JP2010093185A - Lamp, and method of manufacturing lamp - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamp that can have reflection luminance in a non-illumination mode made low without lowering luminance in an illumination mode, and have a sufficiently high illumination/non-illumination contrast ratio, and to provide a method of manufacturing the same. <P>SOLUTION: The lamp 1 includes a light emitting element 5, a package molding 2 having a recessed portion 21 for storing the light emitting element 5 formed on an upper surface 23 being a light emission observation surface, a cathode mark 3 having a side portion 31 exposed to the side of a side surface 22 of the package molding 2 and a floor portion 32 exposed to the side of the upper surface 23 by continuously cutting part of the side surface 22 and part of the upper surface 23, and a mold material for sealing the light emitting element 5 stored in the recessed portion 21, the upper surface 23 of the package molding 2 and the wall portion 31 and floor portion 32 of the cathode mark 3 being a low-reflection-factor part having a lower reflection factor than an internal surface of the recessed portion 21. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a lamp used for a display, a backlight light source, a light sensor, various indicators, and the like, and a method for manufacturing the lamp.

  In recent years, R, G, and B ultra-high brightness semiconductor light emitting devices have been developed, and as light emitting devices that constitute lamps used in displays, backlight sources, various light sensors, indicators, etc. that can emit light in full color indoors or outdoors. It is starting to be used.

As a lamp using such a light emitting element, for example, there is a surface mount type light emitting diode (hereinafter also referred to as “LED”). In general, a surface-mount type LED has an LED element (light-emitting element) bonded to the bottom surface of a recess formed in a package molded body, and the electrode of the LED element and a lead electrode are electrically connected by a conductive material such as a wire. Thereafter, it is manufactured by sealing with a mold material having translucency.
The LED element constituting the LED emits light not only from the top surface but also from the side surface and the bottom surface. For this reason, conventionally, the reflectance in the concave portion of the package molded body is increased, and the light emitted from the side surface and the bottom surface of the LED element disposed in the concave portion is reflected in the concave portion so that it can be efficiently used. Thus, a technique for improving the luminous efficiency of the LED is used.

In addition, an LED used as a light source for a display or an optical sensor has a contrast ratio that is a ratio of luminance when light is emitted (when lit) and reflected luminance (dark luminance) when light is not emitted (when not lit). Is preferably large. As a technique for increasing the contrast ratio of the LED, a method of forming a light absorption layer on the light emission observation surface side surface of the package molded body excluding the light emitting portion by using a screen printing method or a hot stamping method (Patent Document 1) There is. In addition, as a technique for increasing the contrast ratio of the LED, there is a method of increasing the contrast ratio by lowering the reflection luminance when not lit by molding a package molding using a material in which a black pigment is dispersed. .
In general, a step called a cathode mark is formed at the cathode-side corner portion of the surface-mount type package in order to distinguish between P-type and N-type.
Japanese Patent No. 3613041

However, when the technique described in Patent Document 1 is used, reflection at the cathode mark at the time of non-lighting cannot be prevented, and the reflection luminance at the time of non-lighting cannot be sufficiently lowered, so that it is sufficiently high. A contrast ratio could not be obtained.
In addition, when a package molded body is molded using a material in which a black pigment is dispersed, the reflection luminance when not lit can be lowered, but the inside of the concave portion of the package molded body on which the LED element is mounted can also be reduced. Since the reflectance is low, the luminance at the time of lighting is lowered.

The present invention has been made in view of the above problems, and can reduce the reflected luminance when not lit without lowering the luminance when lit, and a sufficiently high contrast ratio between when lit and when not lit. An object of the present invention is to provide a lamp capable of obtaining the above.
It is another object of the present invention to provide a lamp manufacturing method capable of manufacturing a lamp capable of obtaining a high contrast ratio between lighting and non-lighting.

As a result of intensive studies to solve the above problems, the present inventor has completed the present invention. That is, the present invention relates to the following.
(1) A light emitting element, a package molded body in which a recess for accommodating the light emitting element is formed on the upper surface which is a light emission observation surface, a part of the side surface of the package molded body and a part of the upper surface are continuous. And a cathode mark formed with a wall portion exposed on the side surface side and a floor portion exposed on the upper surface side, and a molding material for sealing the light emitting element accommodated in the recess portion. The upper surface of the molded package, the wall portion and the floor portion of the cathode mark are low-reflectance portions having a lower reflectance than the inner surface of the concave portion. lamp.
(2) The lamp according to (1), wherein the low reflectance part is colored dark.

