, hydraulically, pneumatically, manually or in any combination thereof.
  • the driving mechanism may be connected to an actuation 562.
  • the actuation 562 may act on the driving mechanism 560 electrically, mechanically or in any combination thereof.
  • the driving mechanism 560 may be made of a temperature resistant material.
  • the driving mechanism may be configured to act on the closure device with a minimum of thermal loss in the valve chamber.
  • the driving mechanism 560 may be connected to at least a part of the guidance element 232 of the closure device.
  • the driving mechanism may be connected to the mounting part of the guidance element.
  • the guidance element may include thermal insulation, in particular at the connection and/or mounting part of the driving mechanism 560 and the guidance element 232. The insulation prevents the driving mechanism from damage due to high temperatures.
  • FIG. 8 shows a schematic cross-sectional view of the valve element according to embodiments described herein.
  • the driving mechanism in this embodiment includes a spring.
  • the spring 664 may be used to regulate the configuration of the closure device 230.
  • the spring may be made from materials that enable the spring to include flexible characteristics, inter alia, a metallic wire.
  • the spring may be made of high temperature resistant material.
  • the material may be from the group of Cobalt-Nickel-Chromium-Molybdenum (CoNiCrMo)-alloys.
  • the driving mechanism may be thermally isolated from the thermally conductive closure device.
  • the spring may be moved electrically, mechanically, pneumatically, manually or in any combination thereof.
  • the spring may be configured to act on the closure device with a minimum of thermal loss in the valve chamber.
  • FIG. 9 shows a schematic cross-sectional view of the valve element being oriented in an inlet direction according to embodiments described herein, with the valve element being in a closed position.
  • the closure device 230 as illustrated in FIG. 9 adopts a closed configuration.
  • the upper end 235 of the contact element 234 and the valve neck 214 may be contact-free but the lower end 233 of the contact element 234 may be flush with the valve neck 214.
  • the contact element 234 may contact the contact area 219 of the inner inlet tube wall 111.
  • the closure device and the tube wall may particularly form a metallic seal.
  • the closure device may be driven by a driving mechanism 560.
  • the driving mechanism may be operated mechanically, electrically, hydraulically, pneumatically, manually or in any combination thereof.
  • the driving mechanism may be connected to an actuation 562.
  • the actuation 562 may act on the driving mechanism 560 electrically, mechanically or in any combination thereof.
  • the actuation is particularly attached to the driving mechanism when the driving mechanism works upon the presence of an actuation 562.
  • the closure device may include two functions. One function may be to prevent material flow from the evaporator by adapting a closed configuration. Another function may be to seal the entry site of the driving mechanism from the valve chamber by adapting an open configuration. A beneficial effect is that the driving mechanism is exceptionally protected from material particles and high temperatures during the evaporation of material when the valve element adapts to an open configuration.
  • FIG. 10 shows a schematic cross-sectional view of the valve element illustrating such an embodiment described herein with respect to FIG. 9, wherein the valve element is at an open position in FIG. 10.
  • the closure device 230 adopts an open configuration.
  • the upper end 235 of the contact element 234 may contact the inner valve chamber wall 224.
  • the lower end 233 of the contact element 234 and the valve neck 214 may be contact-free in the open position.
  • the upper end 235 of the closure device may contact the inner valve chamber wall 224.
  • the contact element may be configured so that the upper end 235 may seal the entry site of the closure device.
  • the contact element may prevent heat and particle transfer from the valve chamber to the driving mechanism.
  • One benefit of the embodiment is that a particle transfer of the material to be deposited from the valve chamber to the driving mechanism is prevented. Thus, less material is lost during material deposition. Another benefit of the embodiment is that heat loss from the valve chamber in the direction of the driving mechanism is prevented which helps to maintain the process temperatures. Additionally, by sealing the entry side, the driving mechanism is protected against high temperatures and/or any process related influences.
  • the closure device may be driven by a driving mechanism 560.
  • the driving mechanism may be operated mechanically, electrically, hydraulically, pneumatically or in any combination thereof.
