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WO2018107439A1 - Plate-forme de travail de coupe au laser et dispositif de coupe au laser - Google Patents

Plate-forme de travail de coupe au laser et dispositif de coupe au laser Download PDF

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Publication number
WO2018107439A1
WO2018107439A1 PCT/CN2016/110145 CN2016110145W WO2018107439A1 WO 2018107439 A1 WO2018107439 A1 WO 2018107439A1 CN 2016110145 W CN2016110145 W CN 2016110145W WO 2018107439 A1 WO2018107439 A1 WO 2018107439A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser cutting
grid
processed
grid body
bodies
Prior art date
Application number
PCT/CN2016/110145
Other languages
English (en)
Chinese (zh)
Inventor
尹燕东
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201680039084.7A priority Critical patent/CN107980017A/zh
Priority to PCT/CN2016/110145 priority patent/WO2018107439A1/fr
Publication of WO2018107439A1 publication Critical patent/WO2018107439A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment

Definitions

  • the invention relates to the field of laser cutting, in particular to a worktable for laser cutting and a laser cutting device.
  • the grid arrangement of the surface of the table for laser cutting and the design of the vacuum adsorption area usually correspond to a single product.
  • the corresponding work table needs to be replaced, otherwise the laser of different walking routes will fall into the product.
  • the grid body is susceptible to laser burn. As such, the cost and efficiency of processing different sizes of products is high.
  • the present invention aims to solve at least one of the technical problems in the related art to some extent. To this end, the present invention proposes a table for laser cutting and a laser cutting device.
  • the support table is disposed on the base, the support table includes a plurality of connected grid bodies, and the plurality of grid bodies are arranged in an equidistant array and/or equidistant linear intervals.
  • the grid body is used to support the product to be processed.
  • the grid bodies of the support table are arranged at least one of the above two manners, so that different products to be processed are placed on the support table for processing, different walking routes are used. After the laser penetrates the product to be processed, it falls into the space between the grid bodies without causing damage to the grid body. Therefore, the worktable can be adapted to the processing of different products to be processed, which reduces the cost of processing different products and improves the processing efficiency.
  • the base is provided with a groove, and a bottom of the groove is provided with a vacuum adsorption circuit for adsorbing the product to be processed on the support table.
  • the grid body is in the shape of a cube having a side length of from 1 mm to 3 mm.
  • the grid body has a rectangular parallelepiped shape, and the height of the grid body is equal to the width of the grid body.
  • the support table includes a connection portion connecting adjacent two of the grid bodies, the connection portion being recessed relative to the grid body.
  • the connecting portion when the plurality of the grid bodies are arranged at equal intervals, the connecting portion has a grid structure
  • the connecting portion includes a plurality of sub-connecting portions in a strip shape.
  • the height difference between the connecting portion and the grid body is between 1 mm and 2 mm.
  • the distance between adjacent two of the grid bodies is from 3 mm to 4 mm.
  • the grid body is made of aluminum.
  • a laser cutting apparatus includes the work table for laser cutting of any of the above embodiments.
  • the grid bodies of the support table are arranged at least in a manner of at least one of the above two manners, when different products to be processed are placed on the support table for processing, laser wear of different walking routes is performed. After passing through the processed product, it falls into the space between the grid bodies without causing damage to the workbench. Therefore, the worktable can be adapted to the processing of different products to be processed, which reduces the cost of processing different products and improves the processing efficiency.
  • FIG. 1 is a schematic plan view of a table for laser cutting according to an embodiment of the present invention.
  • FIG. 2 is a schematic plan view of a base according to an embodiment of the present invention.
  • FIG 3 is a schematic view showing a connection structure of a grid body according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing another connection structure of a grid body according to an embodiment of the present invention.
  • Fig. 5 is another schematic plan view of a table for laser cutting according to an embodiment of the present invention.
  • Fig. 6 is another schematic plan view of a table for laser cutting according to an embodiment of the present invention.
  • a worktable 100 for laser cutting includes a base 10 and a support base 20 .
  • the support table 20 is disposed on the base 10, and the support table 20 includes a plurality of connected grid bodies 22, and the plurality of grid bodies 22 are arranged in an equidistant array and/or equidistant linear intervals, and the grid body 22 is used for supporting Products to be processed.
