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WO2008139720A1 - 樹脂組成物、ドライフィルム、およびそれから得られる加工品 - Google Patents

樹脂組成物、ドライフィルム、およびそれから得られる加工品 Download PDF

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Publication number
WO2008139720A1
WO2008139720A1 PCT/JP2008/001129 JP2008001129W WO2008139720A1 WO 2008139720 A1 WO2008139720 A1 WO 2008139720A1 JP 2008001129 W JP2008001129 W JP 2008001129W WO 2008139720 A1 WO2008139720 A1 WO 2008139720A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
fabrications
same
dry film
provides
Prior art date
Application number
PCT/JP2008/001129
Other languages
English (en)
French (fr)
Inventor
Katsuhiko Funaki
Etsuo Ohkawado
Kousuke Hirota
Syuji Tahara
Original Assignee
Mitsui Chemicals, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals, Inc. filed Critical Mitsui Chemicals, Inc.
Priority to KR1020097023437A priority Critical patent/KR101142735B1/ko
Priority to CN2008800149288A priority patent/CN101675113B/zh
Priority to JP2009514009A priority patent/JP5289309B2/ja
Priority to US12/597,676 priority patent/US8362103B2/en
Publication of WO2008139720A1 publication Critical patent/WO2008139720A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

　環境に負荷を与える可能性の高いハロゲン含有化合物類およびアンチモン化合物を含まず、硬化後に良好な難燃性を発現し、特に近年の厳しい屈曲耐性、絶縁信頼性の要求に応える皮膜を形成することができる樹脂組成物を提供する。具体的には、（Ａ）ポリイミド前駆体、および（Ｂ）下記式（１）で表される有機リン化合物と、４つ以上の（メタ）アクリレート基を有する化合物との付加物、を有する樹脂組成物が提供される。好ましくは、樹脂組成物には（Ｃ）ホスファゼン化合物が含有される。
PCT/JP2008/001129 2007-05-11 2008-04-30 樹脂組成物、ドライフィルム、およびそれから得られる加工品 WO2008139720A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097023437A KR101142735B1 (ko) 2007-05-11 2008-04-30 수지 조성물, 드라이 필름, 및 그로부터 얻어지는 가공품
CN2008800149288A CN101675113B (zh) 2007-05-11 2008-04-30 树脂组合物、干膜及由其得到的加工品
JP2009514009A JP5289309B2 (ja) 2007-05-11 2008-04-30 樹脂組成物、ドライフィルム、およびそれから得られる加工品
US12/597,676 US8362103B2 (en) 2007-05-11 2008-04-30 Resin composition, dry film, and processed product made using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-126378 2007-05-11
JP2007126378 2007-05-11

Publications (1)

Publication Number Publication Date
WO2008139720A1 true WO2008139720A1 (ja) 2008-11-20

Family

ID=40001945

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001129 WO2008139720A1 (ja) 2007-05-11 2008-04-30 樹脂組成物、ドライフィルム、およびそれから得られる加工品

Country Status (6)

Country Link
US (1) US8362103B2 (ja)
JP (1) JP5289309B2 (ja)
KR (1) KR101142735B1 (ja)
CN (1) CN101675113B (ja)
TW (1) TWI428393B (ja)
WO (1) WO2008139720A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175647A (ja) * 2008-01-28 2009-08-06 Fujifilm Corp 感光性樹脂組成物、フォトスペーサー及びその形成方法、保護膜、着色パターン、表示装置用基板、並びに表示装置
JP2010106167A (ja) * 2008-10-30 2010-05-13 Mitsui Chemicals Inc 電子材料用樹脂組成物
WO2011016094A1 (en) * 2009-08-07 2011-02-10 Mitsui Chemicals, Inc. Heat resistant resin, composition thereof, resin/metal laminate and circuit board
WO2011083554A1 (ja) * 2010-01-05 2011-07-14 日本化薬株式会社 ホスフィンオキサイドを含むポリアミド又はポリイミド樹脂組成物並びにその硬化物
CN102639640A (zh) * 2009-11-19 2012-08-15 东洋纺织株式会社 氨基甲酸酯改性聚酰亚胺系阻燃树脂组合物
JP2023108082A (ja) * 2022-01-25 2023-08-04 日本化薬株式会社 ポリイミド樹脂、該ポリイミド樹脂含有する樹脂組成物及びその硬化物