  (3) A package molded body in which a recess for accommodating the light emitting element is formed on the upper surface which is a light emission observation surface, and a part of the side surface of the package molded body and a part of the upper surface are continuously cut off. A lamp manufacturing method comprising at least a cathode mark formed with a wall portion exposed on the side surface side and a floor portion exposed on the upper surface side, the upper surface of the package molded body, A coloring step of coloring the wall portion and the floor portion of the cathode mark so as to be darker than an inner surface of the concave portion, a mounting step of mounting the light emitting element in the concave portion, and the light emitting element with a molding material A lamp manufacturing method comprising: a sealing step for sealing.

(4) The method for manufacturing a lamp according to (3), wherein in the coloring step, coloring is performed using a screen printing method.
(5) An installation step of installing the package molding body in a fixing frame for fixing the package molding body before the coloring step is provided, and in the installation step, the upper surface and the fixing of the package molding body are fixed. The method of manufacturing a lamp according to (4), wherein the package molded body is installed so that a deviation in a height direction from the upper surface of the frame is 1 mm or less.
(6) The method for manufacturing a lamp according to (4), wherein the screen printing method includes a step of moving a squeegee from a position away from the cathode mark toward the cathode mark.
(7) The method for manufacturing a lamp according to any one of (3) to (6), wherein the coloring step is performed before the mounting step.
(8) The method for manufacturing a lamp according to any one of (3) to (6), wherein the coloring step is performed after the sealing step.

  According to the lamp of the present invention, the upper surface of the package molded body and the wall portion and floor portion of the cathode mark are the low reflectance portion having a lower reflectance than the inner surface of the concave portion. It is possible to prevent reflection on the upper surface of the molded package and the cathode mark. Therefore, the lamp of the present invention can provide a sufficiently high contrast ratio between lighting and non-lighting, and is preferable to have excellent performance when used for a light source of a display or an optical sensor.

  The lamp manufacturing method of the present invention includes a coloring step of coloring the upper surface of the package molded body and the wall and floor of the cathode mark so as to be darker than the inner surface of the recess. Reflection on the upper surface of the molded package and the cathode mark during lighting can be prevented, and a lamp having a sufficiently high contrast ratio between lighting and non-lighting can be obtained.

Hereinafter, the lamp of the present invention and the manufacturing method thereof will be described in detail.
FIG. 1 is a schematic plan view schematically showing an example of the lamp of the present invention. 2 is a side view of the lamp shown in FIG. 1 viewed from the lower side in FIG. 1, and FIG. 3 is a side view of the lamp shown in FIG. 1 viewed from the left side in FIG.
1-3, the code | symbol 1 has shown the lamp | ramp. As shown in FIGS. 1 to 3, the lamp 1 includes a substrate 6 made of copper or the like, a package molded body 2 disposed on the substrate 6, three LED elements 5a, 5b, 5c (light emitting elements), In order to electrically connect the three LED elements 5a, 5b, and 5c to the outside of the lamp 1, three pairs of lead electrodes 4 provided on the substrate 6 are provided.

  As shown in FIG. 1, a recess 21 for accommodating the LED element 5 is formed on the upper surface 23 that is a light emission observation surface of the package molded body 2. The shape of the recess 21 is a mortar shape having a substantially rectangular shape in plan view. Three pairs of lead electrodes 4 are exposed at the bottom 21 a of the recess 21 of the package molded body 2 and the side and lower surfaces of the substrate 6. The number of lead electrodes 4 is not particularly limited, and is a number corresponding to the number of LED elements 5 accommodated in the recesses 21. The lead electrode 4 is preferably excellent in electrical conductivity. Specifically, the lead electrode 4 is plated with a noble metal such as Au or Ag on a base metal such as Cu, Cu-based alloy, Fe-based alloy, or Ni. What formed the layer etc. can be used conveniently. By providing a noble metal plating layer on the surface of the lead electrode 4, light emitted from the bottom surface of the LED element 5 can be reflected by the surface of the lead electrode 4, and the light emitted from the LED element 5 can be efficiently used. Can be used well.