  • the grid bodies 22 of the support table 20 are spaced apart in at least one of the above two manners, so that different products to be processed are placed on the support table 20 for processing.
  • the grid body 22 is not damaged. Therefore, the work of laser cutting
  • the table 100 can be adapted to different processing of a plurality of products to be processed, reducing the cost of processing different products and improving the processing efficiency.
  • the orthographic projection of the support table 20 on the base 10 is located within the range of the base 10.
  • the outermost portion of the support table 20 can be fixed to the base 10 by fasteners.
  • the support of the base 10 to the support table 20 is more stable.
  • the support table 20 is also less prone to displacement, ensuring the accuracy of laser cutting.
  • a plurality of grid bodies 22 are arranged at equal intervals.
  • the different number of combined grid bodies 22 can correspondingly support the products to be processed of corresponding sizes, and thus, the support table 20 can be adapted to the processing of a plurality of products to be processed of different sizes.
  • the dashed lines show two products to be processed a and b of different sizes, and the support table 20 can effectively serve two products to be processed a and b of different sizes by different combinations of the grid bodies 22 . support.
  • the base 10 is provided with a recess 12, and the bottom of the recess 12 is provided with a vacuum adsorption circuit 14 for adsorbing the product to be processed on the grid body 22.
  • the vacuum adsorption circuit 14 can also absorb the debris generated by the product to be processed during laser cutting, and facilitate the collection of the debris and the cleaning of the processing site after the processing is completed. Since the vacuum adsorption circuit 14 completes the adsorption or loosening of the product to be processed through the communication or disconnection of the circuit, the use of the vacuum adsorption circuit 14 also facilitates loading and unloading of the product to be processed, saving a lot of time and improving the processing efficiency.
  • the vacuum adsorption circuit 14 exerts a certain adsorption effect on the support table 20, and the support table 20 is also disposed on the base 10 and is more stable.
  • the grid body 22 is in the shape of a cube, and the side length d of the grid body 22 is from 1 mm to 3 mm.
  • the support table 20 can also adapt to all sizes of products to be processed, saving Processing costs.
  • the side length d of the grid body 22 is 2 mm. Since the distance between the two nearest parallel laser lines is 2 mm when laser cutting, when the side length d of the grid body 22 is designed to be 2 mm, more laser light penetrating the product to be processed falls into the grid. Between the lattice bodies 22, the grid body 22 supporting the product to be processed is prevented from being burnt, and the service life of the table 100 for laser cutting is further extended, thereby saving costs.
  • the cube-shaped grid body 22 can be preferably applied in an embodiment of an equidistant array distribution.
  • the grid body 22 has a rectangular parallelepiped shape, and the height c of the grid body 22 and the length f of the grid body 22 are equal.
  • the length e of the grid body can be determined according to actual conditions.
  • the table 100 for laser cutting of this embodiment corresponds to a product to be processed in which the traveling path of the laser is mainly in the same direction during laser cutting, for example, a direction parallel to the length e of the grid body, reducing the laser falling into the grid during laser cutting.
  • the risk on the body 22 protects the grid body 22 for laser cutting from being burnt by the laser, and when the product to be processed is replaced, the laser cutting path is mainly in the same direction as the laser cutting, and the laser cutting table 100 does not need to be replaced. , greatly saving costs and improving processing efficiency.
  • the support table 20 includes a connection portion 24 that connects adjacent two grid bodies 22 that are recessed relative to the grid body 22.
  • the grid body 22 connected to each other by the joint portion 24 stably fixes the support table 20 to the base 10.
  • the energy of the laser is generally designed to penetrate enough of the product to be processed, so that after the laser penetrates the product to be processed, it cannot continue to reach the recessed connecting portion 24.
  • the recessed connecting portion 24 also avoids the burning of the laser light and prolongs the service life of the table 100 for laser cutting.
  • the connecting portion 24 when the plurality of grid bodies 22 are arranged at equal intervals, the connecting portion 24 includes a portion having a grid structure;
  • the connecting portion 24 when the plurality of grid bodies 22 are arranged at equidistant linear intervals, the connecting portion 24 includes A plurality of sub-connecting portions 26 in a strip shape are included.
