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WO2019003267A1 - Dispositif de montage de composant et procédé de création de données de composant - Google Patents

Dispositif de montage de composant et procédé de création de données de composant Download PDF

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Publication number
WO2019003267A1
WO2019003267A1 PCT/JP2017/023376 JP2017023376W WO2019003267A1 WO 2019003267 A1 WO2019003267 A1 WO 2019003267A1 JP 2017023376 W JP2017023376 W JP 2017023376W WO 2019003267 A1 WO2019003267 A1 WO 2019003267A1
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WO
WIPO (PCT)
Prior art keywords
component
imaging
image
unit
control unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/023376
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English (en)
Japanese (ja)
Inventor
孝智 水嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2019526402A priority Critical patent/JP6831460B2/ja
Priority to PCT/JP2017/023376 priority patent/WO2019003267A1/fr
Publication of WO2019003267A1 publication Critical patent/WO2019003267A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a component mounting apparatus and a component data creation method.
  • the part data creation method is disclosed, for example, in Japanese Patent Laid-Open No. 2006-302949.
  • Japanese Patent Laid-Open No. 2006-302949 discloses a method of creating component library data (method of creating component data) for creating component data for recognizing a component in a component mounting apparatus for mounting a component on a substrate.
  • the target component is imaged by the component recognition camera, and information including the position and the diameter of the electrode is acquired based on the imaged image.
  • the operator confirms the image and inputs the information of the electrode.
  • component data creation method component data creation method
  • component data can be created automatically, it is difficult to recognize an electrode from a captured image.
  • the operator needs to input information. This increases the workload on the operator.
  • an erroneous input may occur, so that it may not be possible to create component data with high accuracy. Therefore, it is desired to reduce the work load on the operator and create component data with high accuracy.
  • the present invention has been made to solve the problems as described above, and one object of the present invention is to reduce the work load on the operator and to implement component mounting capable of creating component data with high accuracy.
  • An apparatus and component data creation method is provided.
  • the component mounting apparatus recognizes a component based on an image of the component taken by the mounting head for mounting the component on a substrate, an imaging unit capable of imaging the component, and the imaging unit.
  • the control unit is configured to generate component data by causing the imaging unit to image the component a plurality of times under different imaging conditions.
  • the control unit is configured to perform control of generating component data by causing the imaging unit to image the component a plurality of times under different imaging conditions.
  • the apparatus includes illumination for irradiating the component with light at the time of imaging by the imaging unit, and the control unit changes the irradiation condition of light by illumination and the component is used multiple times by the imaging unit. It is configured to perform imaging control and create component data.
  • the component whose appearance changes depending on the light irradiation condition can be imaged under a plurality of light irradiation conditions. Therefore, the number of feature points of the component can be recognized effectively. can do.
  • control unit is configured to control the creation of the component data by causing the imaging unit to image the component a plurality of times by changing the irradiation direction of light to the component.
  • a component having a feature point whose light reflection direction changes depending on the light irradiation direction can be imaged under a plurality of irradiation conditions in which the light irradiation direction is changed. The number that can be recognized can be increased more effectively.
  • the control unit varies the amount of light to be emitted from the illumination to the component and the component is performed a plurality of times by the imaging unit It is configured to perform imaging and control to acquire an amount of light suitable for imaging based on the imaged image.
  • the component includes a plurality of bump electrodes
  • the control unit irradiates the component with light from below. Control is performed to create component data based on an image obtained by imaging the component and an image obtained by imaging the component by emitting light from the side to the component.
  • the outer shape of the part can be easily recognized based on the image captured by irradiating the part with light from below, and the part is irradiated with light from the side, The positions of the plurality of bump electrodes projecting downward can be easily recognized.
  • the control unit acquires an outer shape of the component based on an image of the component imaged under the first imaging condition, and a second imaging condition different from the first imaging condition It is comprised so that control which acquires the arrangement
  • the component data can be easily accurate with the image captured under the first imaging condition in which the external shape of the component is clearly visible and the image imaged under the second imaging condition in which the electrode of the component is clearly visible. It can be created well.
  • control unit is configured to perform control of imaging the component under the second imaging condition after imaging the component under the first imaging condition.
