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WO2018194066A1 - Carrier film and method for manufacturing electronic component - Google Patents

Carrier film and method for manufacturing electronic component Download PDF

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Publication number
WO2018194066A1
WO2018194066A1 PCT/JP2018/015898 JP2018015898W WO2018194066A1 WO 2018194066 A1 WO2018194066 A1 WO 2018194066A1 JP 2018015898 W JP2018015898 W JP 2018015898W WO 2018194066 A1 WO2018194066 A1 WO 2018194066A1
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WO
WIPO (PCT)
Prior art keywords
carrier film
hole
sheet member
ultraviolet laser
wavelength
Prior art date
Application number
PCT/JP2018/015898
Other languages
French (fr)
Japanese (ja)
Inventor
一生 山元
良太 浅井
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2019513655A priority Critical patent/JP6760493B2/en
Priority to CN201880025656.5A priority patent/CN110521291B/en
Priority to KR1020197030062A priority patent/KR102193968B1/en
Publication of WO2018194066A1 publication Critical patent/WO2018194066A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00—Producing shaped prefabricated articles from the material
    • B28B1/30—Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to a carrier film used for molding a sheet member, and a method of manufacturing an electronic component including a step of forming a hole which is at least one of a through hole and a bottomed hole in a sheet member molded thereon. It is.
  • the sheet member is used as a component member of an electronic component or a component member of an intermediate product in the manufacturing process of the electronic component.
  • An example of the sheet member is a ceramic green sheet.
  • a method for manufacturing a ceramic electronic component including a step of forming a through hole in a ceramic green sheet there is a method for manufacturing a ceramic electronic component described in JP-A-6-304774 (Patent Document 1).
  • a laser is irradiated onto a carrier film made of, for example, polyethylene terephthalate (hereinafter abbreviated as PET) and a ceramic green sheet formed thereon.
  • PET polyethylene terephthalate
  • a laser is irradiated from the carrier film side.
  • through holes are formed in both the carrier film and the ceramic green sheet formed thereon.
  • the above-mentioned through hole is filled with a conductive paste containing metal powder.
  • the ceramic green sheet in which the through hole is filled with the conductive paste is fired after the carrier film is peeled off.
  • the conductive paste filled in the through hole becomes a via conductor after firing.
  • the diameter of via conductors has been reduced with the miniaturization of electronic components.
  • a laser used in a process of forming a through hole for a small-diameter via conductor in a sheet member use of an ultraviolet laser suitable for processing a minute region has been studied.
  • the ultraviolet laser for example, a laser having a wavelength distribution in which the center wavelength is 355 nm and the wavelength of 375 nm or more is included.
  • the material of the carrier film when a material having a low absorption rate of the ultraviolet laser in most of the wavelength distribution is used as the material of the carrier film, it may be difficult to form a through hole in the carrier film.
  • a material for the carrier film when a material having a high absorption rate of the ultraviolet laser in most of the wavelength distribution is used, the formation of through holes in the carrier film is likely to proceed. However, in that case, there is a possibility that the hole diameter in the vicinity of the interface between the carrier film and the sheet member becomes large.
  • FIG. 2 is a diagram for explaining in more detail the problem when a material having a high absorption rate of an ultraviolet laser is used in most of the wavelength distribution as the material of the carrier film.
  • 2 (A) to 2 (E) schematically show the main part of each step sequentially performed in an example of a method of manufacturing an electronic component including a step of forming a through hole in a sheet member by an ultraviolet laser. It is sectional drawing.
  • FIG. 2A is a cross-sectional view illustrating a process in which the carrier film 110 is manufactured or prepared.
  • the carrier film 110 is made of a material having a high absorption rate of an ultraviolet laser in most of the wavelength distribution described above, such as polyethylene naphthalate (hereinafter abbreviated as PEN).
  • FIG. 2B is a cross-sectional view illustrating a process in which the sheet member 120 is formed on one main surface of the carrier film 110.
  • the material and molding method of the sheet member 120 are not particularly limited.
  • FIG. 2C is a cross-sectional view showing a process in which the through hole 130 is formed in the sheet member 120 formed on the carrier film 110 and one main surface thereof by irradiation with the ultraviolet laser B.
  • the ultraviolet laser B is irradiated from the other main surface side of the carrier film 110.
  • a through hole 130 is formed in the carrier film 110 and the sheet member 120.
  • the component near the center wavelength in the ultraviolet laser B is easily absorbed from the other main surface side of the carrier film 110. Therefore, the carrier film 110 is perforated from the other main surface side by the component near the center wavelength in the ultraviolet laser B.
  • the component having the wavelength of 375 nm or more is easily absorbed from the one main surface side of the carrier film 110. Therefore, the carrier film 110 is also perforated from the one main surface side by the above components.
  • FIG. 2D is a cross-sectional view showing a process of filling the through holes formed in the carrier film 110 and the sheet member 120 with the conductive paste 140.
  • the conductive paste 140 is also filled in a portion 130 a where the hole diameter is increased near the interface between the carrier film 110 and the sheet member 120.
  • FIG. 2E is a cross-sectional view illustrating a process in which the carrier film 110 is peeled from the sheet member 120.
  • the protruding portion 140a of the conductive paste 140 from an unintended through hole is formed on the sheet member 120 after the carrier film 110 is peeled off. appear.
  • FIG. 2E when a plurality of via conductors are provided, there is a possibility that adjacent via conductors come into contact with each other.
  • the above problem can occur not only when a ceramic green sheet is formed as a sheet member on a carrier film but also when a resin sheet is formed.
  • the above problem may occur not only when the through hole is formed in the sheet member but also when the bottomed hole is formed.
  • An object of the present invention is to suppress excessive processing in the vicinity of the interface between a through hole and a bottomed hole when an ultraviolet laser is formed on a sheet member formed on a carrier film. It is to provide a carrier film. Moreover, it is providing the manufacturing method of the electronic component in which said carrier film is used.
  • the absorption rate of the irradiated ultraviolet laser can be improved.
  • the present invention is first directed to a carrier film.
  • the carrier film according to the present invention is used for forming a sheet member.
  • an ultraviolet laser having a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more is irradiated, the absorptance of components less than 375 nm in the wavelength distribution of the ultraviolet laser is 50% or more.
  • the absorptance of a component of 375 nm or more in the wavelength distribution of the ultraviolet laser is less than 50%.
  • the above carrier film when a sheet member is formed on one main surface and the above ultraviolet laser is irradiated from the other main surface side, absorption of components having a wavelength of 375 nm or more from the one main surface side is suppressed. Therefore, when the through hole is formed in the carrier film and the hole that is at least one of the through hole and the bottomed hole is formed in the sheet member by the ultraviolet laser, excessive processing in the vicinity of the interface between the two is suppressed.
  • the carrier film according to the present invention preferably has the following characteristics. That is, the carrier film according to the present invention includes polyethylene terephthalate (PET) and polyethylene naphthalate (PEN).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • the ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less.
  • the present invention is also directed to a method for manufacturing an electronic component.
  • the method for manufacturing an electronic component according to the present invention includes a step of forming a hole which is at least one of a through hole and a bottomed hole in a sheet member formed on a carrier film.
  • the manufacturing method of the electronic component which concerns on this invention is equipped with the following 1st thru
  • the first step is a step in which a carrier film is produced or prepared.
  • a 2nd process is a process by which a sheet
  • the carrier film and the sheet member formed on the carrier film are irradiated with an ultraviolet laser from the other main surface side of the carrier film, whereby a through-hole is formed in the carrier film and penetrates the sheet member.
  • a hole that is at least one of a hole and a bottomed hole is formed.
  • the ultraviolet laser has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more.
  • the fourth step is a step in which the through-hole formed in the carrier film and the hole formed in the sheet member are filled with the conductive paste.
