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WO1996008749A3 - Method of producing a three-dimensional component or group of components - Google Patents

Method of producing a three-dimensional component or group of components Download PDF

Info

Publication number
WO1996008749A3
WO1996008749A3 PCT/DE1995/001151 DE9501151W WO9608749A3 WO 1996008749 A3 WO1996008749 A3 WO 1996008749A3 DE 9501151 W DE9501151 W DE 9501151W WO 9608749 A3 WO9608749 A3 WO 9608749A3
Authority
WO
WIPO (PCT)
Prior art keywords
features
layers
galvanic
dimensional
production
Prior art date
Application number
PCT/DE1995/001151
Other languages
German (de)
French (fr)
Other versions
WO1996008749A2 (en
Inventor
Martina Rothe
Andreas Maciossek
Bernd Loechel
Original Assignee
Fraunhofer Ges Zur Foerderng D
Martina Rothe
Andreas Maciossek
Bernd Loechel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Zur Foerderng D, Martina Rothe, Andreas Maciossek, Bernd Loechel filed Critical Fraunhofer Ges Zur Foerderng D
Publication of WO1996008749A2 publication Critical patent/WO1996008749A2/en
Publication of WO1996008749A3 publication Critical patent/WO1996008749A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

The invention concerns a method of producing a three-dimensional component or group of components, particularly on surfaces of already processed semiconductor chips. The production of three-dimensional features on chip surfaces is based on the stucturing of thick photosensitive resists and subsequent formation of the surface features by galvanic etching. Prior art methods merely use a thick photoresist and interposed galvanic starting layers to form three-dimensional features. The production of complex features is only possible with considerable difficulty owing to the low stability of the photoresist. The method proposed for the production of three-dimensional features uses, in addition to the galvanic etching of e.g. UV-structured photoresist layers with build-on metal films (16), etching using metal auxiliary films which are later removed again (sacrificial layers) (13). These metal auxiliary films lying in the resist layers are also used, in multi-layer features, as galvanic starting layers for additional build-on levels. The three-dimensional features which can be made by the method described enable, for example, e.g. coils and transformers to be manufactured, in a form in which they could not be manufactured previously, for integration on chip surfaces.
PCT/DE1995/001151 1994-09-14 1995-08-23 Method of producing a three-dimensional component or group of components WO1996008749A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4432725A DE4432725C1 (en) 1994-09-14 1994-09-14 Forming three-dimensional components on surface of semiconductor chips etc.
DEP4432725.0 1994-09-14

Publications (2)

Publication Number Publication Date
WO1996008749A2 WO1996008749A2 (en) 1996-03-21
WO1996008749A3 true WO1996008749A3 (en) 1996-07-25

Family

ID=6528199

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1995/001151 WO1996008749A2 (en) 1994-09-14 1995-08-23 Method of producing a three-dimensional component or group of components

Country Status (2)

Country Link
DE (1) DE4432725C1 (en)
WO (1) WO1996008749A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19523915A1 (en) * 1995-06-30 1997-01-02 Bosch Gmbh Robert Microvalve and method for manufacturing a microvalve
EP1178499B1 (en) * 1999-04-14 2004-11-24 Takashi Nishi Microsolenoid coil and its manufacturing method
US6625372B1 (en) * 1999-11-15 2003-09-23 Axsun Technologies, Inc. Mounting and alignment structures for optical components
DE19955975A1 (en) * 1999-11-19 2001-05-23 Inst Mikrotechnik Mainz Gmbh Lithographic process for the production of micro components
US6763575B2 (en) * 2001-06-11 2004-07-20 Oak-Mitsui Inc. Printed circuit boards having integrated inductor cores
US6852454B2 (en) 2002-06-18 2005-02-08 Freescale Semiconductor, Inc. Multi-tiered lithographic template and method of formation and use
DE10302771B4 (en) * 2003-01-24 2006-07-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. System and method for manufacturing microcomponents
US6977223B2 (en) * 2003-03-07 2005-12-20 Massachusetts Institute Of Technology Three dimensional microfabrication
DE102006058068B4 (en) 2006-12-07 2018-04-05 Infineon Technologies Ag Semiconductor component with semiconductor chip and passive coil component and method for its production
JP6302613B1 (en) * 2017-03-01 2018-03-28 ナノコイル株式会社 Manufacturing method of nano coil type GSR sensor element
WO2018217646A1 (en) 2017-05-22 2018-11-29 Howmedica Osteonics Corp. Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process
AU2019206103B2 (en) 2018-07-19 2025-06-26 Howmedica Osteonics Corp. System and process for in-process electron beam profile and location analyses

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258097A (en) * 1992-11-12 1993-11-02 Ford Motor Company Dry-release method for sacrificial layer microstructure fabrication

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JURISCH R: "IDENTIFIKATION: KONTAKTLOS VIA HOCHFREQUENZ", ELEKTRONIK, vol. 42, no. 9, 4 May 1993 (1993-05-04), pages 86 - 90, 92, XP000362956 *

Also Published As

Publication number Publication date
DE4432725C1 (en) 1996-01-11
WO1996008749A2 (en) 1996-03-21

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