  As the package molding 2, for example, a thermoplastic resin such as polyamide, liquid crystal polymer, polycarbonate, polyphenylene sulfide, polybutylene terephthalate, a thermosetting resin such as epoxy resin or pozzoimide, or a ceramic is used. In the present embodiment, the material constituting the package molded body 2 described above is mixed with a white filler such as titanium oxide or zinc oxide to whiten the package molded body 2, so that the inside of the recess 21 of the package molded body 2 Those with improved reflectivity are used.

  In the present embodiment, the cathode mark 3 is formed at one of the four corners of the upper surface 23 of the package molded body 2. The cathode mark 3 is formed by cutting a part of the side surface 22 and a part of the upper surface 23 of the package molded body 2 to expose a wall portion 31 exposed on the side surface 22 side of the package molded body 2 and a floor portion exposed on the upper surface 23 side. 32.

  In the present embodiment, as shown in FIGS. 1 to 3, a part of the side surface 22 and the upper surface 23 of the molded molded body 2, and the wall portion 31 and the floor portion 32 of the cathode mark 3 are colored in a dark color. Thus, the reflectance is lower than that of the inner surface of the recessed portion 21 of the white molded package 2. The color of the low reflectivity portion may be a dark color that can make the reflectivity lower than the inner surface of the recess 21, but the closer the color is to black, the higher the contrast ratio between lighting and non-lighting. Therefore, it is preferable.

  As shown in FIG. 1, the LED element 5 is bonded to the bottom 21 a of the recess 21 using a die bond agent such as silver paste. The number, color, type, and the like of the LED elements 5 are not particularly limited, and can be determined according to the use of the lamp. As the LED element 5, for example, a semiconductor such as InN, AlN, GaN, AlGaN, InGaN, AlInGaN, GaP, GaAs, AlInGaP, ZnSe, and SiC is formed as a light emitting layer on the substrate by MOCVD method, liquid phase method, etc. A material in which an electrode is formed by vapor deposition, CVD, sputtering, or the like is preferably used.

  In the present embodiment, in order to obtain a lamp capable of emitting light in full color, the LED element 5 includes three LED elements 5a, 5b, and 5c of red, blue, and green as shown in FIG. Each of the LED elements 5a, 5b, and 5c is provided with electrodes. As shown in FIG. 1, the electrodes formed on the LED elements 5a, 5b, and 5c and the three pairs of lead electrodes 4 are Au The wires 7 are electrically connected to each other.

  Further, the recess 21 of the package molded body 2 is filled with a molding material (not shown) for sealing the LED element 5 accommodated in the recess 21. As the molding material, a material that can protect the LED element 5, has high insulating properties, and has excellent translucency is preferably used. Specifically, it is preferable to use a translucent resin made of epoxy, silicone, modified acrylic or the like as the molding material. In addition, the resin constituting the molding material is converted into a colorant that cuts light from the LED element 5 and light to the LED element 5 as desired, a diffusing material that diffuses light, and further converted into desired light. A fluorescent substance etc. can be contained.

Next, a method for manufacturing the lamp 1 shown in FIGS. 1 to 3 will be described.
In the present embodiment, a case will be described as an example where each of the coloring process, the mounting process, and the sealing process is performed in a state where a plurality of package molded bodies 2 are arranged on a lead frame (not shown).
To manufacture the lamp 1 shown in FIGS. 1 to 3, first, on a plurality of substrates 6 (only one is shown in FIG. 4) on which three pairs of lead electrodes 4 of a lead frame (not shown) are formed. Then, the molded molded body 2 shown in FIG. 4 having the recessed portion 21 where the lead electrode 4 is exposed on the upper surface 23 and the cathode mark 3 on the edge is formed by injection molding or the like (FIG. 4).