  • the fifth step is a step in which the carrier film is peeled from the sheet member in which the hole is filled with the conductive paste.
  • said carrier film is a carrier film which concerns on this invention mentioned above.
  • the carrier film according to the present invention is used. Therefore, when the through hole is formed in the carrier film by the ultraviolet laser and the above hole is formed in the sheet member, excessive processing in the vicinity of the interface between the two is suppressed. Therefore, the protrusion of the conductive paste from the above-mentioned hole on the sheet member after peeling of the carrier film is suppressed. As a result, contact between adjacent via conductors is suppressed.
  • the carrier film according to the present invention when the through hole is formed in the carrier film by the ultraviolet laser and the above hole is formed in the sheet member, excessive processing in the vicinity of the interface between the two is suppressed. Moreover, in the manufacturing method of the electronic component which concerns on this invention, the protrusion from the said hole of the electrically conductive paste on the sheet
  • Embodiments of the present invention will be shown below, and the features of the present invention will be described in more detail.
  • the present invention is widely applied to both the manufacture of ceramic electronic parts manufactured by molding ceramic green sheets such as ceramic multilayer substrates and ceramic fuel cells, and the manufacture of non-ceramic electronic components such as resin multilayer substrates. .
  • the carrier film according to the present invention has the following characteristics. That is, when an ultraviolet laser having a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more is irradiated, the absorptance of components less than 375 nm in the wavelength distribution of the ultraviolet laser is 50% or more. Moreover, the absorptance of a component of 375 nm or more in the wavelength distribution of the ultraviolet laser is less than 50%.
  • the above condition is realized when the carrier film includes PET and PEN, and the ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less.
  • said conditions are implement
  • the specific configuration of the carrier film for realizing the above conditions is not limited to these.
  • UV absorbers include phenyl salicylate, p-tert-butylphenyl salicylate, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2 -(2'-hydroxy-5'-tert-methylphenyl) benzotriazole, 2- (2H-benzotriazol-2-yl) -4-6-bis (1-methyl-1-phenylethyl) phenol, 2- It is at least one organic compound selected from ethylhexyl-2-cyano-3,3′-diphenyl acrylate and ethyl-2-cyano-3,3′-diphenyl acrylate.
  • the carrier film is prepared to have a thickness of 25 ⁇ m.
  • a sheet member is formed on one main surface of the carrier film so as to have a thickness of 10 ⁇ m.
  • the sheet member is a ceramic green sheet containing a low-temperature fired ceramic material.
  • the ultraviolet laser applied to the carrier film has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more. The ultraviolet laser is irradiated from the other main surface side of the carrier film. In this experimental example, through holes are formed in both the carrier film and the sheet member by the irradiation of the ultraviolet laser.
  • This experimental example defines the absorptance of a component having a wavelength of less than 375 nm and the absorptance of a component having a wavelength of 375 nm or more when the carrier film is irradiated with the above-described ultraviolet laser.
  • the carrier film used in the experimental example can be produced by a known method such as a biaxial stretching method.
  • Table 1 shows the absorption rate of the ultraviolet laser and the values of the opening diameters at various positions of the formed through-holes when the above-described ultraviolet laser is irradiated onto various carrier films of this experimental example.
  • the absorption rate of the ultraviolet laser is divided into a component having a wavelength ⁇ of 300 nm or more and less than 355 nm, a component having a wavelength ⁇ of 355 nm or more and less than 375 nm, and a component having a wavelength ⁇ of 375 nm or more and less than 425 nm.
  • the absorptance of each wavelength component of the ultraviolet laser is measured by a spectrophotometer.
  • “film” represents a carrier film
  • sheet represents a sheet member.
  • sample 1 When sample 1 has a low absorptance with respect to most of the wavelength distribution, it was difficult to form a through hole within a predetermined time. Also, as in Sample 2, there was a component having an absorption rate of less than 50% among components having a wavelength ⁇ of less than 375 nm, and the component having a wavelength ⁇ of 375 nm or more was formed when the absorption rate was 50% or more. The shape of the through hole became irregular. This is thought to be because the processing from the one main surface side and the sheet member side of the carrier film progressed, and the processing from the other main surface side of the carrier film was hindered by the gas generated by the thermal decomposition of the carrier film and the sheet member. It is done.
  • the values of the opening diameters on the emission side of the ultraviolet laser in the carrier film and the incidence side of the ultraviolet laser in the sheet member are both 100 ⁇ m or more.
  • the absorption rate of the component having the wavelength ⁇ of less than 375 nm is 50% or more and the absorption rate of the component having the wavelength ⁇ of 375 nm or more is less than 50% as in the samples 3 to 5,
  • the value of the opening diameter at the position was less than 100 ⁇ m.
  • the weight ratio of PEN to the sum of the weights of PEN and PET is 0.05
  • the weight ratio of PEN to the sum of the weights of PEN and PET is 0.14
  • sample 5 PEN
  • the weight ratio of PEN to the sum of PET and PET is 0.25. Therefore, in the carrier film, when the weight ratio of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less, good processing results can be obtained.
  • FIG. 1 is a drawing for explaining an example of a method for manufacturing an electronic component using a carrier film according to the present invention.
  • FIGS. 1A to 1E show an example of a method for manufacturing an electronic component including a step of forming a hole that is at least one of a through hole and a bottomed hole in a sheet member formed on a carrier film. It is sectional drawing which represents each principal part of each process performed sequentially typically.
  • FIG. 1A is a cross-sectional view showing a step (first step) in which the carrier film 10 is produced or prepared.
  • the carrier film 10 is a carrier film according to the present invention, and includes PEN and PET in the weight ratio described above. That is, the ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less.
  • the carrier film 10 has a thickness of, for example, 25 ⁇ m to 100 ⁇ m by considering the time required for forming the through hole and the handling of the sheet member 20 formed thereon in the second step described later. It is produced as follows.
  • the release layer is formed using a silicone resin or a fluororesin.
  • inorganic material powder may be added to the carrier film 10 in order to adjust the thermal expansion coefficient, improve the mechanical strength, and prevent winding slippage.
  • the material of the inorganic material powder is at least one selected from oxides such as aluminum oxide, nitrides such as silicon nitride, and carbides such as silicon carbide.
  • the shape of the inorganic material powder is spherical or flaky. From the viewpoint of filling properties, a spherical shape is preferable.
  • FIG. 1B is a cross-sectional view showing a step (second step) in which the sheet member 20 is formed on one main surface of the carrier film 10.
  • the sheet member 20 is a ceramic green sheet containing a low-temperature fired ceramic material.
  • a slurry in which a ceramic material powder, a binder, a plasticizer, and an organic solvent are mixed is applied onto one main surface of the carrier film 10 using a lip coater or the like, thereby forming the sheet member 20.
  • the sheet member 20 is formed to have a thickness between 5 ⁇ m and 100 ⁇ m, for example.
  • FIG. 1C is a cross-sectional view showing a step (third step) in which through holes 30 are formed in the carrier film 10 and the sheet member 20 formed on one main surface thereof by irradiation with the ultraviolet laser B. is there.
  • the ultraviolet laser B is irradiated from the other main surface side of the carrier film 10.
  • the ultraviolet laser B has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more.
  • the through hole 30 is opened in both the carrier film 10 and the sheet member 20.
  • the diameter of the through hole 30 is set between 20 ⁇ m and 200 ⁇ m, for example.
  • the carrier film 10 is a carrier film according to the present invention as described above. That is, when the ultraviolet laser B is irradiated from the other main surface side to the carrier film 10 having the sheet member 20 formed on one main surface, absorption of components having a wavelength of 375 nm or more from the one main surface side is suppressed. . Therefore, when the through hole 30 is formed by the ultraviolet laser in the carrier film 10 and the sheet member 20 formed thereon, excessive processing in the vicinity of the interface between the two is suppressed.
