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WO2013033034A3 - Procédé de formation d'interconnexions électriques haute densité à l'aide de liens de type rivets - Google Patents

Procédé de formation d'interconnexions électriques haute densité à l'aide de liens de type rivets Download PDF

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Publication number
WO2013033034A3
WO2013033034A3 PCT/US2012/052552 US2012052552W WO2013033034A3 WO 2013033034 A3 WO2013033034 A3 WO 2013033034A3 US 2012052552 W US2012052552 W US 2012052552W WO 2013033034 A3 WO2013033034 A3 WO 2013033034A3
Authority
WO
WIPO (PCT)
Prior art keywords
making high
substrate
bonds
density electrical
electrical interconnections
Prior art date
Application number
PCT/US2012/052552
Other languages
English (en)
Other versions
WO2013033034A2 (fr
Inventor
Kedar G. SHAH
Satinderpall S. Pannu
Angela C. Tooker
Original Assignee
Lawrence Livermore National Security, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lawrence Livermore National Security, Llc filed Critical Lawrence Livermore National Security, Llc
Publication of WO2013033034A2 publication Critical patent/WO2013033034A2/fr
Publication of WO2013033034A3 publication Critical patent/WO2013033034A3/fr

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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de formation d'interconnexions électriques haute densité entre des composants microélectroniques à l'aide de liens de type rivets, ceci en positionnant un premier substrat sur un second substrat afin d'aligner un trou traversant et une première plage de contact métallique adjacente du premier substrat avec une seconde plage de contact métallique du second substrat, et en formant une bosse métallique à travers le trou traversant de sorte que la bosse métallique se lie aux première et seconde plages de contact métalliques et les connecte électriquement via le trou traversant.
PCT/US2012/052552 2011-08-26 2012-08-27 Procédé de formation d'interconnexions électriques haute densité à l'aide de liens de type rivets WO2013033034A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161528096P 2011-08-26 2011-08-26
US61/528,096 2011-08-26

Publications (2)

Publication Number Publication Date
WO2013033034A2 WO2013033034A2 (fr) 2013-03-07
WO2013033034A3 true WO2013033034A3 (fr) 2013-04-25

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Application Number Title Priority Date Filing Date
PCT/US2012/052552 WO2013033034A2 (fr) 2011-08-26 2012-08-27 Procédé de formation d'interconnexions électriques haute densité à l'aide de liens de type rivets

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WO (1) WO2013033034A2 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5048747A (en) * 1989-06-27 1991-09-17 At&T Bell Laboratories Solder assembly of components
KR20020005592A (ko) * 1999-02-26 2002-01-17 가나이 쓰토무 배선 기판 및 그 제조 방법, 반도체 장치 및 그 제조방법, 및 전자 기기
US20020074381A1 (en) * 2000-12-15 2002-06-20 Unitive International Limited Low temperature methods of bonding components and related structures
US20030059642A1 (en) * 2001-09-27 2003-03-27 Zequn Mei Method of making lead-free solder and solder paste with improved wetting and shelf life
KR20070096016A (ko) * 2005-01-10 2007-10-01 마이크론 테크놀로지, 인크 본드 패드를 갖는 상호 결선 구조체 및 본드 패드 상의범프 사이트 형성 방법
US20070231964A1 (en) * 2002-03-04 2007-10-04 Micron Technology, Inc. Methods of forming semiconductor assemblies

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5048747A (en) * 1989-06-27 1991-09-17 At&T Bell Laboratories Solder assembly of components
KR20020005592A (ko) * 1999-02-26 2002-01-17 가나이 쓰토무 배선 기판 및 그 제조 방법, 반도체 장치 및 그 제조방법, 및 전자 기기
US20020074381A1 (en) * 2000-12-15 2002-06-20 Unitive International Limited Low temperature methods of bonding components and related structures
US20030059642A1 (en) * 2001-09-27 2003-03-27 Zequn Mei Method of making lead-free solder and solder paste with improved wetting and shelf life
US20070231964A1 (en) * 2002-03-04 2007-10-04 Micron Technology, Inc. Methods of forming semiconductor assemblies
KR20070096016A (ko) * 2005-01-10 2007-10-01 마이크론 테크놀로지, 인크 본드 패드를 갖는 상호 결선 구조체 및 본드 패드 상의범프 사이트 형성 방법

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