  • the driving mechanism may be connected to an actuation 562.
  • the actuation 562 may act on the driving mechanism 560 electrically, mechanically or in any combinations thereof.
  • the arrangement of the valve element may include an inlet tube 115, a valve chamber 222 and an outlet tube 116.
  • the valve element may be oriented towards the inlet tube, in particular the closure device may be oriented towards the inlet tube.
  • the closure device of the valve element therefore may open and/or close in the direction of the inlet tube.
  • the valve element may be oriented in an inlet direction.
  • the closure device may be vertically oriented.
  • the valve element may be oriented towards the outlet tube, in particular the closure device may be oriented towards the outlet tube.
  • the closure device therefore may open and/or close in the direction of the outlet tube.
  • the valve element may be oriented in an outlet direction.
  • the closure device When being oriented in an outlet direction the closure device may be in a horizontally oriented.
  • the closure device when being oriented in an inlet direction, may be in a closed configuration by the upper end 235 of the contact element 234 being flush with the valve neck 214.
  • the closure device when being oriented in an inlet direction, may be in a closed configuration by the lower end 233 of the contact element 234 being flush with the valve neck 214.
  • the closure device and the tube wall may particularly form a metallic seal.
  • the closure device when being oriented in an inlet direction, the closure device may be in an open configuration through the contact element 234 being contact-free from the valve neck 214 and within the inlet tube 115.
  • the closure device when being oriented in an inlet direction, may be in an open configuration through the contact element 234 being contact-free from the valve neck 214 and within the valve chamber 222.
  • FIG. 11 shows a schematic cross-sectional view of the valve element 200 with the valve element being oriented in an outlet direction according to embodiments described herein, wherein the valve element can adopt a closed and an open position.
  • the closure device may adopt an open and a closed configuration.
  • the closure device 230 may be moved in the direction of the outlet tube 116.
  • the valve neck 214 may be at the outlet tube wall 116.
  • the contact area 219 may be part of the inner outlet tube wall 117.
  • the open and closed configurations may underlie similar mechanisms with regard to the embodiments described in FIGS. 2 and 3.
  • the closure device may be moved in the direction of the valve neck.
  • the closure device may be moved in the direction of the valve chamber 222.
  • the upper end 235 of the contact element may be flush with the valve neck 214.
  • the closure device and the tube wall 117 may particularly form a metallic seal.
  • the closure device may be moved away from the valve neck.
  • the closure device may be moved towards the outlet tube 116.
  • a driving mechanism may be present. The driving mechanism may be driven by an optional actuation 562 according to embodiments described herein.
  • FIG. 12 shows a schematic cross-sectional view of a valve element with the valve element being oriented in an outlet direction according to embodiments described herein, wherein the valve element can adopt a closed and an open position.
  • the closure device may adopt an open and a closed configuration.
  • the closure device may be moved in the direction of the outlet tube 116.
  • the valve neck 214 may be at the outlet tube wall 116.
  • the contact area 219 may be part of the inner outlet tube wall 117.
  • the open and closed configurations may be similar to the embodiments described in terms of FIGS. 9 and 10.
  • the closure device may be moved in the direction of the valve neck.
  • the closure device may be moved in the direction of the outlet tube 116.
  • the lower end 233 of the contact element may be flush with the valve neck 214.
  • the closure device may be moved away from the valve neck.
  • the closure device may be moved in the direction of the valve chamber 222.
  • the upper end 235 of the contact element may contact the inner valve chamber wall 224.
  • a driving mechanism may be present.
  • the driving mechanism may be driven by an optional actuation 562 according to embodiments described herein.
  • the closure device adopts an open configuration
  • the upper end 235 of the closure device may contact the inner valve chamber wall 224.
  • the contact element may be configured so that the upper end 235 may seal the entry site of the closure device.
  • the contact element may prevent material and/or heat transfer from the valve chamber to the driving mechanism according to embodiments described herein.
  • the closure device when the valve element is oriented in an outlet direction, the closure device may be in a closed configuration through the upper end 235 of the contact element 234 being flush with the valve neck 214.