  • FIG. 1D is a cross-sectional view showing a step (fourth step) in which the through-hole 30 formed in the carrier film 10 and the sheet member 20 is filled with the conductive paste 40.
  • the material and filling method of the conductive paste 40 are not particularly limited.
  • a conductive paste 40 in which a metal powder such as copper, a binder, a plasticizer, and an organic solvent are mixed is filled in the through holes 30 using a screen printer or the like.
  • an inorganic material powder may be added to the conductive paste 40 in order to adjust the shrinkage rate during sintering.
  • a material of the inorganic material powder a ceramic material powder contained in the sheet member 20 is preferable.
  • FIG. 1E is a cross-sectional view showing a step (fifth step) in which the carrier film is peeled from the sheet member 20 in which the through-holes are filled with the conductive paste 40.
  • the protrusion of the conductive paste 40 from the through hole 30 on the sheet member 20 after the carrier film 10 is peeled off is suppressed. It has been. As a result, contact between adjacent via conductors (not shown) is suppressed.
  • the example of the electronic component manufacturing method described above is for the case where the sheet member is a ceramic green sheet. However, even if the sheet member is a resin sheet, the same process is performed and the same effect is obtained. It is done. Further, in this example, the case where the through hole is formed in the sheet member is described, but the case where the bottomed hole is formed by changing at least one of the irradiation time and energy of the ultraviolet laser. However, the same effect can be obtained.

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided are a carrier film in which, when at least one of a through-hole and a bottomed hole is formed by means of an ultraviolet laser in a sheet member molded on the carrier film, excessive processing in the vicinity of an interface therebetween is suppressed, and a method for manufacturing an electronic component using the carrier film. The carrier film (10) is used for molding a sheet member (20) and, when irradiated with ultraviolet laser (B) with a wavelength distribution having a central wavelength of from 355 nm to 365 nm and including a wavelength of 375 nm or more, has an absorption rate of not less than 50% with respect to components of less than 375 nm in the wavelength distribution of the ultraviolet laser (B) and an absorption rate of less than 50% with respect to components of not less than 375 nm.

Description

キャリアフィルムおよび電子部品の製造方法Method for manufacturing carrier film and electronic component
　この発明は、シート部材の成形に用いられるキャリアフィルム、およびその上に成形されたシート部材に、貫通孔および有底孔の少なくとも一方である孔を形成する工程を含む電子部品の製造方法に関するものである。 The present invention relates to a carrier film used for molding a sheet member, and a method of manufacturing an electronic component including a step of forming a hole which is at least one of a through hole and a bottomed hole in a sheet member molded thereon. It is.
　シート部材は、電子部品の構成部材、または電子部品の製造過程における中間製品の構成部材として用いられる。シート部材の一例として、セラミックグリーンシートが挙げられる。セラミックグリーンシートに貫通孔を形成する工程を含むセラミック電子部品の製造方法の一例として、特開平６－３０４７７４号（特許文献１）に記載のセラミック電子部品の製造方法が挙げられる。 The sheet member is used as a component member of an electronic component or a component member of an intermediate product in the manufacturing process of the electronic component. An example of the sheet member is a ceramic green sheet. As an example of a method for manufacturing a ceramic electronic component including a step of forming a through hole in a ceramic green sheet, there is a method for manufacturing a ceramic electronic component described in JP-A-6-304774 (Patent Document 1).
　特許文献１に記載のセラミック電子部品の製造方法では、例えばポリエチレンテレフタレート（以下ＰＥＴと略記）からなるキャリアフィルムおよびその上に成形されたセラミックグリーンシートに対して、レーザが照射される。その際、レーザは、キャリアフィルム側から照射される。その結果、キャリアフィルムおよびその上に成形されたセラミックグリーンシートの両者に貫通孔が形成される。 In the method for manufacturing a ceramic electronic component described in Patent Document 1, a laser is irradiated onto a carrier film made of, for example, polyethylene terephthalate (hereinafter abbreviated as PET) and a ceramic green sheet formed thereon. In that case, a laser is irradiated from the carrier film side. As a result, through holes are formed in both the carrier film and the ceramic green sheet formed thereon.
　上記の貫通孔には、金属粉末を含む導電性ペーストが充填される。貫通孔に導電性ペーストが充填されたセラミックグリーンシートは、キャリアフィルムが剥離された後に焼成される。貫通孔に充填された導電性ペーストは、焼成後にビア導体となる。 The above-mentioned through hole is filled with a conductive paste containing metal powder. The ceramic green sheet in which the through hole is filled with the conductive paste is fired after the carrier film is peeled off. The conductive paste filled in the through hole becomes a via conductor after firing.
特開平６－３０４７７４号公報JP-A-6-304774
　近年、電子部品の小型化に伴い、ビア導体の小径化が図られている。シート部材に小径のビア導体用の貫通孔を形成する工程に用いられるレーザには、微小領域の加工に適した紫外線レーザの使用が検討されている。紫外線レーザの一例として、例えば中心波長が３５５ｎｍであり、３７５ｎｍ以上の波長が含まれる波長分布を有するものが挙げられる。 In recent years, the diameter of via conductors has been reduced with the miniaturization of electronic components. As a laser used in a process of forming a through hole for a small-diameter via conductor in a sheet member, use of an ultraviolet laser suitable for processing a minute region has been studied. As an example of the ultraviolet laser, for example, a laser having a wavelength distribution in which the center wavelength is 355 nm and the wavelength of 375 nm or more is included.
　ところが、キャリアフィルムの材料として、波長分布の大部分において紫外線レーザの吸収率が低い材料が用いられた場合、キャリアフィルムへの貫通孔の形成が困難となる虞がある。一方、キャリアフィルムの材料として、波長分布の大部分において紫外線レーザの吸収率が高い材料が用いられた場合、キャリアフィルムへの貫通孔の形成は進みやすくなる。ただし、その場合、キャリアフィルムとシート部材との界面近傍の孔径が大きくなる虞がある。 However, when a material having a low absorption rate of the ultraviolet laser in most of the wavelength distribution is used as the material of the carrier film, it may be difficult to form a through hole in the carrier film. On the other hand, as a material for the carrier film, when a material having a high absorption rate of the ultraviolet laser in most of the wavelength distribution is used, the formation of through holes in the carrier film is likely to proceed. However, in that case, there is a possibility that the hole diameter in the vicinity of the interface between the carrier film and the sheet member becomes large.
　図２は、キャリアフィルムの材料として、波長分布の大部分において紫外線レーザの吸収率が高い材料が用いられた場合の問題を、さらに詳しく説明するための図面である。図２（Ａ）ないし（Ｅ）は、紫外線レーザによる、シート部材に貫通孔を形成する工程を含む電子部品の製造方法の一例において、順次行われる各工程の要部を、それぞれ模式的に表す断面図である。 FIG. 2 is a diagram for explaining in more detail the problem when a material having a high absorption rate of an ultraviolet laser is used in most of the wavelength distribution as the material of the carrier film. 2 (A) to 2 (E) schematically show the main part of each step sequentially performed in an example of a method of manufacturing an electronic component including a step of forming a through hole in a sheet member by an ultraviolet laser. It is sectional drawing.
