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WO2018196339A1 - Armoire et micro-centre de traitement de données - Google Patents

Armoire et micro-centre de traitement de données Download PDF

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Publication number
WO2018196339A1
WO2018196339A1 PCT/CN2017/110957 CN2017110957W WO2018196339A1 WO 2018196339 A1 WO2018196339 A1 WO 2018196339A1 CN 2017110957 W CN2017110957 W CN 2017110957W WO 2018196339 A1 WO2018196339 A1 WO 2018196339A1
Authority
WO
WIPO (PCT)
Prior art keywords
wall
cooling
cabinet
data center
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/110957
Other languages
English (en)
Chinese (zh)
Inventor
李棒
林�智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eco Atlas (shenzhen) Co Ltd
Original Assignee
Eco Atlas (shenzhen) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eco Atlas (shenzhen) Co Ltd filed Critical Eco Atlas (shenzhen) Co Ltd
Publication of WO2018196339A1 publication Critical patent/WO2018196339A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades

Definitions

  • the present invention relates to the field of computer technologies, and in particular, to a cabinet and a micro data center.
  • IT equipment emits a lot of heat when it is running, and traditional data centers use air-cooled methods to cool IT equipment. Since the air heat conduction efficiency is low and the specific volume heat capacity is small, this requires a relatively large air volume for cooling the IT equipment, but the high speed operation of the fan not only consumes a large amount of energy but also generates a large noise. In addition, air-cooled cooling also has certain requirements on air quality. The moisture, dust, nitrogen oxides, sulfur oxides, etc. contained in the air will increase the failure rate of IT equipment and shorten the service life.
  • a cabinet for a micro data center comprising an IT device and a heat sink
  • the cabinet comprising: an outer wall, the outer wall being located outside the heat sink, the outer wall comprising a body, the body having a top open receiving cavity; an inner wall, the inner wall being mounted in the receiving cavity, the inner wall having a top open mounting cavity, the mounting cavity for mounting the IT device, the mounting cavity also being used for housing
  • the IT device is immersed in a cooling liquid for dissipating heat; a cooling assembly is mounted to the inner wall and connected to the heat dissipating device to dissipate heat from the cooling liquid.
  • the cooling assembly includes a cooling coil between the inner wall and the outer wall, the cooling coil abutting the inner wall, and the cooling tube is for connecting to the heat sink The coolant is dissipated.
  • the cooling coil has a plurality of groups, and the plurality of sets of the cooling coils uniformly surround the inner wall.
  • the cooling assembly further includes a plurality of first circulation pumps installed in the installation cavity, and the first circulation pump is configured to drive the coolant.
  • the plurality of sets of cooling coils included in the cooling assembly may be replaced by a cooling coil module installed in the mounting cavity, and the second circulating pump may replace the first circulating pump Used to drive the coolant.
  • the insulation layer is disposed between the outer wall and the inner wall to insulate the cooling coil or the cooling coil module.
  • an inner side of the inner wall is provided with an inner frame, and the inner frame includes a first tube and a second tube, and the first tube and the second tube are used to support the IT device.
  • the inner side of the inner wall is provided with a plurality of ribs, and a flow channel is provided between each two adjacent ribs, the flow channel is used for the cooling liquid to flow, and the flow channel is also used for receiving The network cable and power cable of the IT device.
  • the outer wall is provided with a network cable interface for connecting to the network cable of the IT device and a power cable interface for connecting to the power distribution module on a side adjacent to the first side thereof.
  • the outer wall further includes a cover plate for covering the receiving cavity, and the cover plate is pivotally connected to the first side of the outer wall.
  • the heat dissipating device dissipates heat from the electronic device through the cooling component and the cooling liquid, and can quickly reduce the temperature of the electronic device, and the heat dissipation performance is good.
  • FIG. 1 is an assembled, isometric view of a cabinet provided by an embodiment of the first aspect of the present invention.
  • FIG. 2 is a cross-sectional view of the cabinet of FIG. 1.
  • FIG. 3 is a schematic view of a portion of the components and heat sink of the cabinet of FIG. 1.
  • FIG. 4 is a cross-sectional view of a cabinet provided by an embodiment of the second aspect of the present invention.
  • an embodiment of the first aspect of the present invention provides a cabinet 100 for a micro data center, the micro data center including an IT device 107 and a heat sink.
  • the IT device 107 includes a server and a network switch.
  • the micro data center further includes a power distribution module 110 for connecting to a power line of the IT device 107.
  • the heat sink includes an expansion valve 115, a refrigerant pipe 304, and a refrigerating outdoor unit 301.
  • the refrigerating outdoor unit 301 includes a refrigerating compressor 302 and an air-cooling condenser 303.
  • the heat sink and the cooling coil 112 form a complete vapor compression refrigeration cycle, the interior of which is filled with a refrigerant.
