WO2018107439A1

WO2018107439A1 - Laser cutting work platform and laser cutting device

Info

Publication number: WO2018107439A1
Application number: PCT/CN2016/110145
Authority: WO
Inventors: 尹燕东
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2016-12-15
Filing date: 2016-12-15
Publication date: 2018-06-21
Also published as: CN107980017A

Abstract

A laser cutting work platform (100) and a laser cutting device. The laser cutting work platform (100) comprises a base (10) and a support platform (20). The support platform (20) is provided on the base (10). The support platform (20) comprises a plurality of grids (22) connected to each other. The plurality of grids (22) are provided in a regular array and/or provided linearly with regular gaps in between. The grid (22) is used to support a product to be processed (a, b). As the grid (22) of the support platform (20) is provided with gaps using at least one of the two aforementioned methods, when the product to be processed (a, b) is placed on the support platform (20) for processing, a laser beam penetrates the product to be processed (a, b) via different beam paths entering the gaps between the grids (22), thereby preventing damage to the grid (22). The work platform (100) can be adapted for processing of multiple, different products, reducing the cost of processing of different products and increasing processing efficiency. The laser cutting device comprises the laser cutting work platform (100).

Description

Workbench for laser cutting and laser cutting equipment

Technical field

The invention relates to the field of laser cutting, in particular to a worktable for laser cutting and a laser cutting device.

Background technique

At present, the grid arrangement of the surface of the table for laser cutting and the design of the vacuum adsorption area usually correspond to a single product. When replacing different products, the corresponding work table needs to be replaced, otherwise the laser of different walking routes will fall into the product. On the grid body, the grid body is susceptible to laser burn. As such, the cost and efficiency of processing different sizes of products is high.

Summary of the invention

The present invention aims to solve at least one of the technical problems in the related art to some extent. To this end, the present invention proposes a table for laser cutting and a laser cutting device.

The work table for laser cutting according to an embodiment of the present invention includes:

Base

a support table, the support table is disposed on the base, the support table includes a plurality of connected grid bodies, and the plurality of grid bodies are arranged in an equidistant array and/or equidistant linear intervals. The grid body is used to support the product to be processed.

In the working table for laser cutting according to the embodiment of the present invention, since the grid bodies of the support table are arranged at least one of the above two manners, so that different products to be processed are placed on the support table for processing, different walking routes are used. After the laser penetrates the product to be processed, it falls into the space between the grid bodies without causing damage to the grid body. Therefore, the worktable can be adapted to the processing of different products to be processed, which reduces the cost of processing different products and improves the processing efficiency.

In some embodiments, the base is provided with a groove, and a bottom of the groove is provided with a vacuum adsorption circuit for adsorbing the product to be processed on the support table.

In some embodiments, the grid body is in the shape of a cube having a side length of from 1 mm to 3 mm.

In some embodiments, the grid body has a rectangular parallelepiped shape, and the height of the grid body is equal to the width of the grid body.

In some embodiments, the support table includes a connection portion connecting adjacent two of the grid bodies, the connection portion being recessed relative to the grid body.

In some embodiments, when the plurality of the grid bodies are arranged at equal intervals, the connecting portion has a grid structure;

When a plurality of the grid bodies are disposed at equidistant linear intervals, the connecting portion includes a plurality of sub-connecting portions in a strip shape.

In some embodiments, the height difference between the connecting portion and the grid body is between 1 mm and 2 mm.

In some embodiments, the distance between adjacent two of the grid bodies is from 3 mm to 4 mm.

In certain embodiments, the grid body is made of aluminum.

A laser cutting apparatus according to an embodiment of the present invention includes the work table for laser cutting of any of the above embodiments.

In the laser cutting apparatus of the embodiment of the present invention, since the grid bodies of the support table are arranged at least in a manner of at least one of the above two manners, when different products to be processed are placed on the support table for processing, laser wear of different walking routes is performed. After passing through the processed product, it falls into the space between the grid bodies without causing damage to the workbench. Therefore, the worktable can be adapted to the processing of different products to be processed, which reduces the cost of processing different products and improves the processing efficiency.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention are described in conjunction with the following figures. The description will become obvious and easy to understand, where:

1 is a schematic plan view of a table for laser cutting according to an embodiment of the present invention.