　図２（Ａ）は、キャリアフィルム１１０が作製または準備される工程を示す断面図であ
る。キャリアフィルム１１０には、例えばポリエチレンナフタレート（以下、ＰＥＮと略記）のような、前述の波長分布の大部分において、紫外線レーザの吸収率が高い材料が用いられている。図２（Ｂ）は、キャリアフィルム１１０の一方主面上に、シート部材１２０が成形される工程を示す断面図である。シート部材１２０の材質および成形方法は、特に限定されない。 FIG. 2A is a cross-sectional view illustrating a process in which the carrier film 110 is manufactured or prepared. The carrier film 110 is made of a material having a high absorption rate of an ultraviolet laser in most of the wavelength distribution described above, such as polyethylene naphthalate (hereinafter abbreviated as PEN). FIG. 2B is a cross-sectional view illustrating a process in which the sheet member 120 is formed on one main surface of the carrier film 110. The material and molding method of the sheet member 120 are not particularly limited.
　図２（Ｃ）は、紫外線レーザＢの照射により、キャリアフィルム１１０およびその一方主面上に成形されたシート部材１２０に、貫通孔１３０が形成される工程を示す断面図である。紫外線レーザＢは、キャリアフィルム１１０の他方主面側から照射される。その結果、キャリアフィルム１１０およびシート部材１２０に貫通孔１３０が形成される。 FIG. 2C is a cross-sectional view showing a process in which the through hole 130 is formed in the sheet member 120 formed on the carrier film 110 and one main surface thereof by irradiation with the ultraviolet laser B. The ultraviolet laser B is irradiated from the other main surface side of the carrier film 110. As a result, a through hole 130 is formed in the carrier film 110 and the sheet member 120.
　紫外線レーザＢにおける中心波長近傍の成分は、キャリアフィルム１１０の他方主面側から吸収されやすい。そのため、キャリアフィルム１１０は、紫外線レーザＢにおける中心波長近傍の成分により、他方主面側から穿孔されていく。一方、前述の波長が３７５ｎｍ以上の成分は、キャリアフィルム１１０の一方主面側から吸収されやすい。そのため、キャリアフィルム１１０は、上記の成分により一方主面側からも穿孔されていく。 The component near the center wavelength in the ultraviolet laser B is easily absorbed from the other main surface side of the carrier film 110. Therefore, the carrier film 110 is perforated from the other main surface side by the component near the center wavelength in the ultraviolet laser B. On the other hand, the component having the wavelength of 375 nm or more is easily absorbed from the one main surface side of the carrier film 110. Therefore, the carrier film 110 is also perforated from the one main surface side by the above components.
　その際、キャリアフィルム１１０の一方主面上にはシート部材１２０があるため、両者の界面では穿孔時に発生する熱が籠りやすくなっている。したがって、紫外線レーザＢにおける波長が３７５ｎｍ以上の成分による加工が過剰に進み、図２（Ｃ）に示されるように、両者の界面近傍に孔径が大きくなった部分１３０ａが形成される。 At that time, since the sheet member 120 is provided on one main surface of the carrier film 110, heat generated during perforation is easily generated at the interface between the two. Therefore, the processing with the component having a wavelength of 375 nm or more in the ultraviolet laser B proceeds excessively, and as shown in FIG. 2C, a portion 130a having a large hole diameter is formed near the interface between the two.
　図２（Ｄ）は、キャリアフィルム１１０およびシート部材１２０に形成された貫通孔に、導電性ペースト１４０が充填される工程を示す断面図である。導電性ペースト１４０は、キャリアフィルム１１０とシート部材１２０との界面近傍の、孔径が大きくなった部分１３０ａにも充填される。 FIG. 2D is a cross-sectional view showing a process of filling the through holes formed in the carrier film 110 and the sheet member 120 with the conductive paste 140. The conductive paste 140 is also filled in a portion 130 a where the hole diameter is increased near the interface between the carrier film 110 and the sheet member 120.
　図２（Ｅ）は、シート部材１２０からキャリアフィルム１１０が剥離される工程を示す断面図である。導電性ペースト１４０が、孔径の大きくなった部分１３０ａにも充填された結果、キャリアフィルム１１０の剥離後のシート部材１２０上には、導電性ペースト１４０の、意図しない貫通孔からのはみ出し部１４０ａが発生する。ひいては、図２（Ｅ）には図示されていないが、ビア導体が複数設けられる場合には、隣接するビア導体同士が接触する虞が生じる。 FIG. 2E is a cross-sectional view illustrating a process in which the carrier film 110 is peeled from the sheet member 120. As a result of filling the conductive paste 140 also into the portion 130a having a large hole diameter, the protruding portion 140a of the conductive paste 140 from an unintended through hole is formed on the sheet member 120 after the carrier film 110 is peeled off. appear. Eventually, although not shown in FIG. 2E, when a plurality of via conductors are provided, there is a possibility that adjacent via conductors come into contact with each other.
　上記の問題は、キャリアフィルム上に、シート部材としてセラミックグリーンシートが成形された場合のみならず、樹脂シートが成形された場合にも起こり得る。また、上記の問題は、シート部材に貫通孔が形成される場合のみならず、有底孔が形成される場合にも起こり得る。 The above problem can occur not only when a ceramic green sheet is formed as a sheet member on a carrier film but also when a resin sheet is formed. In addition, the above problem may occur not only when the through hole is formed in the sheet member but also when the bottomed hole is formed.
　この発明の目的は、キャリアフィルム上に成形されたシート部材に、紫外線レーザにより貫通孔および有底孔の少なくとも一方である孔が形成される際に、両者の界面近傍における過剰な加工が抑えられるキャリアフィルムを提供することである。また、上記のキャリアフィルムが用いられる電子部品の製造方法を提供することである。 An object of the present invention is to suppress excessive processing in the vicinity of the interface between a through hole and a bottomed hole when an ultraviolet laser is formed on a sheet member formed on a carrier film. It is to provide a carrier film. Moreover, it is providing the manufacturing method of the electronic component in which said carrier film is used.
　この発明に係るキャリアフィルムでは、照射された紫外線レーザの吸収率についての改良が図られる。 In the carrier film according to the present invention, the absorption rate of the irradiated ultraviolet laser can be improved.
　この発明は、まずキャリアフィルムに向けられる。
　この発明に係るキャリアフィルムは、シート部材の成形に用いられる。そして、中心波長が３５５ｎｍ～３６５ｎｍであり、３７５ｎｍ以上の波長が含まれる波長分布を有する紫外線レーザが照射されたとき、紫外線レーザの波長分布における３７５ｎｍ未満の成分の吸収率が５０％以上である。また、紫外線レーザの波長分布における３７５ｎｍ以上の成分の吸収率が５０％未満である。 The present invention is first directed to a carrier film.
The carrier film according to the present invention is used for forming a sheet member. When an ultraviolet laser having a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more is irradiated, the absorptance of components less than 375 nm in the wavelength distribution of the ultraviolet laser is 50% or more. Moreover, the absorptance of a component of 375 nm or more in the wavelength distribution of the ultraviolet laser is less than 50%.
　上記のキャリアフィルムでは、一方主面にシート部材が成形され、上記の紫外線レーザが他方主面側から照射された場合、波長が３７５ｎｍ以上の成分の、一方主面側からの吸収が抑えられる。そのため、キャリアフィルムに貫通孔が形成され、シート部材に紫外線レーザにより貫通孔および有底孔の少なくとも一方である孔が形成される際に、両者の界面近傍における過剰な加工が抑えられる。 In the above carrier film, when a sheet member is formed on one main surface and the above ultraviolet laser is irradiated from the other main surface side, absorption of components having a wavelength of 375 nm or more from the one main surface side is suppressed. Therefore, when the through hole is formed in the carrier film and the hole that is at least one of the through hole and the bottomed hole is formed in the sheet member by the ultraviolet laser, excessive processing in the vicinity of the interface between the two is suppressed.