  • the closure device and the tube wall may particularly form a metallic seal.
  • the closure device when being oriented in an outlet direction, the closure device may be in a closed configuration through the lower end 233 of the contact element 234 being flush with the valve neck 214.
  • the closure device when the valve element is oriented in an outlet direction, the closure device may be in an open configuration through the contact element 234 being contact-free from the valve neck 214 and within the outlet tube 116.
  • the closure device when being oriented in an outlet direction, the closure device may be in an open configuration through the contact element 234 being contact- free from the valve neck 214 and within the valve chamber 222.
  • FIG. 13 shows a schematic cross-sectional view of a material deposition arrangement chamber 1000 according to embodiments described herein.
  • the chamber may include a material deposition arrangement which may be run in a high vacuum environment.
  • the chamber may include a vacuum generation device 1060.
  • the whole process typically takes place in a high vacuum environment of pressures in the range of 10 ⁇ 6 mbar but is not limited thereto.
  • the vacuum pressure may e.g. also include pressures in the range of 10 ⁇ 4 mbar.
  • the vacuum is not only helpful for the purity of the deposition process but also for the prevention of particle collision during the deposition process.
  • vacuum may be applied to the material deposition arrangement chamber 1000 and the material deposition arrangement 100.
  • Material to be deposited may be evaporated in the evaporator 110, particularly with the help of the crucible 112.
  • the material vapour may be transferred through the inlet tube 115, in particular through the lumen surrounded by the inner tube wall 111.
  • the material vapour may also be transferred through the outlet tube 118, particularly through the space delimited by the inner outlet tube 117.
  • the valve element 200 may limit or prevent the transmission of the material vapour from the inlet tube 115 to the outlet tube 116 and/or from the outlet tube 116 to the shower head 120.
  • the closure device 230 may adopt a closed configuration according to embodiments described herein.
  • the valve element may be changed to an open configuration.
  • the closure device may adopt an open configuration.
  • the valve element may be driven by the driving mechanism 560 which in turn may be optionally driven by an actuation 562.
  • the limitation of the vapour flow-through may allow for pausing the process e.g. during the change of the substrate, without needing to stop the evaporator.
  • the valve element may be in a closed configuration during the preheating of the material deposition arrangement before the deposition process is started.
  • the starting and stopping of the evaporation process is time consuming and slow. It takes time for the arrangement as well as the material to be deposited to reach process temperature and for the temperature decline to be advanced to stop the evaporation process.
  • the evaporated material continues to flow to the substrate during the start and stop of the process.
  • the evaporated material maintains a gaseous state since the limiting valve element can be heated to prevent condensation.
  • the valve element and in particular the closure device may be heated during the process.
  • the closure device may in particular be heated when adopting a closed configuration. Temperature regulation may occur through the delivery and/or generation of thermal energy, inter alia, by transformation of chemical or electrical energy. Examples for heating mechanisms that may be applied can be: Heating wires, thermal elements, jacket tube heating, quartz radiators and/or graphite heating bodies. As described in embodiments herein, the whole material deposition arrangement may be heated. Additionally, there may be a positive temperature gradient from the evaporator to the substrate.
  • a method for depositing material on a substrate may include depositing evaporated material from an evaporator 110 to a substrate.
  • the method may include transferring material to be deposited via an inlet tube 115, a valve element 200, an outlet tube 116 and/or a shower head 120.
  • the method may include regulating the configuration of a closure device.
  • the method may include adopting a closed configuration and an open configuration of the closure device 230.
  • regulating the valve element may include adopting a closed configuration and an open configuration of the closure device. By adopting a closed configuration, the method may include stopping the evaporated material to be deposited.
  • the method may include regulating the temperature of a material deposition arrangement. In particular, regulating the temperature may include heating of the evaporator, the inlet tube, the valve element, the outlet tube and/or the shower head. Heating a valve element may include heating of the closure device to prevent condensation of evaporated material in a closed configuration of the valve element. Heating a valve element may include directly heating a valve element. "Directly heating" a valve element may be understood as operating a heating device in a valve element.