2 is a schematic plan view of a base according to an embodiment of the present invention.

3 is a schematic view showing a connection structure of a grid body according to an embodiment of the present invention.

4 is a schematic view showing another connection structure of a grid body according to an embodiment of the present invention.

Fig. 5 is another schematic plan view of a table for laser cutting according to an embodiment of the present invention.

Fig. 6 is another schematic plan view of a table for laser cutting according to an embodiment of the present invention.

The main component symbol description:

Workbench 100 for laser cutting, base 10, groove 12, vacuum adsorption circuit 14;

The support table 20, the support base grid body 22, the connecting portion 24, the sub-connecting portion 26, the height c of the grid body, the side length d of the grid body, the length e of the grid body, and the width f of the grid body;

Product to be processed a, product to be processed b.

detailed description

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are merely illustrative of the embodiments of the invention, and are not to be construed as limiting.

Referring to FIG. 1 and FIG. 2 , a worktable 100 for laser cutting according to an embodiment of the present invention includes a base 10 and a support base 20 . The support table 20 is disposed on the base 10, and the support table 20 includes a plurality of connected grid bodies 22, and the plurality of grid bodies 22 are arranged in an equidistant array and/or equidistant linear intervals, and the grid body 22 is used for supporting Products to be processed.

In the table 100 for laser cutting according to the embodiment of the present invention, since the grid bodies 22 of the support table 20 are spaced apart in at least one of the above two manners, so that different products to be processed are placed on the support table 20 for processing. When the lasers of different walking routes penetrate the products to be processed and fall into the space between the grid bodies 22, the grid body 22 is not damaged. Therefore, the work of laser cutting The table 100 can be adapted to different processing of a plurality of products to be processed, reducing the cost of processing different products and improving the processing efficiency.

Specifically, the orthographic projection of the support table 20 on the base 10 is located within the range of the base 10. The outermost portion of the support table 20 can be fixed to the base 10 by fasteners. Thus, the support of the base 10 to the support table 20 is more stable. The support table 20 is also less prone to displacement, ensuring the accuracy of laser cutting.

In the embodiment of Fig. 1, a plurality of grid bodies 22 are arranged at equal intervals. When different sizes of products to be processed are placed on the support table 20, the different number of combined grid bodies 22 can correspondingly support the products to be processed of corresponding sizes, and thus, the support table 20 can be adapted to the processing of a plurality of products to be processed of different sizes. . For example, please refer to FIG. 1 , the dashed lines show two products to be processed a and b of different sizes, and the support table 20 can effectively serve two products to be processed a and b of different sizes by different combinations of the grid bodies 22 . support.

In some embodiments, referring to FIG. 2, the base 10 is provided with a recess 12, and the bottom of the recess 12 is provided with a vacuum adsorption circuit 14 for adsorbing the product to be processed on the grid body 22.

In this way, the product to be processed does not shake or shift when the laser is cut, and the precision of the cutting is ensured. At the same time, the vacuum adsorption circuit 14 can also absorb the debris generated by the product to be processed during laser cutting, and facilitate the collection of the debris and the cleaning of the processing site after the processing is completed. Since the vacuum adsorption circuit 14 completes the adsorption or loosening of the product to be processed through the communication or disconnection of the circuit, the use of the vacuum adsorption circuit 14 also facilitates loading and unloading of the product to be processed, saving a lot of time and improving the processing efficiency.

Further, the vacuum adsorption circuit 14 exerts a certain adsorption effect on the support table 20, and the support table 20 is also disposed on the base 10 and is more stable.

Referring to Figures 1 and 3, in some embodiments, the grid body 22 is in the shape of a cube, and the side length d of the grid body 22 is from 1 mm to 3 mm.