Next, by mounting a fixed frame 8 for fixing the package molded body 2 shown in FIG. 4 on a lead frame (not shown) in which a plurality of package molded bodies 2 are arranged, the package molded body is fixed in the fixed frame 8. 2 is installed (installation process).
In the installation step, the package molded body 2 is installed such that the height deviation between the upper surface 23 of the package molded body 2 and the upper surface 8a of the fixed frame 8 is preferably 1 mm or less, more preferably 0.1 mm or less. To do. When the upper surface 8a of the fixed frame 8 is higher than the upper surface 23 of the package molded body 2 and the deviation in the height direction between the upper surface 8a of the fixed frame 8 and the upper surface 23 of the package molded body 2 exceeds 1 mm, When the squeegee is slid, the squeegee may not move smoothly and printing may become unstable or the screen plate may be torn. Further, when the upper surface 8a of the fixed frame 8 is lower than the upper surface 23 of the package molded body 2 and the height deviation between the upper surface 8a of the fixed frame 8 and the upper surface 23 of the package molded body 2 exceeds 1 mm, coloring described later Ink transfer may be insufficient in the process.

  Moreover, it is preferable that the space | interval d of the side surface 22 of the package molding 2 and the inner surface 8b of the fixed frame 8 is the range of 0.05 mm-1 mm. When the distance d is less than 0.05 mm, the ink permeation into the side surface 22 of the package molded body 2 is reduced, and the side surface 22 of the package molded body 2 is hardly colored, or the package molded body 2 is placed in the fixed frame 8. May be difficult to install. If the distance d exceeds 1 mm, the package molded body 2 installed in the fixed frame 8 is not sufficiently fixed, and the package molded body 2 moves during the coloring process, so that the coloring process is performed stably. It may not be possible.

Next, at least the side surface 22 of the package molded body 2 serving as the low reflectance portion is arranged so that the portion serving as the low reflectance portion in the package molded body 2 installed in the fixed frame 8 is darker than the inner surface of the recess 21. Part, the upper surface 23, and the wall portion 31 and floor portion 32 of the cathode mark 3 are colored black using a screen printing method (coloring step).
In order to color at least a part of the side surface 22 of the package molded body 2, the upper surface 23, and the wall portion 31 and the floor portion 32 of the cathode mark 3 in black using the screen printing method, first, in the fixed frame 8 The package molded body 2 installed on the screen is set in a screen printer, and the plate frame with the screen ridges and the package molded body 2 are aligned. Thereafter, the screen ridge pattern is filled with black ink by using a scraper, and the squeegee is slid to transfer the pattern to a portion to be a low reflectance portion of the package molded body 2.

  In addition, it is preferable to color the portion that becomes the low reflectance portion in the screen printing method by moving the squeegee from the position away from the cathode mark 3 toward the cathode mark 3. More specifically, the direction in which the squeegee is moved can be the direction from the side without the cathode mark 3 toward the side with the cathode mark 3, for example, the direction from the left side to the right side in FIG. The direction to the side, the direction from diagonally upper left to diagonally lower right, etc. are mentioned.

  In addition, printing conditions such as squeegee pressure and printing speed in the screen printing method can be determined as appropriate according to the type of ink and the material of the package molded body 2, but the package is molded by fully pressing the ink under the screen cage. In order to color not only the upper surface 23 of the body 2 but also at least a part of the side surface 22 of the package molded body 2 and the wall portion 31 and the floor portion 32 of the cathode mark 3, it is preferable to reduce the printing speed. Specifically, the printing speed is preferably in the range of 20 mm / sec to 100 mm / sec. By setting the printing speed within the above range, at least a part of the side surface 22 of the package molded body 2 and the wall portion 31 and the floor portion 32 of the cathode mark 3 can be easily and reliably colored. Moreover, when the attack angle is in the range of 40 ° to 25 °, it is preferable because the ink can be effectively pushed in during screen printing.

The screen wrinkles used in the present embodiment may be anything as long as they are used for screen printing, and those made of silk, polyester, polyamide, stainless steel, etc. can be used.
Further, the pattern of the screen ridge is to mask a region that does not become the low reflectance portion by using a portion that becomes the low reflectance portion of the package molded body 2 as a screen hole. In the pattern of the screen ridge, the portion that becomes the low reflectance portion of the package molded body 2 and the screen hole may be the same size, or the screen hole is made larger than the portion that becomes the low reflectance portion of the package molded body 2. You may enlarge it. If the screen hole is made larger toward the outside than the portion that becomes the low reflectance portion of the package molded body 2, the side surface 22 of the package molded body 2 can be easily colored, which is preferable. However, if the screen hole is too large when the screen hole is made larger than the part that becomes the low reflectance part of the package molded body 2, the ink wraps around the back side of the screen ridge in the part that functions as a mask, resulting in a low reflectance. There is a risk that a region that does not become a part is colored. For this reason, when making a screen hole larger than the part used as the low-reflectance part of the package molding 2, the shift | offset | difference at the time of planarly viewing the low-reflectance part and screen hole of the package molding 2 is 0.1 mm or less It is preferable to do so.