  • the connecting portion 24 including the mesh structure can stably connect the grid body 22, and the laser cutting precision of the product to be processed is ensured.
  • the plurality of sub-connecting portions 26 in a strip shape can simplify the processing of the table 100 for laser cutting, save cost, and provide a stable connection for the grid body 22.
  • the grid body 22 when the plurality of grid bodies 22 are arranged at equidistant linear intervals, the grid body 22 has a rectangular parallelepiped shape, and the length e of the grid body 22 has a length equal to that of the support table. Length L.
  • the support table of the grid body 22 arranged at equal intervals is suitable for the product to be processed which is mainly in the same direction when the laser travels the laser cutting, for example, the direction parallel to the length e of the grid body.
  • the height difference between the connecting portion 24 and the grid body 22 is between 1 mm and 2 mm.
  • the difference in height between the grid body 22 and the connecting portion 24 is too large, which may cause the overall thickness of the table 100 to be too large, resulting in waste of the material of the support table 20, and also affecting the placement of the vacuum adsorption circuit 14 under the support table 20.
  • the adsorption force of the product to be processed on the support table 20 causes the product to be processed to be unstable, displacement or jitter occurs during laser cutting, affecting the precision of laser cutting; the height difference between the grid body 22 and the connecting portion 24 is too small When the laser penetrates the product to be processed and falls on the connecting portion 24, the connecting portion 24 is burned, resulting in the need to frequently replace the supporting table 20, thereby increasing the processing cost.
  • the height difference is 1 mm.
  • the distance between adjacent two grid bodies 22 is between 3 mm and 4 mm.
  • the distance between the two grid bodies 22 is 2 mm. As such, a greater number of grid bodies 22 provide stable support for the product to be processed.
  • the plurality of grid bodies 22 are arranged in an equidistant array and equidistant linear intervals. It can be understood that FIG. 6 only cites a combination of one of the equidistant array type and the equidistant linear type, and other combinations can be similarly obtained, and are not developed one by one.
  • the grid body 22 is made of aluminum.
  • the aluminum grid body 22 can greatly reduce the processing cost, and the aluminum grid body 22 reduces the processing difficulty and improves the processing efficiency.
  • the connecting portion 24 is also made of aluminum. In this way, the entire support table 20 is easier to process and saves costs.
  • a laser cutting apparatus includes the stage 100 for laser cutting according to any of the above embodiments.
  • the table 100 for laser cutting can be adapted to different processing of a plurality of products to be processed, which reduces the cost when processing different products and improves the processing efficiency.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. , or integrated; can be mechanical connection or electrical connection; can be directly connected, or can be indirectly connected through an intermediate medium, can be the internal connection of two components or the phase of two components Interaction relationship.
  • installation can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne une plate-forme de travail de coupe au laser (100) et un dispositif de coupe au laser. La plate-forme de travail de coupe au laser (100) comprend une base (10) et une plate-forme porteuse (20). La plate-forme porteuse (20) est disposée sur la base (10). La plate-forme porteuse (20) comprend une pluralité de grilles (22) reliées les unes aux autres. La pluralité de grilles (22) est disposée en un réseau régulier et/ou linéairement avec des espaces réguliers entre elles. La grille (22) est utilisée pour porter un produit à traiter (a, b). Étant donné que la grille (22) de la plate-forme porteuse (20) est pourvue d'espaces à l'aide d'au moins l'un des deux procédés susmentionnés, lorsque le produit à traiter (a, b) est placé sur la plate-forme porteuse (20) pour le traitement, un faisceau laser pénètre dans le produit à traiter (a, b) par l'intermédiaire de différents trajets de faisceau entrant dans les espaces entre les grilles (22), empêchant ainsi un endommagement de la grille (22). La plate-forme de travail (100) peut être conçue pour traiter de multiples produits différents, pour réduire le coût de traitement de différents produits et pour augmenter l'efficacité de traitement. Le dispositif de coupe au laser comprend la plate-forme de travail de coupe au laser (100).
PCT/CN2016/110145 2016-12-15 2016-12-15 Plate-forme de travail de coupe au laser et dispositif de coupe au laser WO2018107439A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680039084.7A CN107980017A (zh) 2016-12-15 2016-12-15 激光切割用的工作台和激光切割设备
PCT/CN2016/110145 WO2018107439A1 (fr) 2016-12-15 2016-12-15 Plate-forme de travail de coupe au laser et dispositif de coupe au laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/110145 WO2018107439A1 (fr) 2016-12-15 2016-12-15 Plate-forme de travail de coupe au laser et dispositif de coupe au laser