  • directly heating may be understood as operating a heating device in a closure device, more particularly operating a heating device in a guidance element and/or contact element.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne une chambre d'agencement de dépôt de matériau (1000) pour le dépôt d'un matériau sur un substrat. La chambre d'agencement de dépôt de matériau comprend un dispositif de génération de vide (1060) et un agencement de dépôt de matériau (100) ayant un élément de vanne (200), conçu pour réguler le flux de matériau du matériau à déposer.
PCT/EP2017/059505 2017-04-21 2017-04-21 Agencement de dépôt de matériau, procédé de dépôt de matériau et chambre de dépôt de matériau WO2018192668A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/EP2017/059505 WO2018192668A1 (fr) 2017-04-21 2017-04-21 Agencement de dépôt de matériau, procédé de dépôt de matériau et chambre de dépôt de matériau
CN201780088859.4A CN110462096A (zh) 2017-04-21 2017-04-21 材料沉积布置、用于沉积材料的方法和材料沉积腔室
TW107113315A TWI677586B (zh) 2017-04-21 2018-04-19 材料沈積配置、用以沈積材料於基板之一方法及一材料沈積配置腔室

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/059505 WO2018192668A1 (fr) 2017-04-21 2017-04-21 Agencement de dépôt de matériau, procédé de dépôt de matériau et chambre de dépôt de matériau

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WO2018192668A1 true WO2018192668A1 (fr) 2018-10-25

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US20060013964A1 (en) * 2004-07-14 2006-01-19 City University Of Hong Kong Apparatus and method for focused electric field enhanced plasma-based ion implantation
US20080107811A1 (en) * 2004-12-07 2008-05-08 Addon Apparatus For Vacuum Deposition With A Recharging Reservoir And Corresponding Process For Vacuum Deposition
US20100012026A1 (en) * 2006-06-27 2010-01-21 Fujikin Incorporated Evaporation supply apparatus for raw material and automatic pressure regulating device used therewith
US20140370623A1 (en) * 2013-06-13 2014-12-18 Tsmc Solar Ltd. Evaporation apparatus and method
KR20150129441A (ko) * 2014-05-12 2015-11-20 엘지전자 주식회사 증착 장치
JP2016108579A (ja) * 2014-12-02 2016-06-20 パナソニックＩｐマネジメント株式会社 蒸着装置及び蒸着方法

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JP4943047B2 (ja) * 2006-04-07 2012-05-30 東京エレクトロン株式会社 処理装置及び処理方法
CN102234762B (zh) * 2010-04-23 2014-10-15 鸿富锦精密工业（深圳）有限公司 镀膜系统
CN103688339B (zh) * 2011-07-22 2016-09-28 应用材料公司 用于ald/cvd工艺的反应物输送系统
JP6584067B2 (ja) * 2014-05-30 2019-10-02 日立造船株式会社 真空蒸着装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5865421A (en) * 1995-12-13 1999-02-02 Lintec Co., Ltd. Valve structure for use in a vaporizer
US20060013964A1 (en) * 2004-07-14 2006-01-19 City University Of Hong Kong Apparatus and method for focused electric field enhanced plasma-based ion implantation
US20080107811A1 (en) * 2004-12-07 2008-05-08 Addon Apparatus For Vacuum Deposition With A Recharging Reservoir And Corresponding Process For Vacuum Deposition
US20100012026A1 (en) * 2006-06-27 2010-01-21 Fujikin Incorporated Evaporation supply apparatus for raw material and automatic pressure regulating device used therewith
US20140370623A1 (en) * 2013-06-13 2014-12-18 Tsmc Solar Ltd. Evaporation apparatus and method
KR20150129441A (ko) * 2014-05-12 2015-11-20 엘지전자 주식회사 증착 장치
JP2016108579A (ja) * 2014-12-02 2016-06-20 パナソニックＩｐマネジメント株式会社 蒸着装置及び蒸着方法

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CN110462096A (zh) 2019-11-15
TWI677586B (zh) 2019-11-21

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