  The type of ink used in the present embodiment is used for screen printing, and is not particularly limited as long as it is dark, and UV ink, evaporative drying ink, thermosetting ink, and the like are preferably used. Among these inks, since the pot life is long, it is preferable to use a UV ink that can make it almost unnecessary to change the conditions during printing. As the pigment used in the ink, carbon black having high light heat resistance and excellent hiding power is preferably used. Further, when manufacturing a lamp that can be used outdoors, it is preferable to use an ink having high light and heat resistance.

After the coloring step is completed, the LED element 5 is mounted in the recess 21 of the package molded body 2 (mounting step). In the mounting process, first, the LED element 5 is bonded to the bottom 21a of the recess 21 using a die bond agent such as silver paste. Thereafter, the electrode of the LED element 5 and the lead electrode 4 are electrically connected using a wire 7 made of Au or the like.
After the mounting process is completed, the LED element 5 is sealed by botting a molding material in the recess 21 (sealing process).

In the lamp 1 of this embodiment, the upper surface 23 of the package molded body 2 and the wall portion 31 and the floor portion 32 of the cathode mark 3 are low in reflectance and lower than the inner surface of the recess 21 for housing the LED element 5. Since it is a reflectance part, reflection on the wall 31 and floor 32 of the cathode mark 3 when not lit can be prevented, and the reflected brightness when not lit can be lowered, and the brightness when lit can be reduced. Without lowering, a sufficiently high contrast ratio between lighting and non-lighting can be obtained.
Further, in the lamp 1 of the present embodiment, a part of the side surface 22 of the package molded body 2 is a low reflectance part, so that reflection on the side surface 22 of the package molded body 2 during non-lighting is prevented and The reflected luminance at the time of lighting can be lowered, and an even higher contrast ratio can be obtained.

  Further, in the lamp 1 of the present embodiment, the low reflectance portion including at least a part of the side surface 22 of the package molded body 2, the upper surface 23, the wall portion 31 and the floor portion 32 of the cathode mark 3 is colored in a dark color. Therefore, it is possible to reduce the reflection luminance when not lit without reducing the luminance when lit as in the case of molding a molded package using a material in which a black pigment is dispersed. it can.

Further, in the manufacturing method of the lamp 1 of the present embodiment, the upper surface 23 of the package molded body 2, the wall portion 31 and the floor portion 32 of the cathode mark 3 are arranged more than the inner surface of the recess 21 for housing the LED element 5. Since there is a coloring step for coloring so as to be dark, reflection on the wall 31 and floor 32 of the cathode mark 3 when not lit can be prevented, and when the lighting is sufficiently high and when not lit Can be manufactured.
Moreover, in the manufacturing method of the lamp 1 of the present embodiment, in the coloring step, a part of the side surface 22 of the package molded body 2 is colored so as to be darker than the inner surface of the recess 21. Reflection on the side surface 22 of the body 2 can be prevented, and the lamp 1 having an even higher contrast ratio can be manufactured.

Further, in the manufacturing method of the lamp 1 of the present embodiment, in the coloring process, the printing speed is slowed so that the ink drips on the wall portion 31 and the floor portion 32 of the cathode mark 3 under the screen basket. The wall portion 31 and the floor portion 32 of the cathode mark 3 can be colored using a printing method.
Therefore, in the manufacturing method of the lamp 1 according to the present embodiment, not only the upper surface 23 of the package molded body 2 but also at least a part of the side surface 22 of the package molded body 2 or the wall portion 31 of the cathode mark 3 using screen printing. And the lamp | ramp 1 with which the floor part 32 was colored can be manufactured easily and reliably efficiently.

  On the other hand, in the conventional screen printing method, when the surface has irregularities, only the convex portions can be painted, so that it is difficult to color the steps constituting the cathode mark. Further, when a hot stamp is used, it is difficult to color the step portion because the film cannot be pressed against the step formed on the surface. Therefore, in the conventional screen printing method and hot stamping method, it is difficult to color the cathode mark, and it is difficult to manufacture a lamp capable of obtaining a sufficient contrast ratio.