　この発明に係るキャリアフィルムは、以下の特徴を備えることが好ましい。すなわち、この発明に係るキャリアフィルムは、ポリエチレンテレフタレート（ＰＥＴ）とポリエチレンナフタレート（ＰＥＮ）とを含んでいる。そして、ＰＥＮの重量の、ＰＥＴの重量とＰＥＮの重量との和に対する比が、０．０５以上０．２５以下である。 The carrier film according to the present invention preferably has the following characteristics. That is, the carrier film according to the present invention includes polyethylene terephthalate (PET) and polyethylene naphthalate (PEN). The ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less.
　上記のキャリアフィルムでは、一方主面にシート部材が成形され、前述の紫外線レーザが他方主面側から照射された場合、波長が３７５ｎｍ以上の成分の、一方主面側からの吸収の抑制が容易に実現される。 In the above carrier film, when a sheet member is formed on one main surface and the aforementioned ultraviolet laser is irradiated from the other main surface side, it is easy to suppress absorption of components having a wavelength of 375 nm or more from the one main surface side. To be realized.
　また、この発明は、電子部品の製造方法にも向けられる。
　この発明に係る電子部品の製造方法は、キャリアフィルム上に成形されたシート部材に貫通孔および有底孔の少なくとも一方である孔を形成する工程を含んでいる。そして、この発明に係る電子部品の製造方法は、以下の第１ないし第５の工程を備えている。 The present invention is also directed to a method for manufacturing an electronic component.
The method for manufacturing an electronic component according to the present invention includes a step of forming a hole which is at least one of a through hole and a bottomed hole in a sheet member formed on a carrier film. And the manufacturing method of the electronic component which concerns on this invention is equipped with the following 1st thru | or 5th processes.
　第１の工程は、キャリアフィルムが作製または準備される工程である。第２の工程は、キャリアフィルムの一方主面上に、シート部材が成形される工程である。第３の工程は、キャリアフィルムおよびキャリアフィルム上に成形されたシート部材に、紫外線レーザがキャリアフィルムの他方主面側から照射されることにより、キャリアフィルムに貫通孔が形成され、シート部材に貫通孔および有底孔の少なくとも一方である孔が形成される工程である。紫外線レーザは、中心波長が３５５ｎｍ～３６５ｎｍであり、３７５ｎｍ以上の波長が含まれる波長分布を有している。 The first step is a step in which a carrier film is produced or prepared. A 2nd process is a process by which a sheet | seat member is shape | molded on the one main surface of a carrier film. In the third step, the carrier film and the sheet member formed on the carrier film are irradiated with an ultraviolet laser from the other main surface side of the carrier film, whereby a through-hole is formed in the carrier film and penetrates the sheet member. In this step, a hole that is at least one of a hole and a bottomed hole is formed. The ultraviolet laser has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more.
　第４の工程は、キャリアフィルムに形成された貫通孔およびシート部材に形成された上記の孔に、導電性ペーストが充填される工程である。第５の工程は、上記の孔に導電性ペーストが充填されたシート部材から、キャリアフィルムが剥離される工程である。そして、上記のキャリアフィルムは、前述のこの発明に係るキャリアフィルムである。 The fourth step is a step in which the through-hole formed in the carrier film and the hole formed in the sheet member are filled with the conductive paste. The fifth step is a step in which the carrier film is peeled from the sheet member in which the hole is filled with the conductive paste. And said carrier film is a carrier film which concerns on this invention mentioned above.
　上記の電子部品の製造方法では、この発明に係るキャリアフィルムが用いられる。そのため、紫外線レーザによりキャリアフィルムに貫通孔が形成され、シート部材に上記の孔が形成される際に、両者の界面近傍における過剰な加工が抑えられる。したがって、キャリアフィルムの剥離後のシート部材上における、導電性ペーストの上記の孔からのはみ出しが抑えられる。ひいては、隣接するビア導体の接触が抑えられる。 In the above electronic component manufacturing method, the carrier film according to the present invention is used. Therefore, when the through hole is formed in the carrier film by the ultraviolet laser and the above hole is formed in the sheet member, excessive processing in the vicinity of the interface between the two is suppressed. Therefore, the protrusion of the conductive paste from the above-mentioned hole on the sheet member after peeling of the carrier film is suppressed. As a result, contact between adjacent via conductors is suppressed.
　この発明に係るキャリアフィルムでは、紫外線レーザによりキャリアフィルムに貫通孔が形成され、シート部材に上記の孔が形成される際に、両者の界面近傍における過剰な加工が抑えられる。また、この発明に係る電子部品の製造方法では、キャリアフィルムの剥離後のシート部材上における、導電性ペーストの上記の孔からのはみ出しが抑えられる。ひいては、隣接するビア導体の接触が抑えられる。 In the carrier film according to the present invention, when the through hole is formed in the carrier film by the ultraviolet laser and the above hole is formed in the sheet member, excessive processing in the vicinity of the interface between the two is suppressed. Moreover, in the manufacturing method of the electronic component which concerns on this invention, the protrusion from the said hole of the electrically conductive paste on the sheet | seat member after peeling of a carrier film is suppressed. As a result, contact between adjacent via conductors is suppressed.
この発明に係るキャリアフィルムが用いられた電子部品の製造方法の一例について説明した図面である。It is drawing explaining an example of the manufacturing method of the electronic component using the carrier film which concerns on this invention. この発明が解決しようとする課題を説明するための、波長分布の大部分において紫外線レーザの吸収率が高い材料からなるキャリアフィルムが用いられた電子部品の製造方法の一例について説明した図面である。BRIEF DESCRIPTION OF THE DRAWINGS It is drawing explaining the example of the manufacturing method of the electronic component using the carrier film which consists of material with a high absorption factor of an ultraviolet laser in most wavelength distribution for demonstrating the subject which this invention tends to solve.
　以下にこの発明の実施形態を示して、この発明の特徴とするところをさらに詳しく説明する。この発明は、例えばセラミック多層基板およびセラミック燃料電池など、セラミックグリーンシートを成形して製造されるセラミック電子部品の製造、ならびに樹脂多層基板などの非セラミック電子部品の製造のいずれにも広く適用される。 Embodiments of the present invention will be shown below, and the features of the present invention will be described in more detail. The present invention is widely applied to both the manufacture of ceramic electronic parts manufactured by molding ceramic green sheets such as ceramic multilayer substrates and ceramic fuel cells, and the manufacture of non-ceramic electronic components such as resin multilayer substrates. .
　－キャリアフィルムの実施形態－
　所定の紫外線レーザにおける波長分布の大部分に対して、吸収率が高い材料からなるキャリアフィルムに、その紫外線レーザが照射された場合、キャリアフィルムは、照射面およびその対向面の両面から穿孔されていく。すなわち、前述したように、対向面側において、過剰に加工された部分が発生する。このような課題を解決するため、発明者は鋭意研究を重ねた結果、対向面における紫外線レーザの吸収を抑える条件を見出し、この発明を為すに至った。 -Embodiment of carrier film-
When a carrier film made of a material having a high absorptance is irradiated with respect to most of the wavelength distribution in a predetermined ultraviolet laser, the carrier film is perforated from both the irradiation surface and the opposite surface. Go. That is, as described above, an excessively processed portion is generated on the facing surface side. In order to solve such problems, the inventor has conducted extensive research, and as a result, has found a condition for suppressing the absorption of the ultraviolet laser on the opposite surface, and has made the present invention.
　この発明に係るキャリアフィルムは、以下の特徴を有している。すなわち、中心波長が３５５ｎｍ～３６５ｎｍであり、３７５ｎｍ以上の波長が含まれる波長分布を有する紫外線レーザが照射されたとき、紫外線レーザの波長分布における３７５ｎｍ未満の成分の吸収率が５０％以上である。また、紫外線レーザの波長分布における３７５ｎｍ以上の成分の吸収率が５０％未満である。 The carrier film according to the present invention has the following characteristics. That is, when an ultraviolet laser having a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more is irradiated, the absorptance of components less than 375 nm in the wavelength distribution of the ultraviolet laser is 50% or more. Moreover, the absorptance of a component of 375 nm or more in the wavelength distribution of the ultraviolet laser is less than 50%.