  • the position of the electrode can be associated with the reference position based on the outer shape of the part, so that the part data can be created efficiently.
  • the control unit acquires the external dimensions of the component including a plurality of three-dimensional electrodes, the arrangement information of the electrodes, and the dimensions of the electrodes based on an image obtained by imaging the component.
  • the component data can be obtained based on the imaging result of the imaging unit at the time of mounting the component, and therefore, the measurement error of the outer dimension of the component, the dimension of the electrode, and the arrangement of the electrode is suppressed. be able to.
  • a non-defective part is mistakenly determined as a non-defective part and discarded when the part is mounted.
  • a measuring instrument such as a vernier caliper
  • control unit is configured to perform control to discriminate between the electrode of the component and the noise by using the feature amount of the extracted portion of the image obtained by imaging the component. ing.
  • the control unit is configured to perform control to acquire electrode arrangement information of a component including a plurality of electrodes based on an image obtained by imaging the component, Of the electrodes, a portion that does not need to obtain the placement information is configured to be settable. According to this structure, it is possible to omit acquiring the electrode arrangement information of the unnecessary part, so that the component data can be created in a shorter time.
  • the display unit is configured to display information
  • the control unit is difficult to determine the electrode of the component based on the image obtained by imaging the component when it is difficult to determine It is comprised so that control which displays a part on a display part may be performed. According to this configuration, since the operator can input information of a difficult-to-identify portion, component data can be created with high accuracy.
  • a storage unit for storing component data is provided, and the control unit compares the created component data with the component data stored in the storage unit and can be rewritten If there is, it is configured to rewrite the created component data.
  • the component data creating method captures a component a plurality of times by the imaging unit under different imaging conditions, and creates component data for recognizing the component based on the image of the component captured by the imaging unit Do.
  • the component is imaged a plurality of times by the imaging unit under different imaging conditions, and the component is recognized based on the image of the component imaged by the imaging unit.
  • Create part data for even when not all feature points of the part are clearly displayed in the image by one imaging, the feature points of the part are clearly imaged by any of a plurality of images by imaging under a plurality of imaging conditions be able to.
  • the number of pieces of information of feature points that can be automatically acquired can be increased, so the number of pieces of information of feature points input by the operator can be reduced. Thereby, the occurrence of erroneous input can be suppressed.
  • FIG. 6 is a block diagram showing a control configuration of the component mounting apparatus according to the embodiment of the present invention. It is a schematic diagram for demonstrating a series of mounting operations of the component mounting apparatus by embodiment of this invention. It is a figure for demonstrating the illumination of the component mounting apparatus by embodiment of this invention. It is a figure for demonstrating the image processing in the case of component data creation by embodiment of this invention. It is a figure for demonstrating selection of the bump electrode at the time of component data creation by embodiment of this invention. It is a figure for demonstrating the process of the noise in the case of component data creation by embodiment of this invention.
  • the component mounting apparatus 100 takes out a component (semiconductor chip) C from the wafer W that has been diced and mounts it on the mounting surface of the substrate S, and also uses electronic components (so-called package components) supplied by the tape feeder 3a as the substrate S A so-called composite type component mounting apparatus that can be mounted on the mounting surface of
  • the component mounting apparatus 100 includes a base 1, a conveyor 2, two chip component supply units 3, two mounting units 4, a wafer holding table 5, and an ejection unit 6.
  • a component recognition camera 7, a fixed camera 8, a flux supply unit 9, a wafer storage unit 10, and a control unit 11 are provided.
  • the component mounting apparatus 100 further includes a display unit 12 as shown in FIG. Further, the component mounting apparatus 100 includes the illumination 81.
  • the illumination 81 includes main illumination 811, coaxial illumination 812, and side illumination 813.
  • the mounting unit 4 is an example of the “mounting head” in the claims
  • the fixed camera 8 is an example of the “imaging unit” in the claims.
  • the conveyor 2 is configured to carry in and out the substrate S to a predetermined mounting operation position. Further, the conveyor 2 includes a pair of conveyor rails extending in the X direction, and a positioning mechanism (not shown) for positioning the substrate S at a predetermined position. Thus, the conveyor 2 transports the substrate S in the X direction, and positions and fixes the substrate S at a predetermined mounting operation position.