  In addition, since the screen printing method in the manufacturing method of the lamp 1 according to the present embodiment includes the step of moving the squeegee from the position away from the cathode mark 3 toward the cathode mark 3, the screen cage disposed on the cathode mark 3 The ink can be sufficiently pushed down, and the wall portion 31 and the floor portion 32 of the cathode mark 3 can be easily colored. Further, by moving the squeegee from the position away from the cathode mark 3 toward the cathode mark 3, it is possible to effectively prevent the squeegee from colliding with a step between the upper surface 23 of the package molded body 2 and the floor portion 32 of the cathode mark 3. Since the squeegee can be moved smoothly, it can be colored efficiently by the screen printing method.

In addition, the manufacturing method of the lamp | ramp 1 and the lamp | ramp 1 of this invention is not limited to embodiment mentioned above. For example, the coloring step can be performed before the mounting step as in the above-described example, but may be performed after the sealing step.
In this case, by using a screen plate having a pattern in which the light emitting part of the package is masked, only the upper surface of the package molded body can be painted without painting the light emitting part. Moreover, since the coloring step is performed after the sealing step, the inner wall surface of the light-emitting portion is not colored with ink, so that sufficient luminance can be obtained during lighting.
Further, in the lamp 1 of this embodiment, in order to improve productivity, each process of the coloring process, the mounting process, and the sealing process is performed in a state where a large number of package molded bodies 2 are arranged on a lead frame (not shown). It is preferable to manufacture a large number at the same time by performing the above.

"Example 1"
The lamp 1 shown in FIGS. 1 to 3 was manufactured by the following method.
That is, on the upper surface 23, the recesses 21 where the lead electrodes 4 are exposed are formed on a plurality of copper substrates 6 on which three pairs of lead electrodes 4 made of silver plated silver of a lead frame (not shown) are formed. Each package molded body 2 made of polyphthalamide (Solvay Amodel) having cathode marks 3 at the edges was formed (FIG. 4).

  Next, the package molded body 2 was installed in the fixed frame 8 by placing the fixed frame 8 shown in FIG. 4 on a lead frame (not shown) in which a plurality of package molded bodies 2 are arranged. In addition, the deviation in the height direction between the upper surface 23 of the package molded body 2 and the upper surface 8a of the fixed frame 8 in the installation process was 0.1 mm. The distance d between the side surface 22 of the package molded body 2 and the inner surface 8b of the fixed frame 8 was 0.15 mm.

Next, at least a part of the side surface 22 of the package molded body 2 to be the low reflectance portion, the upper surface 23, and the wall portion 31 and the floor portion 32 of the cathode mark 3 are colored black using a screen printing method (coloring). Process).
In the screen printing method, first, the package molded body 2 installed in the fixed frame 8 was set in a screen printing machine, and the plate frame with the screen ridges and the package molded body 2 were aligned. Thereafter, the screen ridge pattern made of stainless steel was filled with black ink using a scraper, and the squeegee was slid to transfer the pattern to the portion that becomes the low reflectance portion of the package molded body 2.

The direction in which the squeegee is moved is the direction from the left side to the right side in FIG. In the screen printing method, the squeegee pressure was 0.22 MPa, and the printing speed was 50 mm / sec.
Further, the pattern of the screen ridge is such that a portion that becomes a low reflectance portion of the package molded body 2 is a screen hole, and a region that is not a low reflectance portion is a mask, and the low reflectance portion of the package molded body 2 is The screen hole was larger than the portion, and the deviation when the low reflectance portion of the package molded body 2 and the screen hole were viewed in plan was 0.25 mm.
Moreover, MT550TV (trade name: manufactured by Microtech) was used as a screen printing apparatus, and Dicure SSD582DV Black (trade name: manufactured by Dainippon Ink) was used as ink. Moreover, after coloring by the screen printing method, ultraviolet rays were irradiated to cure and adhere the ink.

  A photograph of the lamp 1 of Example 1 after the coloring step obtained in this way is shown in FIG. FIG. 5 is a photograph showing a part of the manufacturing process of the lamp of Example 1.