In this way, most of the laser light that penetrates the product to be processed falls between the cube grid bodies 22 without falling into the grid body 22, thereby avoiding the laser from burning the grid body 22 and prolonging the laser cutting. The life of the table 100, the support table 20 can also adapt to all sizes of products to be processed, saving Processing costs.

Preferably, the side length d of the grid body 22 is 2 mm. Since the distance between the two nearest parallel laser lines is 2 mm when laser cutting, when the side length d of the grid body 22 is designed to be 2 mm, more laser light penetrating the product to be processed falls into the grid. Between the lattice bodies 22, the grid body 22 supporting the product to be processed is prevented from being burnt, and the service life of the table 100 for laser cutting is further extended, thereby saving costs.

The cube-shaped grid body 22 can be preferably applied in an embodiment of an equidistant array distribution.

Referring to FIGS. 1 and 4, in some embodiments, the grid body 22 has a rectangular parallelepiped shape, and the height c of the grid body 22 and the length f of the grid body 22 are equal.

Specifically, the length e of the grid body can be determined according to actual conditions.

The table 100 for laser cutting of this embodiment corresponds to a product to be processed in which the traveling path of the laser is mainly in the same direction during laser cutting, for example, a direction parallel to the length e of the grid body, reducing the laser falling into the grid during laser cutting. The risk on the body 22 protects the grid body 22 for laser cutting from being burnt by the laser, and when the product to be processed is replaced, the laser cutting path is mainly in the same direction as the laser cutting, and the laser cutting table 100 does not need to be replaced. , greatly saving costs and improving processing efficiency.

In some embodiments, the support table 20 includes a connection portion 24 that connects adjacent two grid bodies 22 that are recessed relative to the grid body 22.

Since the periphery of the support table 20 is fixed to the base 10 by fasteners, the grid body 22 connected to each other by the joint portion 24 stably fixes the support table 20 to the base 10. At the same time, the energy of the laser is generally designed to penetrate enough of the product to be processed, so that after the laser penetrates the product to be processed, it cannot continue to reach the recessed connecting portion 24. Thus, the recessed connecting portion 24 also avoids the burning of the laser light and prolongs the service life of the table 100 for laser cutting.

Referring to FIG. 1 , in some embodiments, when the plurality of grid bodies 22 are arranged at equal intervals, the connecting portion 24 includes a portion having a grid structure;

Referring to FIG. 5, when the plurality of grid bodies 22 are arranged at equidistant linear intervals, the connecting portion 24 includes A plurality of sub-connecting portions 26 in a strip shape are included.

Thus, the connecting portion 24 including the mesh structure can stably connect the grid body 22, and the laser cutting precision of the product to be processed is ensured. The plurality of sub-connecting portions 26 in a strip shape can simplify the processing of the table 100 for laser cutting, save cost, and provide a stable connection for the grid body 22.

Referring to FIG. 4 and FIG. 5, preferably, when the plurality of grid bodies 22 are arranged at equidistant linear intervals, the grid body 22 has a rectangular parallelepiped shape, and the length e of the grid body 22 has a length equal to that of the support table. Length L. The support table of the grid body 22 arranged at equal intervals is suitable for the product to be processed which is mainly in the same direction when the laser travels the laser cutting, for example, the direction parallel to the length e of the grid body.

In some embodiments, the height difference between the connecting portion 24 and the grid body 22 is between 1 mm and 2 mm.

Thus, most of the laser light that penetrates the product to be processed does not fall on the connecting portion 24, causing burns to the connecting portion 24, thereby prolonging the service life of the table 100 for laser cutting.

Specifically, the difference in height between the grid body 22 and the connecting portion 24 is too large, which may cause the overall thickness of the table 100 to be too large, resulting in waste of the material of the support table 20, and also affecting the placement of the vacuum adsorption circuit 14 under the support table 20. The adsorption force of the product to be processed on the support table 20 causes the product to be processed to be unstable, displacement or jitter occurs during laser cutting, affecting the precision of laser cutting; the height difference between the grid body 22 and the connecting portion 24 is too small When the laser penetrates the product to be processed and falls on the connecting portion 24, the connecting portion 24 is burned, resulting in the need to frequently replace the supporting table 20, thereby increasing the processing cost.