  • the two chip component supply units 3 are provided at both ends on the front side (Y1 direction side) of the component mounting apparatus 100, respectively.
  • tape feeders 3a are arranged side by side along the X direction. Each tape feeder 3a intermittently delivers the carrier tape and supplies the electronic components in the carrier tape to a predetermined component supply position.
  • the mounting unit 4 is configured to mount the electronic component and the component C of the wafer W supplied from the chip component supply unit 3 on the substrate S. Specifically, the mounting unit 4 is supported movably in the horizontal direction (XY direction) above the conveyor 2 (substrate S) by the XY moving mechanism.
  • the mounting unit 4 has a plurality of (two) suction nozzles 4 a (see FIG. 3) disposed along the X direction.
  • the component C is, for example, a wafer level package (WLP) or a wafer level chip size package (WL-CSP).
  • the mounting unit 4 is configured to suction the component C taken out of the wafer W by the takeout unit 6 by the suction nozzle 4 a and mount the component C on the substrate S.
  • the mounting unit 4 is configured to suction the electronic components supplied by the tape feeder 3a by the suction nozzle 4a and mount the electronic component on the substrate S.
  • the wafer holding table 5 is configured to support the wafer W pulled out of the wafer storage unit 10 by a loading and unloading mechanism (not shown) at a predetermined position.
  • the takeout unit 6 is configured to take out the component C from the wafer W and deliver it to the mounting unit 4. Further, the takeout unit 6 is moved in the horizontal direction (XY direction) at a position above the wafer holding table 5 by a predetermined driving means.
  • the takeout unit 6 also includes four wafer heads 6a (see FIG. 3).
  • Wafer head 6a is configured to be rotatable around the X axis and capable of moving (lifting) in the vertical direction. Further, the wafer head 6 a is configured to be able to suction the component C. That is, the take-out unit 6 sucks the component C pushed up by the projection (not shown) with the wafer head 6a and takes it out, flips the component C (flip), and mounts the component 4 (suction It is configured to deliver the part C to the nozzle 4a).
  • the component recognition camera 7 is configured to pick up an image of the component C to be taken out prior to taking out the component C from the wafer W. Further, the component recognition camera 7 is provided in the same frame as the extraction unit 6. Further, the component recognition camera 7 is moved in the horizontal direction (XY direction) at a position above the wafer holding table 5 by a predetermined driving means.
  • the component recognition camera 7 is provided with illumination (not shown).
  • the illumination is configured to emit light during imaging by the component recognition camera 7.
  • the illumination has a light source such as an LED (light emitting diode).
  • the fixed camera 8 is installed on the base 1 and in the movable area of the mounting unit 4.
  • the fixed camera 8 is configured to capture an electronic component (including the component C) suctioned by the suction nozzle 4 a of the mounting unit 4 from the lower side.
  • the stationary camera 8 is provided with an illumination 81 as shown in FIGS. 2 and 4.
  • the illumination 81 is configured to emit light at the time of imaging by the fixed camera 8.
  • the illumination 81 includes a light source such as an LED (light emitting diode).
  • the illumination 81 is configured such that the main illumination 811, the coaxial illumination 812, and the side illumination 813 emit light according to the imaging method.
  • the main illumination 811 is configured to irradiate light obliquely with respect to the vertical direction (Z direction). Specifically, the main illumination 811 is disposed so as to surround the outside of the coaxial illumination 812. Further, the main illumination 811 is configured to emit light obliquely upward to the upper side.
  • the coaxial illumination 812 is configured to emit light coaxially with the optical axis of the fixed camera 8. That is, the coaxial illumination 812 is configured to emit light upward.
  • the side illumination 813 is configured to irradiate light to the component C from the side. That is, the side illumination 813 is configured to irradiate light from the side to the component C held by the suction nozzle 4a.
