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WO2013033034A3 - Method for making high-density electrical interconnections using rivet bonds - Google Patents

Method for making high-density electrical interconnections using rivet bonds Download PDF

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Publication number
WO2013033034A3
WO2013033034A3 PCT/US2012/052552 US2012052552W WO2013033034A3 WO 2013033034 A3 WO2013033034 A3 WO 2013033034A3 US 2012052552 W US2012052552 W US 2012052552W WO 2013033034 A3 WO2013033034 A3 WO 2013033034A3
Authority
WO
WIPO (PCT)
Prior art keywords
making high
substrate
bonds
density electrical
electrical interconnections
Prior art date
Application number
PCT/US2012/052552
Other languages
French (fr)
Other versions
WO2013033034A2 (en
Inventor
Kedar G. SHAH
Satinderpall S. Pannu
Angela C. Tooker
Original Assignee
Lawrence Livermore National Security, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lawrence Livermore National Security, Llc filed Critical Lawrence Livermore National Security, Llc
Publication of WO2013033034A2 publication Critical patent/WO2013033034A2/en
Publication of WO2013033034A3 publication Critical patent/WO2013033034A3/en

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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A method of making high-density electrical interconnects between micro-electronic components using rivet bonds, by positioning a first substrate over a second substrate to align a through-hole and adjacent first metal bond pad of the first substrate with a second metal bond pad of the second substrate, and forming a metal bump through the through-hole so that the metal bump bonds to and electrically connects the first and second metal bond pads via the through-hole.
PCT/US2012/052552 2011-08-26 2012-08-27 Method for making high-density electrical interconnections using rivet bonds WO2013033034A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161528096P 2011-08-26 2011-08-26
US61/528,096 2011-08-26

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WO2013033034A2 WO2013033034A2 (en) 2013-03-07
WO2013033034A3 true WO2013033034A3 (en) 2013-04-25

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5048747A (en) * 1989-06-27 1991-09-17 At&T Bell Laboratories Solder assembly of components
KR20020005592A (en) * 1999-02-26 2002-01-17 가나이 쓰토무 Wiring board and its production method, semiconductor device and its production method, and electronic apparatus
US20020074381A1 (en) * 2000-12-15 2002-06-20 Unitive International Limited Low temperature methods of bonding components and related structures
US20030059642A1 (en) * 2001-09-27 2003-03-27 Zequn Mei Method of making lead-free solder and solder paste with improved wetting and shelf life
KR20070096016A (en) * 2005-01-10 2007-10-01 마이크론 테크놀로지, 인크 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
US20070231964A1 (en) * 2002-03-04 2007-10-04 Micron Technology, Inc. Methods of forming semiconductor assemblies

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5048747A (en) * 1989-06-27 1991-09-17 At&T Bell Laboratories Solder assembly of components
KR20020005592A (en) * 1999-02-26 2002-01-17 가나이 쓰토무 Wiring board and its production method, semiconductor device and its production method, and electronic apparatus
US20020074381A1 (en) * 2000-12-15 2002-06-20 Unitive International Limited Low temperature methods of bonding components and related structures
US20030059642A1 (en) * 2001-09-27 2003-03-27 Zequn Mei Method of making lead-free solder and solder paste with improved wetting and shelf life
US20070231964A1 (en) * 2002-03-04 2007-10-04 Micron Technology, Inc. Methods of forming semiconductor assemblies
KR20070096016A (en) * 2005-01-10 2007-10-01 마이크론 테크놀로지, 인크 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

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