After the coloring step was completed, the LED element 5 was mounted in the recess 21 of the package molded body 2 (mounting step). In the mounting process, first, three LED elements 5a, 5b, and 5c of red, blue, and green were bonded to the bottom 21a of the recess 21 using a die bonding agent made of silver paste. Thereafter, the electrode of the LED element 5 and the lead electrode 4 were electrically connected using a wire 7 made of Au.
Then, after the mounting process is completed, a mold material made of silicone resin is injected into the recess 21 and thermally cured to seal the LED element 5 (sealing process), and the lamp 1 shown in FIGS. did.

"Example 2"
A lamp of Example 2 was manufactured in the same manner as Example 1 except that the coloring process was performed after the sealing process.

“Comparative Example 1”
A lamp of Comparative Example 1 was manufactured in the same manner as Example 1 except that only the upper surface of the package molded body was colored black using a screen printing method.

"Contrast ratio"
For the front and side surfaces of the lamps of Examples 1, 2 and Comparative Example 1 thus obtained, the area ratio of the dark color portion was examined. The results are shown in Table 1.

  As shown in Table 1, in Example 1 and Example 2, the area ratio of the front dark color part is larger than that of Comparative Example 1. Further, in Example 1 and Example 2, the area ratio of the dark color portion on the side surface is larger than that in Comparative Example 1. For this reason, in Example 1 and Example 2, compared with the comparative example 1, the high reflective brightness at the time of non-lighting can be made low, and a contrast ratio is obtained.

FIG. 1 is a schematic plan view schematically showing an example of the lamp of the present invention. 2 is a side view of the lamp shown in FIG. 1 as viewed from below in FIG. FIG. 3 is a side view of the lamp shown in FIG. 1 viewed from the left side in FIG. FIG. 4 is a schematic plan view for explaining the manufacturing method of the lamp shown in FIG. FIG. 5 is a photograph showing a part of the manufacturing process of the lamp of Example 1.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Lamp, 2 ... Package molded object, 3 ... Cathode mark, 4 ... Lead electrode 5, 5a, 5b, 5c ... LED element (light emitting element), 6 ... Board | substrate, 7 ... Wire, 8 ... Fixed frame, 21 ... Recess, 21a ... bottom, 22 ... side, 23 ... top, 31 ... wall, 32 ... floor.

Claims (8)

A light emitting element;
A package molded body in which a concave portion for accommodating the light emitting element is formed on the upper surface which is a light emission observation surface;
A cathode in which a part of the side surface of the package molded body and a part of the upper surface are continuously cut to form a wall portion exposed on the side surface side and a floor portion exposed on the upper surface side. Mark and
A mold material for sealing the light emitting element accommodated in the recess,
The lamp according to claim 1, wherein the upper surface of the package molded body, the wall portion and the floor portion of the cathode mark are low-reflectance portions having a reflectance lower than that of the inner surface of the concave portion.   The lamp according to claim 1, wherein the low reflectance part is colored dark. A package molded body in which a concave portion for accommodating a light emitting element is formed on the upper surface which is a light emission observation surface, and a part of the side surface of the package molded body and a part of the upper surface are continuously cut off. A method of manufacturing a lamp having at least a cathode mark formed with a wall portion exposed on the side surface side and a floor portion exposed on the upper surface side,
A coloring step of coloring the upper surface of the molded package and the wall and floor of the cathode mark so as to be darker than the inner surface of the recess;
A mounting step of mounting a light emitting element in the recess;
And a sealing step of sealing the light emitting element with a molding material.   4. The method of manufacturing a lamp according to claim 3, wherein in the coloring step, coloring is performed using a screen printing method. Before the coloring step, comprising an installation step of installing the package molded body in a fixed frame for fixing the package molded body,
5. The package molded body according to claim 4, wherein in the installation step, the package molded body is installed such that a deviation in a height direction between the upper surface of the package molded body and an upper surface of the fixed frame is 1 mm or less. A method of manufacturing a lamp.   The lamp manufacturing method according to claim 4, wherein the screen printing method includes a step of moving a squeegee from a position away from the cathode mark toward the cathode mark.   The method of manufacturing a lamp according to any one of claims 3 to 6, wherein the coloring step is performed before the mounting step.   The method of manufacturing a lamp according to any one of claims 3 to 6, wherein the coloring step is performed after the sealing step.

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