  • the illumination 81 can adjust the intensity of the light to be emitted. Specifically, the illumination 81 has its light intensity adjusted by PWM control (pulse width modulation control). Further, the illumination 81 is configured to be able to individually illuminate the main illumination 811, the coaxial illumination 812, and the side illumination 813 so as to emit light. Further, the illumination 81 is configured to be able to emit light by combining the main illumination 811, the coaxial illumination 812, and the side illumination 813. For example, illumination 81 is configured to emit light in combination with main illumination 811 and coaxial illumination 812.
  • PWM control pulse width modulation control
  • the flux supply unit 9 is provided to transfer (apply) the flux to the bump electrode B of the component C. Specifically, the flux supply unit 9 thins, spreads and supplies the flux thinly on the plate. Then, the component C adsorbed by the suction nozzle 4 a of the mounting unit 4 is brought into contact with the spread and spread flux. Thus, the flux is transferred to the bump electrode B of the component C. The flux is applied to the bump electrode B of the component C so that the wetting of the solder for bonding becomes good.
  • the wafer storage unit 10 is configured to be able to store a plurality of diced wafers W.
  • Component C of wafer W is, for example, a chip component for flip chip mounting on which a plurality of bump electrodes B are formed. That is, on the mounting surface of the component C, a plurality of three-dimensional electrodes protruding from the mounting surface are provided. In this case, the component C is stuck and held on a film-like wafer sheet so that the bump electrode formation surface (mounting surface) faces upward.
  • the control unit 11 is configured to integrally control the operation of each unit of the component mounting apparatus 100.
  • the control unit 11 includes the conveyor 2, the chip component supply unit 3, the mounting unit 4, the wafer holding table 5, the takeout unit 6, the component recognition camera 7, the fixed camera 8, the flux supply unit 9 and the wafer storage unit 10. And the like are configured to perform operation control.
  • the control unit 11 controls the operation of each unit based on an output signal from a position detection unit such as an encoder incorporated in the drive motor of each unit described above.
  • the control unit 11 has a function of performing imaging control and image recognition of various cameras (the component recognition camera 7 and the fixed camera 8).
  • the control unit 11 includes a CPU (central processing unit) 111 and a memory 112.
  • the memory 112 is an example of the “storage unit” in the claims.
  • the display unit 12 is configured to display information. Specifically, information for operating the component mounting apparatus 100 is displayed on the display unit 12. In addition, information indicating the state of the component mounting apparatus 100 is displayed on the display unit 12.
  • the component C to be mounted is taken out by the takeout unit 6, and the component C is held by suction on the wafer head 6a of the takeout unit 6.
  • Ru The wafer head 6a is rotated to flip the part C, and the part C is placed at a predetermined delivery position.
  • the suction nozzle 4a of the mounting unit 4 is lowered to the delivery height position above the delivery position, and the component C is attracted.
  • the mounting unit 4 After the component C is sucked, the mounting unit 4 is moved to above the flux supply unit 9. The suction nozzle 4 a of the mounting unit 4 is lowered to the transfer height position, and the flux is transferred (coated) onto the bump electrode formation surface of the component C. Thereafter, the mounting unit 4 is moved so as to pass above the fixed camera 8, and the bump electrode formation surface of the component C sucked by the suction nozzle 4a is imaged. Thereby, the defect determination of the bump electrode formation surface of the component C and the recognition of the suction position deviation are performed.
  • the transfer operation and the imaging operation may be reversed in order. That is, when the state before transfer can perform imaging (image recognition) better, the imaging operation is performed first.
  • the mounting unit 4 is moved above the substrate S held by the conveyor 2, and the suction nozzle 4a is lowered to a mounting height position above the predetermined mounting position, and the component C is placed on the substrate S (Implemented)
  • the mounting unit 4 is moved above the predetermined component removal position of the tape feeder 3a. Then, the suction nozzle 4a is lowered to take out the electronic component. Thereafter, the mounting unit 4 is moved so as to pass above the fixed camera 8, and the lower surface of the electronic component sucked by the suction nozzle 4a is imaged. Then, the mounting unit 4 is moved to the upper side of the substrate S. Thereafter, the suction nozzle 4a is lowered, and the electronic component is mounted (mounted) on the substrate S.