Publications (1)

Publication Number Publication Date
WO2018107439A1 true WO2018107439A1 (fr) 2018-06-21

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CN (1) CN107980017A (fr)
WO (1) WO2018107439A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114055412A (zh) * 2021-11-29 2022-02-18 霸州市云谷电子科技有限公司 一种平台结构及贴合装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112549156A (zh) * 2020-11-16 2021-03-26 环旭电子股份有限公司 一种切割支撑平台及切割系统
CN117583758B (zh) * 2023-12-05 2024-07-09 太仓靓特金属制品有限公司 一种展示架加工用定长激光切割设备
CN118595639B (zh) * 2024-08-07 2024-10-25 福建东钢钢铁有限公司 一种型钢激光切割设备

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CN201931208U (zh) * 2011-02-28 2011-08-17 东莞市开泰激光科技有限公司 激光切割机的吸附工作台
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US20130161312A1 (en) * 2003-09-16 2013-06-27 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
CN203292710U (zh) * 2013-06-07 2013-11-20 苏州市世嘉科技股份有限公司 激光切割机用工作台
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CN104759765A (zh) * 2015-02-04 2015-07-08 大族激光科技产业集团股份有限公司 激光切割用治具

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CN103395978B (zh) * 2013-07-23 2017-11-14 武汉帝尔激光科技股份有限公司 一种面板工件的圆孔切割系统及切割方法

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Publication number Priority date Publication date Assignee Title
US20130161312A1 (en) * 2003-09-16 2013-06-27 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
CN201366669Y (zh) * 2009-02-16 2009-12-23 罗健星 多用途真空工作台
JP2011156554A (ja) * 2010-01-29 2011-08-18 Hitachi Zosen Fukui Corp 板材の突き合わせ位置決め装置
CN201931208U (zh) * 2011-02-28 2011-08-17 东莞市开泰激光科技有限公司 激光切割机的吸附工作台
CN203292710U (zh) * 2013-06-07 2013-11-20 苏州市世嘉科技股份有限公司 激光切割机用工作台
CN104096980A (zh) * 2014-06-26 2014-10-15 长春光华微电子设备工程中心有限公司 激光切割真空吸附平台
CN204123174U (zh) * 2014-08-26 2015-01-28 无锡格瑞斯精密机械有限公司 一种工件固定装置
CN104759765A (zh) * 2015-02-04 2015-07-08 大族激光科技产业集团股份有限公司 激光切割用治具

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114055412A (zh) * 2021-11-29 2022-02-18 霸州市云谷电子科技有限公司 一种平台结构及贴合装置

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