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008132842A1 (ja) * 2007-04-24 2008-11-06 Mitsui Chemicals, Inc. 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品
KR101128207B1 (ko) * 2007-04-24 2012-03-23 미쓰이 가가쿠 가부시키가이샤 감광성 수지 조성물, 드라이 필름 및 그것을 이용한 가공품
KR101898689B1 (ko) * 2011-06-21 2018-09-13 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 난연화된 지환식 폴리이미드 수지 조성물 및 그 박육 성형체
US20220017673A1 (en) * 2020-07-15 2022-01-20 Fujifilm Electronic Materials U.S.A., Inc. Dielectric Film Forming Compositions

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000086761A (ja) * 1998-09-16 2000-03-28 Manac Inc ポリイミドの製造方法
JP2004029702A (ja) * 2001-11-22 2004-01-29 Mitsui Chemicals Inc 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工部品
JP2006251715A (ja) * 2005-03-14 2006-09-21 Kaneka Corp 難燃性を有する感光性樹脂組成物及び感光性ドライフィルムレジスト

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1327642A4 (en) 2000-09-20 2006-07-19 Taiyo Ink Mfg Co Ltd CARBOXYLATED PHOTOSENSITIVE RESIN, THIS CONTAINING, ALKALI DEVELOPABLE, LIGHT-CURABLE / HEAT-CURABLE COMPOSITION, AND THEREOF HARDENED ARTICLE
KR100529577B1 (ko) * 2001-11-22 2005-11-17 미쓰이 가가쿠 가부시키가이샤 감광성 수지조성물, 드라이필름 및 그것을 이용한 가공부품
JP4627146B2 (ja) 2004-03-29 2011-02-09 京セラケミカル株式会社 感光性熱硬化型樹脂組成物及びフレキシブルプリント配線板
JP2005300785A (ja) 2004-04-09 2005-10-27 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びその硬化塗膜
JPWO2008087812A1 (ja) * 2007-01-18 2010-05-06 昭和高分子株式会社 リン含有難燃剤及びそれを含む硬化性難燃性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000086761A (ja) * 1998-09-16 2000-03-28 Manac Inc ポリイミドの製造方法
JP2004029702A (ja) * 2001-11-22 2004-01-29 Mitsui Chemicals Inc 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工部品
JP2006251715A (ja) * 2005-03-14 2006-09-21 Kaneka Corp 難燃性を有する感光性樹脂組成物及び感光性ドライフィルムレジスト

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175647A (ja) * 2008-01-28 2009-08-06 Fujifilm Corp 感光性樹脂組成物、フォトスペーサー及びその形成方法、保護膜、着色パターン、表示装置用基板、並びに表示装置
JP2010106167A (ja) * 2008-10-30 2010-05-13 Mitsui Chemicals Inc 電子材料用樹脂組成物
WO2011016094A1 (en) * 2009-08-07 2011-02-10 Mitsui Chemicals, Inc. Heat resistant resin, composition thereof, resin/metal laminate and circuit board
CN102639640A (zh) * 2009-11-19 2012-08-15 东洋纺织株式会社 氨基甲酸酯改性聚酰亚胺系阻燃树脂组合物
KR101738193B1 (ko) 2009-11-19 2017-05-19 도요보 가부시키가이샤 우레탄 변성 폴리이미드계 난연 수지 조성물
WO2011083554A1 (ja) * 2010-01-05 2011-07-14 日本化薬株式会社 ホスフィンオキサイドを含むポリアミド又はポリイミド樹脂組成物並びにその硬化物
JP5715577B2 (ja) * 2010-01-05 2015-05-07 日本化薬株式会社 ホスフィンオキサイドを含むポリアミド又はポリイミド樹脂組成物並びにその硬化物
JP2023108082A (ja) * 2022-01-25 2023-08-04 日本化薬株式会社 ポリイミド樹脂、該ポリイミド樹脂含有する樹脂組成物及びその硬化物
JP7682113B2 (ja) 2022-01-25 2025-05-23 日本化薬株式会社 ポリイミド樹脂、該ポリイミド樹脂含有する樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP5289309B2 (ja) 2013-09-11
US20100059263A1 (en) 2010-03-11
US8362103B2 (en) 2013-01-29
TW200902628A (en) 2009-01-16
TWI428393B (zh) 2014-03-01
KR101142735B1 (ko) 2012-05-07
CN101675113A (zh) 2010-03-17
CN101675113B (zh) 2012-04-18
KR20100002277A (ko) 2010-01-06
JPWO2008139720A1 (ja) 2010-07-29

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