  • the component C is individually stored in the carrier tape and supplied from the tape feeder 3a, after the component C is taken out from the tape feeder 3a, transfer and imaging are performed as shown in FIG. The component C is placed (mounted) on the
  • control unit 11 is configured to perform control of creating component data for recognizing the component C based on the image of the component C captured by the fixed camera 8.
  • control unit 11 is configured to perform control of generating component data by causing the imaging unit to image the component C a plurality of times under different imaging conditions.
  • control unit 11 is configured to perform control to create component data by causing the stationary camera 8 to image the component C a plurality of times by changing the irradiation condition of light by the illumination 81.
  • control unit 11 is configured to perform control to create component data by causing the stationary camera 8 to image the component C a plurality of times with different irradiation directions of light to the component C.
  • the control unit 11 applies the light to the part C from below to pick up the part C, and the part C on the basis of the image obtained by irradiating the light from the side to pick up the part C. It is configured to perform control to create data.
  • the control unit 11 emits light by combining the main illumination 811 and the coaxial illumination 812 to generate an image of the component C, and the image of emitting the light from the side illumination 813 to image the component C. , Is configured to create part data.
  • control unit 11 acquires the outer shape of the part C based on the image of the part C imaged under the first imaging condition, and based on the image of the part C imaged according to the second imaging condition different from the first imaging condition. Control for acquiring the arrangement information of the electrode of the part C. Under the first imaging condition, the component C is irradiated with light from below and imaged. In addition, in the second imaging condition, light is emitted to the part C from the side and taken.
  • control unit 11 is configured to perform control of imaging the component C under the second imaging condition after imaging the component C under the first imaging condition. That is, after acquiring the outer shape of the part C based on the result of imaging under the first imaging condition, the control unit 11 acquires the electrode layout information of the part C based on the result of imaging under the second imaging condition Is configured as.
  • the control unit 11 causes the component C to be imaged a plurality of times by the fixed camera 8 by changing the amount of light emitted from the illumination 81 to the component C, and acquires the amount of light suitable for imaging based on the imaged image It is configured to perform control. For example, when the number of bumps and the diameter of the bumps are known or when they can be easily extracted, the illuminance with which the bumps can be easily seen is automatically determined.
  • the component C is imaged at a plurality of different illumination levels, and the bumps are extracted based on the acquired image to determine the number of bumps, the diameter of the bumps, and the like. Then, the illumination level at which the measurement result closest to the known value is obtained is acquired as the appropriate illuminance of the part. Bump coordinate data creation and component recognition at the time of actual production are performed using this illuminance.
  • the control unit 11 is configured to perform control to acquire the outer dimensions of the part C including a plurality of three-dimensional electrodes, the arrangement information of the electrodes, and the dimensions of the electrodes based on an image obtained by capturing the part C.
  • the control unit 11 is configured to perform control to discriminate between the electrode of the part C and the noise by using the feature amount of the extraction portion of the image obtained by capturing the part C.
  • expansion / contraction processing is performed on a portion of an image based on a captured image.
  • binary analysis after performing binarization processing based on a captured image, expansion / contraction processing is performed on a part of the image. This makes it possible to remove minute noise components. Thereafter, contour tracking is performed to calculate feature amounts.
  • the feature amount is, for example, an area, a diameter conversion value in which the area is an equivalent area circle, a peripheral length, a diameter conversion value in which the peripheral length is an equivalent circle peripheral length, an included circle diameter (diameter of circumscribed circle), major axis / minor axis, Roundness (difference between maximum radius and minimum radius), roundness, horizontal-vertical fillet diameter, arithmetic moment, etc. are included. It is possible to automatically remove noise by distortion and size of the shape assuming that the shape of the bump electrode B is circular using the result of calculating the feature amount. For example, if the circle is greatly distorted, it is removed as noise. In this case, the operator can confirm whether the removal should be performed.
  • the control unit 11 is configured to perform control to acquire the arrangement information of the electrodes of the part C including the plurality of electrodes based on the image obtained by imaging the part C.
  • the component mounting apparatus 100 is configured to be able to set a portion of the plurality of electrodes that does not need to obtain the placement information.
  • the bump information acquisition unnecessary portion is set in advance and excluded from the image analysis. For example, the operator selects and eliminates the bump information acquisition unnecessary portion by the mouse operation.