  • the outer wall 104 is located outside of the heat sink, and the outer wall 104 includes a body having a receiving cavity with an open top. Further, the outer wall 104 has a first side. Further, the outer wall 104 is provided on a side adjacent to the first side thereof with a network cable interface 108 for connecting to the network cable of the IT device 107, and a power supply for connecting to the power line of the IT device 107. Line interface 109. Further, the outer wall 104 further includes a cover plate 101 for covering the receiving cavity. Further, the cover plate 101 is pivotally coupled to the first side of the outer wall 104. Further, when the cover plate 101 is in the closed state, the cover plate 101 seals the entire cabinet by pressing the seal. This prevents the coolant from flowing out of the cabinet during transportation and prevents external foreign matter from entering the cabinet.
  • the inner wall 103 is mounted in the receiving cavity, and the inner wall 103 has a top open mounting cavity for mounting the IT device 107, and the mounting cavity is also used.
  • the coolant 111 for immersing the IT device 107 for heat dissipation is contained.
  • the inner side of the inner wall 103 is provided with an inner frame 102, and the inner frame 102 includes a first tube 201 and an opposite second tube 202 arranged in parallel, and the first tube 201 and the second tube 202 are used.
  • the IT device 107 is supported.
  • a plurality of ribs 106 are disposed on an inner side of the inner wall 103, and a flow passage is provided between each two adjacent ribs 106, and the flow passage is used for the coolant 111 to flow through, the flow passage It is also used to house the network cable and the power cord of the IT device 107.
  • a weak electric wire slot 105 is disposed between the outer wall 104 and the inner wall 103 for wiring the network cable and the sensor wire in the cabinet.
  • an insulating layer 113 is further disposed between the outer wall 104 and the inner wall 103 to insulate the cooling liquid 111.
  • a first side of the outer wall 104 is higher than a first side of the inner wall 103, and a first side of the outer wall 104 is for mounting the power distribution module 110 above the inner wall 103,
  • the power distribution module 110 is used to supply power to the IT equipment in the cabinet, and is equipped with an air switch and a lightning protection device. Further, the expansion valve 115 is disposed inside the cabinet 100 (please refer to FIG. 3).
  • the cooling assembly is mounted on the inner wall 103 and connected to the heat dissipating device to dissipate the cooling liquid 111.
  • the cooling assembly includes a cooling coil 112 located between the inner wall 103 and the outer wall 104, the cooling coil 112 abutting the inner wall 103, the cooling coil 112 is configured to be connected to the heat sink to dissipate heat from the coolant 111.
  • the cooling coil 112 is connected to the refrigerating unit 301 through the refrigerant pipe 304 for heat dissipation.
  • the cooling assembly further includes a first circulation pump 114 installed in the installation cavity and used for immersing in the coolant 111, and the first circulation pump 114 is used to drive the The coolant 111 is described.
  • the first circulation pump 114 is immersed in the coolant 111, so that noise and vibration are small.
  • the cover 101 of the outer wall 104 is pivoted relative to the body of the outer wall 104.
  • the coolant 111 is poured into the mounting cavity of the inner wall 103.
  • the IT device 107 is immersed in the cooling liquid 111.
  • the cover 101 of the outer wall 104 is covered.
  • the first circulation pump 114 is activated.
  • the heat sink is activated.
  • the heat sink dissipates the IT device 107 through the cooling component and the coolant 111, and the temperature of the IT device 107 can be quickly reduced, and the heat dissipation performance is good.
  • the heat sink dissipates the IT device 107 through the cooling component and the coolant 111, and the temperature of the IT device 107 can be quickly reduced, and the heat dissipation performance is good.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne une armoire, qui est utilisée pour un centre de traitement de données. Le centre de traitement de données comprend un dispositif électronique et un dispositif de dissipation thermique. L'armoire comprend : une paroi externe, la paroi externe étant située sur le côté extérieur du dispositif de dissipation thermique, la paroi externe comprenant un corps principal, et le corps principal ayant une cavité de réception ayant une partie supérieure ouverte ; une paroi interne, la paroi interne étant montée à l'intérieur de la cavité de réception, la paroi interne ayant une cavité de montage ayant une partie supérieure ouverte, la cavité de montage étant utilisée pour monter le dispositif électronique, et la cavité de montage étant en outre utilisée pour contenir un liquide de refroidissement qui permet au dispositif électronique d'être immergé en vue d'une dissipation thermique ; et un ensemble de refroidissement, l'ensemble de refroidissement étant monté sur la paroi interne et étant relié au dispositif de dissipation thermique pour effectuer une dissipation thermique sur le liquide de refroidissement. La présente invention concerne également un centre de traitement de données.
PCT/CN2017/110957 2017-04-24 2017-11-14 Armoire et micro-centre de traitement de données Ceased WO2018196339A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710270316.6A CN106912186A (zh) 2017-04-24 2017-04-24 机柜及微型数据中心
CN201710270316.6 2017-04-24