　上記の条件は、キャリアフィルムがＰＥＴとＰＥＮとを含み、かつＰＥＮの重量の、ＰＥＴの重量とＰＥＮの重量との和に対する比が、０．０５以上０．２５以下とされることで実現される。また、上記の条件は、キャリアフィルムがＰＥＴと紫外線吸収剤とを含むようにすることでも実現される。ただし、上記の条件が実現されるためのキャリアフィルムの具体的な構成は、これらに限られない。 The above condition is realized when the carrier film includes PET and PEN, and the ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less. The Moreover, said conditions are implement | achieved also by making a carrier film contain PET and a ultraviolet absorber. However, the specific configuration of the carrier film for realizing the above conditions is not limited to these.
　紫外線吸収剤は、フェニルサリシレート、ｐ－ｔｅｒｔ－ブチルフェニルサリシレート、２,４－ジヒドロキシベンゾフェノン、２－ヒドロキシ－４－メトキシベンゾフェノン、２－（２´－ヒドロキシ－５´－メチルフェニル）ベンゾトリアゾール、２－（２´－ヒドロキシ－５´－ｔｅｒｔ－メチルフェニル）ベンゾトリアゾール、２－（２Ｈ－ベンゾトリアゾール－２－イル）－４－６－ビス（１－メチル－１－フェニルエチル）フェノール、２－エチルヘキシル－２－シアノ－３,３´－ジフェニルアクリレート、エチル－２－シアノ－３,３´－ジフェニルアクリレートの中から選ばれる少なくとも１種の有機化合物である。 UV absorbers include phenyl salicylate, p-tert-butylphenyl salicylate, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2 -(2'-hydroxy-5'-tert-methylphenyl) benzotriazole, 2- (2H-benzotriazol-2-yl) -4-6-bis (1-methyl-1-phenylethyl) phenol, 2- It is at least one organic compound selected from ethylhexyl-2-cyano-3,3′-diphenyl acrylate and ethyl-2-cyano-3,3′-diphenyl acrylate.
　この発明を実験例に基づいてより具体的に説明する。キャリアフィルムは厚さ２５μｍとなるように作製されている。キャリアフィルムの一方主面には、シート部材が、厚さ１０μｍとなるように成形されている。ここで、シート部材は、低温焼成セラミック材料を含むセラミックグリーンシートである。キャリアフィルムに照射される紫外線レーザは、中心波長が３５５ｎｍ～３６５ｎｍであり、３７５ｎｍ以上の波長が含まれる波長分布を有するものである。紫外線レーザは、キャリアフィルムの他方主面側から照射される。この実験例においては、上記の紫外線レーザの照射により、キャリアフィルムとシート部材との両方に貫通孔が形成される。 This invention will be described more specifically based on experimental examples. The carrier film is prepared to have a thickness of 25 μm. A sheet member is formed on one main surface of the carrier film so as to have a thickness of 10 μm. Here, the sheet member is a ceramic green sheet containing a low-temperature fired ceramic material. The ultraviolet laser applied to the carrier film has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more. The ultraviolet laser is irradiated from the other main surface side of the carrier film. In this experimental example, through holes are formed in both the carrier film and the sheet member by the irradiation of the ultraviolet laser.
　この実験例により、上記の紫外線レーザがキャリアフィルムに照射されたときの、波長が３７５ｎｍ未満の成分の吸収率と、３７５ｎｍ以上の成分の吸収率とが規定される。実験例に用いられたキャリアフィルムは、例えば２軸延伸法のような、既知の工法により作製され得る。 This experimental example defines the absorptance of a component having a wavelength of less than 375 nm and the absorptance of a component having a wavelength of 375 nm or more when the carrier film is irradiated with the above-described ultraviolet laser. The carrier film used in the experimental example can be produced by a known method such as a biaxial stretching method.
　表１には、上記の紫外線レーザが、この実験例の種々のキャリアフィルムに照射されたときの、紫外線レーザの吸収率と、形成された貫通孔の種々の位置における開口径の値とが示されている。紫外線レーザの吸収率は、波長λが３００ｎｍ以上３５５ｎｍ未満の成分と、波長λが３５５ｎｍ以上３７５ｎｍ未満の成分と、波長λが３７５ｎｍ以上４２５ｎｍ未満の成分とに分けて示されている。紫外線レーザの各波長成分の吸収率は、分光光度計により測定される。なお、表１の「フィルム」は、キャリアフィルムを表し、「シート」は、シート部材を表す。 Table 1 shows the absorption rate of the ultraviolet laser and the values of the opening diameters at various positions of the formed through-holes when the above-described ultraviolet laser is irradiated onto various carrier films of this experimental example. Has been. The absorption rate of the ultraviolet laser is divided into a component having a wavelength λ of 300 nm or more and less than 355 nm, a component having a wavelength λ of 355 nm or more and less than 375 nm, and a component having a wavelength λ of 375 nm or more and less than 425 nm. The absorptance of each wavelength component of the ultraviolet laser is measured by a spectrophotometer. In Table 1, “film” represents a carrier film, and “sheet” represents a sheet member.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　試料１のように、波長分布の大部分に対して吸収率が低い場合、所定の時間内での貫通孔の形成が困難であった。また、試料２のように、波長λが３７５ｎｍ未満の成分のうち、吸収率が５０％未満のものがあり、波長λが３７５ｎｍ以上の成分の吸収率が５０％以上である場合、形成された貫通孔の形状が不定形となった。これは、キャリアフィルムの一方主面側およびシート部材側からの加工が進み、キャリアフィルムおよびシート部材の熱分解により発生したガスにより、キャリアフィルムの他方主面側からの加工が妨げられたためと考えられる。 When sample 1 has a low absorptance with respect to most of the wavelength distribution, it was difficult to form a through hole within a predetermined time. Also, as in Sample 2, there was a component having an absorption rate of less than 50% among components having a wavelength λ of less than 375 nm, and the component having a wavelength λ of 375 nm or more was formed when the absorption rate was 50% or more. The shape of the through hole became irregular. This is thought to be because the processing from the one main surface side and the sheet member side of the carrier film progressed, and the processing from the other main surface side of the carrier film was hindered by the gas generated by the thermal decomposition of the carrier film and the sheet member. It is done.
　また、試料６ないし８のように、波長分布の大部分に対して吸収率が高い場合、キャリアフィルムとシート部材との界面近傍が過剰に加工される。その結果、キャリアフィルムにおける紫外線レーザの出射側およびシート部材における紫外線レーザの入射側の開口径の値が、いずれも１００μｍ以上となる。 Also, as in samples 6 to 8, when the absorption rate is high for most of the wavelength distribution, the vicinity of the interface between the carrier film and the sheet member is excessively processed. As a result, the values of the opening diameters on the emission side of the ultraviolet laser in the carrier film and the incidence side of the ultraviolet laser in the sheet member are both 100 μm or more.