  • the bump information acquisition unnecessary portion is a portion unnecessary for the quality determination of the part C. In the example of FIG. 6, the information on the upper left plural bump groups is excluded as unnecessary.
  • the control unit 11 is configured to perform control to display a difficult-to-determine part on the display unit 12 when it is difficult to determine the electrode of the part C based on an image obtained by capturing the part C.
  • a guide 201 a is attached to the bump electrode B in which the electrodes can be determined.
  • a guide 201 b is attached to a portion where the determination of the electrode is difficult.
  • the measurement information is overlaid on the part image, and the guide 201b is attached to the location where the distortion is observed in the shape.
  • the guides 201a and 201b are displayed in an identifiable manner to the operator.
  • the guides 201a and 201b are displayed in different colors, shapes, display methods (such as blinking display), and the like.
  • the bump diameter and distortion are determined by the distribution based on the statistics of a plurality of extraction points. The operator performs bump / noise determination separately on the portion shown with the guide 201b.
  • the state of the setting candidate is overlaid on the component image and attached to the size display 202a, 202b or 202c to indicate it to the operator.
  • the operator compares the size displays 202a to 202c with the extracted portion on the image to select and determine the bump diameter. If the diameter of the design value does not match the diameter on the image, component data is created according to the diameter on the image. That is, when the component C is mounted, component data is created so as to fit the image that is actually captured.
  • the part where the part C is likely to be reflected and the part where it is difficult to be reflected are different.
  • the image on the part C is imaged when the image is captured by the main illumination 811 and the coaxial illumination 812 of FIG. Reflected.
  • the side illumination 813 of (D) the mark on the part C is not reflected. That is, it switches to a lighting condition that makes it easy to distinguish between a portion to be viewed and a portion not to be viewed, and acquires a plurality of component images.
  • imaging is performed using the main illumination 811 and the coaxial illumination 812 where the outline part is most visible. Further, when it is desired to acquire the position of the bump, imaging is performed using the side illumination 813 in which the bump can be seen without reflection of the outer shape, the mark, the pattern, and the like. That is, since the bumps are arranged to protrude with respect to the mounting surface of the component C, it is possible to clearly pick up an image even when light is applied from the side.
  • the plurality of bumps are recognized in groups. For example, groups that are all necessary electrodes, grounding electrodes, etc. may be divided into groups that may have a predetermined number or more, coupling reinforcing electrodes, etc., and groups that are not particularly needed.
  • the control unit 11 changes the recognition number and the missing number threshold value for each group, recognizes bumps, and creates component data.
  • the created component data is stored in the memory 112.
  • the control unit 11 is configured to compare the created component data with the component data stored in the memory 112, and rewrite the created component data if the data can be rewritten. That is, redundant storage of component data in the memory 112 is suppressed.
  • Parts data creation process With reference to FIG. 10, component data creation processing by the control unit 11 of the component mounting apparatus 100 will be described based on a flowchart.
  • step S1 of FIG. 10 the first imaging by the fixed camera 8 is performed. Specifically, the component C sucked by the suction nozzle 4 a is positioned above the fixed camera 8, and imaging of the component C is performed. In step S2, the suction shift angle, the external dimensions of the part, and the part center position are calculated.
  • step S3 the calculation result is displayed on the display unit 12. Based on the display on the display unit 12, the operator makes fine adjustments to the result as needed.
  • step S4 the part C is rotated by the shift angle. Specifically, the suction nozzle 4a is rotated in the opposite direction by the amount of the angle deviation.
  • step S5 the second imaging by the fixed camera 8 is performed. At this time, the component C is imaged under an imaging condition different from that of the first imaging.
  • step S6 bumps are extracted from the captured image. Specifically, the bump position and the bump diameter are extracted from the image.
  • step S7 the extracted bumps are displayed on the display unit 12. Based on the display on the display unit 12, the operator makes fine adjustments to the result as needed. Specifically, the operator performs an operation of deleting a bump not required for production check, an erroneously created bump, and a portion where noise can not be determined. In addition, an appropriate bump diameter selection operation is performed by the operator. In step S8, it is determined whether there is a change in bump diameter. If there is a change, the process proceeds to step S9. If there is no change, the process proceeds to step S10.