Preferably, the height difference is 1 mm.

In some embodiments, the distance between adjacent two grid bodies 22 is between 3 mm and 4 mm.

This prevents the laser from causing burns to the grid body 22 for laser cutting.

Preferably, the distance between the two grid bodies 22 is 2 mm. As such, a greater number of grid bodies 22 provide stable support for the product to be processed.

Referring to FIG. 6, in some embodiments, the plurality of grid bodies 22 are arranged in an equidistant array and equidistant linear intervals. It can be understood that FIG. 6 only cites a combination of one of the equidistant array type and the equidistant linear type, and other combinations can be similarly obtained, and are not developed one by one.

In some embodiments, the grid body 22 is made of aluminum.

In the embodiment of the present invention, the aluminum grid body 22 can greatly reduce the processing cost, and the aluminum grid body 22 reduces the processing difficulty and improves the processing efficiency.

Further, in some embodiments, the connecting portion 24 is also made of aluminum. In this way, the entire support table 20 is easier to process and saves costs.

A laser cutting apparatus according to an embodiment of the present invention includes the stage 100 for laser cutting according to any of the above embodiments.

In the laser cutting apparatus of the embodiment of the present invention, since the grid bodies 22 of the support table 20 are spaced apart in at least one of the above two manners, so that different products to be processed are placed on the support table 20 for processing, different walking routes are used. The laser light penetrates the product to be processed and falls into the space between the grid bodies 22 without causing damage to the grid body 22 for laser cutting. Therefore, the table 100 for laser cutting can be adapted to different processing of a plurality of products to be processed, which reduces the cost when processing different products and improves the processing efficiency.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " After, "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inside", "Outside", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship of the "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplified description, and does not indicate or imply the indicated device or component. It must be constructed and operated in a particular orientation, and is not to be construed as limiting the invention.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined.

In the present invention, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. , or integrated; can be mechanical connection or electrical connection; can be directly connected, or can be indirectly connected through an intermediate medium, can be the internal connection of two components or the phase of two components Interaction relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the present invention, the first feature "on" or "under" the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means a specific feature described in connection with the embodiment or example. A structure, material or feature is included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification, as well as features of various embodiments or examples, may be combined and combined.

Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The embodiments are subject to variations, modifications, substitutions and variations.

Claims

A work table for laser cutting, comprising:

Base

a support table, the support table is disposed on the base, the support table includes a plurality of connected grid bodies, and the plurality of grid bodies are arranged in an equidistant array and/or equidistant linear intervals. The grid body is used to support the product to be processed.
The table for laser cutting according to claim 1, wherein the base is provided with a groove, and a bottom of the groove is provided with a vacuum adsorption circuit for using the vacuum adsorption circuit to be processed. The product is adsorbed on the grid body.
A table for laser cutting according to claim 1, wherein said grid body has a cubic shape, and said grid body has a side length of from 1 mm to 3 mm.
A table for laser cutting according to claim 1, wherein said grid body has a rectangular parallelepiped shape, and said grid body has a height equal to a width of said grid body.
A table for laser cutting according to claim 1, wherein said table includes a connecting portion that connects adjacent two of said grid bodies, said connecting portion being opposite said grid The body is concave.
The table for laser cutting according to claim 5, wherein when the plurality of grid bodies are arranged at equal intervals, the connecting portion comprises a portion having a grid structure;

When the plurality of grid bodies are disposed at equidistant linear intervals, the connecting portion includes a plurality of sub-connecting portions in a strip shape.
A table for laser cutting according to claim 5, wherein a height difference between said connecting portion and said grid body is from 1 mm to 2 mm.
A table for laser cutting according to claim 1, wherein the distance between adjacent two of said grid bodies is from 3 mm to 4 mm.
A work table for laser cutting according to claim 1, wherein said grid The body is made of aluminum.
A laser cutting apparatus comprising the work table for laser cutting according to any one of claims 1-9.