　一方、試料３ないし５のように、波長λが３７５ｎｍ未満の成分の吸収率が５０％以上であり、波長λが３７５ｎｍ以上の成分の吸収率が５０％未満である場合、貫通孔の種々の位置における開口径の値は、いずれも１００μｍ未満であった。ここで、試料３では、ＰＥＮとＰＥＴの重量の和に対するＰＥＮの重量比が０．０５、試料４では、ＰＥＮとＰＥＴの重量の和に対するＰＥＮの重量比が０．１４、試料５では、ＰＥＮとＰＥＴの重量の和に対するＰＥＮの重量比が０．２５である。したがって、キャリアフィルムにおいて、ＰＥＴの重量とＰＥＮの重量との和に対するＰＥＮの重量比が、０．０５以上０．２５以下である場合、良好な加工結果が得られる。 On the other hand, when the absorption rate of the component having the wavelength λ of less than 375 nm is 50% or more and the absorption rate of the component having the wavelength λ of 375 nm or more is less than 50% as in the samples 3 to 5, The value of the opening diameter at the position was less than 100 μm. Here, in sample 3, the weight ratio of PEN to the sum of the weights of PEN and PET is 0.05, in sample 4, the weight ratio of PEN to the sum of the weights of PEN and PET is 0.14, and in sample 5, PEN The weight ratio of PEN to the sum of PET and PET is 0.25. Therefore, in the carrier film, when the weight ratio of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less, good processing results can be obtained.
　－電子部品の製造方法－
　図１は、この発明に係るキャリアフィルムが用いられた電子部品の製造方法の一例について説明した図面である。図１（Ａ）ないし（Ｅ）は、キャリアフィルム上に成形されたシート部材に、貫通孔および有底孔の少なくとも一方である孔を形成する工程を含む、電子部品の製造方法の一例において、順次行われる各工程の要部を、それぞれ模式的に表す断面図である。 -Manufacturing method of electronic parts-
FIG. 1 is a drawing for explaining an example of a method for manufacturing an electronic component using a carrier film according to the present invention. FIGS. 1A to 1E show an example of a method for manufacturing an electronic component including a step of forming a hole that is at least one of a through hole and a bottomed hole in a sheet member formed on a carrier film. It is sectional drawing which represents each principal part of each process performed sequentially typically.
　この例では、紫外線レーザの照射により、キャリアフィルムとシート部材との両方に貫通孔が形成される場合が示されているが、キャリアフィルムに貫通孔が形成され、シート部材に有底孔が形成されるようにしてもよい。 In this example, the case where through holes are formed in both the carrier film and the sheet member by irradiation with an ultraviolet laser is shown, but the through holes are formed in the carrier film and the bottomed holes are formed in the sheet member. You may be made to do.
　なお、各図面は模式図であり、実際の製品の寸法は必ずしも反映されていない。また、製造工程上で発生する各構成要素の形状のばらつきなども、各図面に必ずしも反映されていない。すなわち、以後、この明細書中で説明のために用いられる図面は、たとえ実際の製品と異なる部分があったとしても、本質的な面で実際の製品を表すものと言うことができる。 Note that each drawing is a schematic diagram, and the actual product dimensions are not necessarily reflected. Further, variations in the shape of each component generated in the manufacturing process are not necessarily reflected in each drawing. That is, hereinafter, the drawings used for explanation in this specification can be said to represent an actual product in an essential aspect even if there are different parts from the actual product.
　図１（Ａ）は、キャリアフィルム１０が作製または準備される工程（第１の工程）を示す断面図である。キャリアフィルム１０は、この発明に係るキャリアフィルムであり、ＰＥＮおよびＰＥＴを前述した重量比で含んでいる。すなわち、ＰＥＮの重量の、ＰＥＴの重量とＰＥＮの重量との和に対する比が、０．０５以上０．２５以下である。キャリアフィルム１０は、貫通孔の形成に要する時間と、後述の第２の工程でその上に形成されるシート部材２０の取り扱いとが考慮されることにより、例えば２５μｍから１００μｍの間の厚みとなるように作製される。 FIG. 1A is a cross-sectional view showing a step (first step) in which the carrier film 10 is produced or prepared. The carrier film 10 is a carrier film according to the present invention, and includes PEN and PET in the weight ratio described above. That is, the ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less. The carrier film 10 has a thickness of, for example, 25 μm to 100 μm by considering the time required for forming the through hole and the handling of the sheet member 20 formed thereon in the second step described later. It is produced as follows.
　キャリアフィルム１０の一方主面側（後述の第２の工程でシート部材２０が形成される側）には、後述する第５の工程においてシート部材２０の剥離性を向上させるための離型層が付与されていてもよい。離型層は、シリコーン樹脂またはフッ素樹脂を用いて形成される。 On one main surface side (the side on which the sheet member 20 is formed in the second step described later) of the carrier film 10, there is a release layer for improving the peelability of the sheet member 20 in the fifth step described later. It may be given. The release layer is formed using a silicone resin or a fluororesin.
　また、キャリアフィルム１０には、熱膨張係数の調整、機械的強度の向上、および巻きずれの防止などのため、無機材料粉末が添加されていてもよい。無機材料粉末の材質は、酸化アルミニウムなどの酸化物、窒化ケイ素などの窒化物、および炭化ケイ素などの炭化物のうちから選ばれる少なくとも１種類である。無機材料粉末の形状は、球状またはフレーク状である。充填性の観点からは、球状が好ましい。 In addition, inorganic material powder may be added to the carrier film 10 in order to adjust the thermal expansion coefficient, improve the mechanical strength, and prevent winding slippage. The material of the inorganic material powder is at least one selected from oxides such as aluminum oxide, nitrides such as silicon nitride, and carbides such as silicon carbide. The shape of the inorganic material powder is spherical or flaky. From the viewpoint of filling properties, a spherical shape is preferable.
　図１（Ｂ）は、キャリアフィルム１０の一方主面上に、シート部材２０が成形される工程（第２の工程）を示す断面図である。ここで、シート部材２０は、低温焼成セラミック材料を含むセラミックグリーンシートである。例えば、セラミック材料の粉末、バインダー、可塑剤および有機溶剤が混合されてなるスラリが、キャリアフィルム１０の一方主面上にリップコータなどを用いて塗工されることにより、シート部材２０となる。シート部材２０は、例えば５μｍから１００μｍの間の厚みとなるように成形されている。 FIG. 1B is a cross-sectional view showing a step (second step) in which the sheet member 20 is formed on one main surface of the carrier film 10. Here, the sheet member 20 is a ceramic green sheet containing a low-temperature fired ceramic material. For example, a slurry in which a ceramic material powder, a binder, a plasticizer, and an organic solvent are mixed is applied onto one main surface of the carrier film 10 using a lip coater or the like, thereby forming the sheet member 20. The sheet member 20 is formed to have a thickness between 5 μm and 100 μm, for example.
　図１（Ｃ）は、紫外線レーザＢの照射により、キャリアフィルム１０およびその一方主面上に成形されたシート部材２０に貫通孔３０が形成される工程（第３の工程）を示す断面図である。紫外線レーザＢは、キャリアフィルム１０の他方主面側から照射される。紫外線レーザＢは、中心波長が３５５ｎｍ～３６５ｎｍであり、３７５ｎｍ以上の波長が含まれる波長分布を有している。その結果、キャリアフィルム１０およびシート部材２０の両者に貫通孔３０が開けられる。貫通孔３０の孔径は、例えば２０μｍから２００μｍの間に設定される。 FIG. 1C is a cross-sectional view showing a step (third step) in which through holes 30 are formed in the carrier film 10 and the sheet member 20 formed on one main surface thereof by irradiation with the ultraviolet laser B. is there. The ultraviolet laser B is irradiated from the other main surface side of the carrier film 10. The ultraviolet laser B has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more. As a result, the through hole 30 is opened in both the carrier film 10 and the sheet member 20. The diameter of the through hole 30 is set between 20 μm and 200 μm, for example.