  • step S9 the bumps are extracted again.
  • bump diameter data is again created according to the selected bump diameter.
  • step S10 existing similar data is confirmed. That is, it is checked whether there is data similar to the created component data on the database.
  • step S11 it is determined whether there is similar data. If similar data is present, the process proceeds to step S12. If similar data is not present, the process proceeds to step S14.
  • step S12 it is determined whether there is a data replacement instruction. That is, it is determined whether or not there is an instruction by the operator to replace and store new data with respect to similar data. If there is a replacement instruction, the data is replaced in step S13, and the process proceeds to step S14. If there is no replacement instruction, the process proceeds to step S14.
  • step S14 bump group setting is accepted. Thereafter, the component data creation process is ended.
  • control unit 11 is configured to perform control of generating component data by causing the fixed camera 8 to image the component C a plurality of times under different imaging conditions.
  • the feature points of the part C are made clearer by any of the plurality of images by imaging under a plurality of imaging conditions. It can be imaged.
  • the number of pieces of information of feature points that can be automatically acquired can be increased, so the number of pieces of information of feature points input by the operator can be reduced.
  • the occurrence of erroneous input can be suppressed.
  • control unit 11 performs control to create component data by causing the component C to be imaged a plurality of times by the fixed camera 8 with different irradiation conditions of light by the illumination 81.
  • the control unit 11 performs control to create component data by causing the component C to be imaged a plurality of times by the fixed camera 8 with different irradiation conditions of light by the illumination 81.
  • the control unit 11 controls the production of the component data by causing the component C to be imaged a plurality of times by the fixed camera 8 while making the irradiation direction of light to the component C different.
  • the component C having a feature point whose light reflection direction changes depending on the light irradiation direction can be imaged under a plurality of irradiation conditions in which the light irradiation direction is changed, so that the feature point of the component C is recognized.
  • the number of things that can be done can be increased more effectively.
  • the control unit 11 causes the component C to be imaged a plurality of times by the fixed camera 8 with different amounts of light emitted from the illumination 81 to the component C. Control to obtain an amount of light suitable for imaging. As a result, the amount of light at the time of photographing to recognize the component C can be optimized, so that the recognition accuracy of the component C at the time of component mounting on the substrate S can be improved.
  • the control unit 11 irradiates the component C with light from below to image the component C and the component C with light from the side. It is configured to perform control to create component data based on an image obtained by capturing the component C.
  • the outer shape of the part C can be easily recognized based on the image captured by irradiating the part C with light from below, and the lower part of the part C is irradiated with light from the side.
  • the positions of the plurality of bump electrodes B protruding to the top can be easily recognized.
  • control unit 11 acquires the outer shape of the part C based on the image of the part C captured under the first imaging condition, and the second imaging different from the first imaging condition It is configured to perform control to acquire the arrangement information of the electrode of the part C based on the image of the part C captured according to the condition.
  • component data is easily and accurately created from an image captured under the first imaging condition in which the external shape of the component C is clearly visible and an image captured under the second imaging condition in which the electrode of the component C is clearly visible. can do.
  • the control unit 11 is configured to perform control of imaging the component C under the second imaging condition.
  • the positions of the electrodes can be associated with the reference position based on the outer shape of the part C and thus acquired, so that the part data can be created efficiently.
  • the controller 11 controls the external dimensions of the part C including the plurality of three-dimensional electrodes, the arrangement information of the electrodes, and the dimensions of the electrodes based on the image obtained by imaging the part C. Configure to perform control to acquire.
  • component data can be acquired based on the imaging result of fixed camera 8 at the time of mounting component C, it is possible to suppress the measurement error of the external dimension of component C, the dimension of the electrode, and the arrangement of the electrodes. Can.
  • a measuring instrument such as a vernier caliper
  • control unit 11 is configured to perform control to determine the electrode of the part C and noise using the feature amount of the extracted portion of the image obtained by capturing the part C. Do. As a result, it is possible to suppress the mixing of noise into component data. Further, since the mixing of noise can be suppressed, the checking operation can be performed in a short time even when the operator needs to check.
