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WO2018194066A1 - Film de support et procédé de fabrication de composant électronique - Google Patents

Film de support et procédé de fabrication de composant électronique Download PDF

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Publication number
WO2018194066A1
WO2018194066A1 PCT/JP2018/015898 JP2018015898W WO2018194066A1 WO 2018194066 A1 WO2018194066 A1 WO 2018194066A1 JP 2018015898 W JP2018015898 W JP 2018015898W WO 2018194066 A1 WO2018194066 A1 WO 2018194066A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier film
hole
sheet member
ultraviolet laser
wavelength
Prior art date
Application number
PCT/JP2018/015898
Other languages
English (en)
Japanese (ja)
Inventor
一生 山元
良太 浅井
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2019513655A priority Critical patent/JP6760493B2/ja
Priority to CN201880025656.5A priority patent/CN110521291B/zh
Priority to KR1020197030062A priority patent/KR102193968B1/ko
Publication of WO2018194066A1 publication Critical patent/WO2018194066A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00—Producing shaped prefabricated articles from the material
    • B28B1/30—Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to a carrier film used for molding a sheet member, and a method of manufacturing an electronic component including a step of forming a hole which is at least one of a through hole and a bottomed hole in a sheet member molded thereon. It is.
  • the sheet member is used as a component member of an electronic component or a component member of an intermediate product in the manufacturing process of the electronic component.
  • An example of the sheet member is a ceramic green sheet.
  • a method for manufacturing a ceramic electronic component including a step of forming a through hole in a ceramic green sheet there is a method for manufacturing a ceramic electronic component described in JP-A-6-304774 (Patent Document 1).
  • a laser is irradiated onto a carrier film made of, for example, polyethylene terephthalate (hereinafter abbreviated as PET) and a ceramic green sheet formed thereon.
  • PET polyethylene terephthalate
  • a laser is irradiated from the carrier film side.
  • through holes are formed in both the carrier film and the ceramic green sheet formed thereon.
  • the above-mentioned through hole is filled with a conductive paste containing metal powder.
  • the ceramic green sheet in which the through hole is filled with the conductive paste is fired after the carrier film is peeled off.
  • the conductive paste filled in the through hole becomes a via conductor after firing.
  • the diameter of via conductors has been reduced with the miniaturization of electronic components.
  • a laser used in a process of forming a through hole for a small-diameter via conductor in a sheet member use of an ultraviolet laser suitable for processing a minute region has been studied.
  • the ultraviolet laser for example, a laser having a wavelength distribution in which the center wavelength is 355 nm and the wavelength of 375 nm or more is included.
  • the material of the carrier film when a material having a low absorption rate of the ultraviolet laser in most of the wavelength distribution is used as the material of the carrier film, it may be difficult to form a through hole in the carrier film.
  • a material for the carrier film when a material having a high absorption rate of the ultraviolet laser in most of the wavelength distribution is used, the formation of through holes in the carrier film is likely to proceed. However, in that case, there is a possibility that the hole diameter in the vicinity of the interface between the carrier film and the sheet member becomes large.
  • FIG. 2 is a diagram for explaining in more detail the problem when a material having a high absorption rate of an ultraviolet laser is used in most of the wavelength distribution as the material of the carrier film.
  • 2 (A) to 2 (E) schematically show the main part of each step sequentially performed in an example of a method of manufacturing an electronic component including a step of forming a through hole in a sheet member by an ultraviolet laser. It is sectional drawing.
  • FIG. 2A is a cross-sectional view illustrating a process in which the carrier film 110 is manufactured or prepared.
  • the carrier film 110 is made of a material having a high absorption rate of an ultraviolet laser in most of the wavelength distribution described above, such as polyethylene naphthalate (hereinafter abbreviated as PEN).
  • FIG. 2B is a cross-sectional view illustrating a process in which the sheet member 120 is formed on one main surface of the carrier film 110.
  • the material and molding method of the sheet member 120 are not particularly limited.
  • FIG. 2C is a cross-sectional view showing a process in which the through hole 130 is formed in the sheet member 120 formed on the carrier film 110 and one main surface thereof by irradiation with the ultraviolet laser B.
  • the ultraviolet laser B is irradiated from the other main surface side of the carrier film 110.
  • a through hole 130 is formed in the carrier film 110 and the sheet member 120.
  • the component near the center wavelength in the ultraviolet laser B is easily absorbed from the other main surface side of the carrier film 110. Therefore, the carrier film 110 is perforated from the other main surface side by the component near the center wavelength in the ultraviolet laser B.
  • the component having the wavelength of 375 nm or more is easily absorbed from the one main surface side of the carrier film 110. Therefore, the carrier film 110 is also perforated from the one main surface side by the above components.
  • FIG. 2D is a cross-sectional view showing a process of filling the through holes formed in the carrier film 110 and the sheet member 120 with the conductive paste 140.
  • the conductive paste 140 is also filled in a portion 130 a where the hole diameter is increased near the interface between the carrier film 110 and the sheet member 120.
  • FIG. 2E is a cross-sectional view illustrating a process in which the carrier film 110 is peeled from the sheet member 120.
  • the protruding portion 140a of the conductive paste 140 from an unintended through hole is formed on the sheet member 120 after the carrier film 110 is peeled off. appear.
  • FIG. 2E when a plurality of via conductors are provided, there is a possibility that adjacent via conductors come into contact with each other.