　キャリアフィルム１０は、前述したようにこの発明に係るキャリアフィルムである。すなわち、一方主面にシート部材２０が成形されたキャリアフィルム１０に、紫外線レーザＢが他方主面側から照射された場合、波長が３７５ｎｍ以上の成分の、一方主面側からの吸収が抑えられる。そのため、キャリアフィルム１０およびその上に成形されたシート部材２０に、紫外線レーザによる貫通孔３０が形成される際に、両者の界面近傍における過剰な加工が抑えられる。 The carrier film 10 is a carrier film according to the present invention as described above. That is, when the ultraviolet laser B is irradiated from the other main surface side to the carrier film 10 having the sheet member 20 formed on one main surface, absorption of components having a wavelength of 375 nm or more from the one main surface side is suppressed. . Therefore, when the through hole 30 is formed by the ultraviolet laser in the carrier film 10 and the sheet member 20 formed thereon, excessive processing in the vicinity of the interface between the two is suppressed.
　図１（Ｄ）は、キャリアフィルム１０およびシート部材２０に形成された貫通孔３０に、導電性ペースト４０が充填される工程（第４の工程）を示す断面図である。導電性ペースト４０の材質および充填方法は、特に限定されない。例えば、銅などの金属粉末、バインダー、可塑剤および有機溶剤が混合されてなる導電性ペースト４０が、貫通孔３０にスクリーン印刷機などを用いて充填される。 FIG. 1D is a cross-sectional view showing a step (fourth step) in which the through-hole 30 formed in the carrier film 10 and the sheet member 20 is filled with the conductive paste 40. The material and filling method of the conductive paste 40 are not particularly limited. For example, a conductive paste 40 in which a metal powder such as copper, a binder, a plasticizer, and an organic solvent are mixed is filled in the through holes 30 using a screen printer or the like.
　また、導電性ペースト４０には、焼結時の収縮率の調整などのため、無機材料粉末が添加されていてもよい。無機材料粉末の材質としては、シート部材２０に含まれるセラミック材料粉末が好ましい。 Further, an inorganic material powder may be added to the conductive paste 40 in order to adjust the shrinkage rate during sintering. As a material of the inorganic material powder, a ceramic material powder contained in the sheet member 20 is preferable.
　図１（Ｅ）は、貫通孔に導電性ペースト４０が充填されたシート部材２０から、キャリアフィルムが剥離される工程（第５の工程）を示す断面図である。図１（Ｅ）に示されているように、この発明に係る電子部品の製造方法では、キャリアフィルム１０の剥離後のシート部材２０上の、導電性ペースト４０の貫通孔３０からのはみ出しが抑えられている。その結果、不図示の隣接するビア導体の接触が抑えられる。 FIG. 1E is a cross-sectional view showing a step (fifth step) in which the carrier film is peeled from the sheet member 20 in which the through-holes are filled with the conductive paste 40. As shown in FIG. 1E, in the electronic component manufacturing method according to the present invention, the protrusion of the conductive paste 40 from the through hole 30 on the sheet member 20 after the carrier film 10 is peeled off is suppressed. It has been. As a result, contact between adjacent via conductors (not shown) is suppressed.
　上記の電子部品の製造方法の例は、シート部材がセラミックグリーンシートである場合について説明されたものであるが、シート部材が樹脂シートであっても同様の工程が実施され、同様の効果が得られる。また、この例では、シート部材に貫通孔が形成される場合について説明されたものであるが、紫外線レーザの照射時間およびエネルギーの少なくとも一方を変えることにより有底孔が形成された場合であっても、やはり同様の効果が得られる。 The example of the electronic component manufacturing method described above is for the case where the sheet member is a ceramic green sheet. However, even if the sheet member is a resin sheet, the same process is performed and the same effect is obtained. It is done. Further, in this example, the case where the through hole is formed in the sheet member is described, but the case where the bottomed hole is formed by changing at least one of the irradiation time and energy of the ultraviolet laser. However, the same effect can be obtained.
　なお、この明細書に記載の実施形態は、例示的なものであって、この発明は上記の実施形態に限定されるものではなく、この発明の範囲内において、種々の応用、変形を加えることができる。 The embodiments described in this specification are illustrative, and the present invention is not limited to the above-described embodiments, and various applications and modifications are added within the scope of the present invention. Can do.
１０　　キャリアフィルム
２０　　シート部材
３０　　貫通孔
４０　　導電性ペースト 10 Carrier film 20 Sheet member 30 Through-hole 40 Conductive paste

Claims (3)

  1. 　シート部材の成形に用いられるキャリアフィルムであって、
    　中心波長が３５５ｎｍ～３６５ｎｍであり、３７５ｎｍ以上の波長が含まれる波長分布を有する紫外線レーザが照射されたとき、
    　前記紫外線レーザの波長分布における３７５ｎｍ未満の成分の吸収率が５０％以上であり、前記紫外線レーザの波長分布における３７５ｎｍ以上の成分の吸収率が５０％未満であることを特徴とする、キャリアフィルム。     A carrier film used for forming a sheet member,
    When an ultraviolet laser having a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more is irradiated,
    The carrier film, wherein an absorption rate of a component of less than 375 nm in the wavelength distribution of the ultraviolet laser is 50% or more, and an absorption rate of a component of 375 nm or more in the wavelength distribution of the ultraviolet laser is less than 50%.
  2. 　ポリエチレンテレフタレートと、ポリエチレンナフタレートとを含んでおり、
    　ポリエチレンナフタレートの重量の、ポリエチレンテレフタレートの重量とポリエチレンナフタレートの重量との和に対する比が、０．０５以上０．２５以下であることを特徴とする、請求項１に記載のキャリアフィルム。     Contains polyethylene terephthalate and polyethylene naphthalate,
    The carrier film according to claim 1, wherein the ratio of the weight of polyethylene naphthalate to the sum of the weight of polyethylene terephthalate and the weight of polyethylene naphthalate is 0.05 or more and 0.25 or less.
  3. 　キャリアフィルム上に成形されたシート部材に貫通孔および有底孔の少なくとも一方である孔を形成する工程を含む電子部品の製造方法であって、
    　前記キャリアフィルムが作製または準備される第１の工程と、
    　前記キャリアフィルムの一方主面上に、前記シート部材が成形される第２の工程と、
    　前記キャリアフィルムおよび前記キャリアフィルム上に成形された前記シート部材に、中心波長が３５５ｎｍ～３６５ｎｍであり、３７５ｎｍ以上の波長が含まれる波長分布を有する紫外線レーザが、前記キャリアフィルムの他方主面側から照射されることにより、前記キャリアフィルムに貫通孔が形成され、前記シート部材に貫通孔および有底孔の少なくとも一方である孔が形成される第３の工程と、
    　前記キャリアフィルムに形成された前記貫通孔および前記シート部材に形成された前記孔に、導電性ペーストが充填される第４の工程と、
    　前記孔に前記導電性ペーストが充填された前記シート部材から、前記キャリアフィルムが剥離される第５の工程とを備え、
    　前記キャリアフィルムは、請求項１または２に記載のキャリアフィルムであることを特徴とする、電子部品の製造方法。     A method for producing an electronic component comprising a step of forming a hole which is at least one of a through hole and a bottomed hole in a sheet member formed on a carrier film,
    A first step in which the carrier film is produced or prepared;
    A second step in which the sheet member is formed on one main surface of the carrier film;
    The carrier film and the sheet member formed on the carrier film have an ultraviolet laser having a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more from the other main surface side of the carrier film. A third step in which a through hole is formed in the carrier film by irradiation and a hole which is at least one of a through hole and a bottomed hole is formed in the sheet member;
    A fourth step of filling the through-hole formed in the carrier film and the hole formed in the sheet member with a conductive paste;
    A fifth step in which the carrier film is peeled off from the sheet member in which the hole is filled with the conductive paste,
    The method for manufacturing an electronic component according to claim 1, wherein the carrier film is the carrier film according to claim 1.
PCT/JP2018/015898 2017-04-19 2018-04-17 Carrier film and method for manufacturing electronic component WO2018194066A1 (en)

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