  • control unit 11 is configured to perform control to acquire the electrode arrangement information of the component C including the plurality of electrodes based on the image obtained by imaging the component C.
  • the electrodes of the above a portion which does not need to obtain the arrangement information is configured to be settable. As a result, it is possible to omit acquisition of arrangement information of electrodes of unnecessary portions, so that component data can be created in a shorter time.
  • the control unit 11 displays the part that is difficult to determine on the display unit 12 Configure to perform control.
  • the operator can input information on difficult-to-identify portions, component data can be created with high accuracy.
  • control unit 11 compares the created component data with the component data stored in the memory 112, and rewrites the created component data when it can be rewritten. Configure to Thus, duplication of component data can be suppressed, and data management can be easily performed.
  • the present invention is not limited to this.
  • the present invention may be applied to a component mounting apparatus which mounts a component supplied by a tape or tray on a substrate.
  • the lead component may be imaged to create component data of the lead component as component data.
  • components when component data is created, an example of a configuration in which components are imaged under two different imaging conditions is shown, but the present invention is not limited to this.
  • components may be imaged according to three or more different imaging conditions, and component data may be created based on the respective imaging results.
  • the present invention is not limited to this.
  • the imaging of the component may be performed with different conditions such as the imaging position and the imaging direction.
  • component data may be created using known data in addition to an image obtained by capturing a component.
  • the processing of the control unit has been described using a flow-driven flow that sequentially performs processing along the processing flow, but the present invention is not limited to this.
  • the processing of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events.
  • the operation may be completely event driven, or the combination of event driving and flow driving may be performed.
  • Mounting unit (mounting head) 8 Fixed Camera (Imaging Unit) 11 control unit 12 display unit 81 lighting 112 memory (storage unit) 12 bump electrode C component S substrate

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif de montage de composant (100) qui comprend : une tête de montage (4) pour monter un composant (C) sur un substrat (S) ; une unité d'imagerie (8) qui peut imager un composant ; et une unité de commande (11) qui crée des données de composant qui sont destinées à reconnaître le composant, les données étant créées sur la base de l'image du composant qui a été imagé par l'unité d'imagerie. L'unité de commande est configurée de façon à effectuer une commande dans laquelle des données de composant sont créées en amenant l'unité d'imagerie à imager le composant plusieurs fois dans différentes conditions d'imagerie.
PCT/JP2017/023376 2017-06-26 2017-06-26 Dispositif de montage de composant et procédé de création de données de composant Ceased WO2019003267A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019526402A JP6831460B2 (ja) 2017-06-26 2017-06-26 部品実装装置および部品データ作成方法
PCT/JP2017/023376 WO2019003267A1 (fr) 2017-06-26 2017-06-26 Dispositif de montage de composant et procédé de création de données de composant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/023376 WO2019003267A1 (fr) 2017-06-26 2017-06-26 Dispositif de montage de composant et procédé de création de données de composant

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WO2019003267A1 true WO2019003267A1 (fr) 2019-01-03

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JPH05296725A (ja) * 1992-04-24 1993-11-09 Matsushita Electric Ind Co Ltd 位置検出方法
JPH0738294A (ja) * 1993-07-26 1995-02-07 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2001135999A (ja) * 1999-11-09 2001-05-18 Matsushita Electric Ind Co Ltd 部品ライブラリの作成方法および作成装置
JP2002110745A (ja) * 2000-09-27 2002-04-12 Yamaha Motor Co Ltd 部品認識制御方法及び部品認識制御装置
JP2005005619A (ja) * 2003-06-13 2005-01-06 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープの検査装置およびパターン不良の確認方法
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JP2005123352A (ja) * 2003-10-16 2005-05-12 Juki Corp 部品データ生成装置及び電子部品実装装置
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WO2014049873A1 (fr) * 2012-09-28 2014-04-03 富士機械製造株式会社 Dispositif de correction de données de traitement d'image et procédé de correction de données de traitement d'image

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022061872A (ja) * 2020-10-07 2022-04-19 株式会社Fuji 部品実装機
JP7602886B2 (ja) 2020-10-07 2024-12-19 株式会社Fuji 部品実装機

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