Publications (1)

Publication Number Publication Date
WO2018196339A1 true WO2018196339A1 (fr) 2018-11-01

Family

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Application Number Title Priority Date Filing Date
PCT/CN2017/110957 Ceased WO2018196339A1 (fr) 2017-04-24 2017-11-14 Armoire et micro-centre de traitement de données

Country Status (2)

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CN (1) CN106912186A (fr)
WO (1) WO2018196339A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020183038A1 (fr) * 2019-03-13 2020-09-17 Submer Technologies, S.L. Système de réfrigération pour entités de calcul

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106912186A (zh) * 2017-04-24 2017-06-30 深圳绿色云图科技有限公司 机柜及微型数据中心
CN107690267B (zh) * 2017-09-30 2023-11-28 深圳绿色云图科技有限公司 一种数据中心冷却系统以及数据中心
CN107690268B (zh) * 2017-09-30 2023-11-28 深圳绿色云图科技有限公司 一种数据中心冷却系统以及数据中心
CN107846822A (zh) * 2017-11-26 2018-03-27 北京中热能源科技有限公司 一种电子设备冷却系统
CN108551746A (zh) * 2018-04-11 2018-09-18 安徽凯贝耐特钣金科技有限公司 一种浸入式油冷机柜
CN109588018B (zh) * 2018-12-28 2020-05-12 成都中讯创新科技股份有限公司 一种全浸式数据中心架构
TWI816445B (zh) * 2022-04-07 2023-09-21 緯穎科技服務股份有限公司 密封機構及其兩相式水冷散熱裝置

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CN205385684U (zh) * 2016-01-26 2016-07-13 北京创和世纪通讯技术股份有限公司 散热机柜
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CN106255387A (zh) * 2016-08-31 2016-12-21 深圳绿色云图科技有限公司 散热系统及数据中心
CN106416450A (zh) * 2014-06-30 2017-02-15 微软技术许可有限责任公司 浸入冷却液体中的数据中心
CN106912186A (zh) * 2017-04-24 2017-06-30 深圳绿色云图科技有限公司 机柜及微型数据中心

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CN206879304U (zh) * 2017-04-24 2018-01-12 深圳绿色云图科技有限公司 机柜及微型数据中心

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CN106416450A (zh) * 2014-06-30 2017-02-15 微软技术许可有限责任公司 浸入冷却液体中的数据中心
CN104915321A (zh) * 2015-06-04 2015-09-16 浪潮电子信息产业股份有限公司 一种浸入式相变冷却高密度计算系统
CN205385684U (zh) * 2016-01-26 2016-07-13 北京创和世纪通讯技术股份有限公司 散热机柜
CN106163242A (zh) * 2016-08-31 2016-11-23 杭州华为数字技术有限公司 一种机柜换热系统及服务器
CN106255387A (zh) * 2016-08-31 2016-12-21 深圳绿色云图科技有限公司 散热系统及数据中心
CN106912186A (zh) * 2017-04-24 2017-06-30 深圳绿色云图科技有限公司 机柜及微型数据中心

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020183038A1 (fr) * 2019-03-13 2020-09-17 Submer Technologies, S.L. Système de réfrigération pour entités de calcul
JP2022531069A (ja) * 2019-03-13 2022-07-06 スブメル・テクノロジーズ・エセエレ コンピューティングデバイスのための冷却システム
JP7316372B2 (ja) 2019-03-13 2023-07-27 スブメル・テクノロジーズ・エセエレ コンピューティングデバイスのための冷却システム
US11856727B2 (en) 2019-03-13 2023-12-26 Submer Technologies, S.L. Cooling system for computer components

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