  • the above problem can occur not only when a ceramic green sheet is formed as a sheet member on a carrier film but also when a resin sheet is formed.
  • the above problem may occur not only when the through hole is formed in the sheet member but also when the bottomed hole is formed.
  • An object of the present invention is to suppress excessive processing in the vicinity of the interface between a through hole and a bottomed hole when an ultraviolet laser is formed on a sheet member formed on a carrier film. It is to provide a carrier film. Moreover, it is providing the manufacturing method of the electronic component in which said carrier film is used.
  • the absorption rate of the irradiated ultraviolet laser can be improved.
  • the present invention is first directed to a carrier film.
  • the carrier film according to the present invention is used for forming a sheet member.
  • an ultraviolet laser having a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more is irradiated, the absorptance of components less than 375 nm in the wavelength distribution of the ultraviolet laser is 50% or more.
  • the absorptance of a component of 375 nm or more in the wavelength distribution of the ultraviolet laser is less than 50%.
  • the above carrier film when a sheet member is formed on one main surface and the above ultraviolet laser is irradiated from the other main surface side, absorption of components having a wavelength of 375 nm or more from the one main surface side is suppressed. Therefore, when the through hole is formed in the carrier film and the hole that is at least one of the through hole and the bottomed hole is formed in the sheet member by the ultraviolet laser, excessive processing in the vicinity of the interface between the two is suppressed.
  • the carrier film according to the present invention preferably has the following characteristics. That is, the carrier film according to the present invention includes polyethylene terephthalate (PET) and polyethylene naphthalate (PEN).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • the ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less.
  • the present invention is also directed to a method for manufacturing an electronic component.
  • the method for manufacturing an electronic component according to the present invention includes a step of forming a hole which is at least one of a through hole and a bottomed hole in a sheet member formed on a carrier film.
  • the manufacturing method of the electronic component which concerns on this invention is equipped with the following 1st thru
  • the first step is a step in which a carrier film is produced or prepared.
  • a 2nd process is a process by which a sheet
  • the carrier film and the sheet member formed on the carrier film are irradiated with an ultraviolet laser from the other main surface side of the carrier film, whereby a through-hole is formed in the carrier film and penetrates the sheet member.
  • a hole that is at least one of a hole and a bottomed hole is formed.
  • the ultraviolet laser has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more.
  • the fourth step is a step in which the through-hole formed in the carrier film and the hole formed in the sheet member are filled with the conductive paste.
  • the fifth step is a step in which the carrier film is peeled from the sheet member in which the hole is filled with the conductive paste.
  • said carrier film is a carrier film which concerns on this invention mentioned above.
  • the carrier film according to the present invention is used. Therefore, when the through hole is formed in the carrier film by the ultraviolet laser and the above hole is formed in the sheet member, excessive processing in the vicinity of the interface between the two is suppressed. Therefore, the protrusion of the conductive paste from the above-mentioned hole on the sheet member after peeling of the carrier film is suppressed. As a result, contact between adjacent via conductors is suppressed.
  • the carrier film according to the present invention when the through hole is formed in the carrier film by the ultraviolet laser and the above hole is formed in the sheet member, excessive processing in the vicinity of the interface between the two is suppressed. Moreover, in the manufacturing method of the electronic component which concerns on this invention, the protrusion from the said hole of the electrically conductive paste on the sheet
  • Embodiments of the present invention will be shown below, and the features of the present invention will be described in more detail.
  • the present invention is widely applied to both the manufacture of ceramic electronic parts manufactured by molding ceramic green sheets such as ceramic multilayer substrates and ceramic fuel cells, and the manufacture of non-ceramic electronic components such as resin multilayer substrates. .
  • the carrier film according to the present invention has the following characteristics. That is, when an ultraviolet laser having a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more is irradiated, the absorptance of components less than 375 nm in the wavelength distribution of the ultraviolet laser is 50% or more. Moreover, the absorptance of a component of 375 nm or more in the wavelength distribution of the ultraviolet laser is less than 50%.
  • the above condition is realized when the carrier film includes PET and PEN, and the ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less.
  • said conditions are implement
  • the specific configuration of the carrier film for realizing the above conditions is not limited to these.
  • UV absorbers include phenyl salicylate, p-tert-butylphenyl salicylate, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2 -(2'-hydroxy-5'-tert-methylphenyl) benzotriazole, 2- (2H-benzotriazol-2-yl) -4-6-bis (1-methyl-1-phenylethyl) phenol, 2- It is at least one organic compound selected from ethylhexyl-2-cyano-3,3′-diphenyl acrylate and ethyl-2-cyano-3,3′-diphenyl acrylate.
  • the carrier film is prepared to have a thickness of 25 ⁇ m.
  • a sheet member is formed on one main surface of the carrier film so as to have a thickness of 10 ⁇ m.
  • the sheet member is a ceramic green sheet containing a low-temperature fired ceramic material.
  • the ultraviolet laser applied to the carrier film has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more. The ultraviolet laser is irradiated from the other main surface side of the carrier film. In this experimental example, through holes are formed in both the carrier film and the sheet member by the irradiation of the ultraviolet laser.
  • This experimental example defines the absorptance of a component having a wavelength of less than 375 nm and the absorptance of a component having a wavelength of 375 nm or more when the carrier film is irradiated with the above-described ultraviolet laser.
  • the carrier film used in the experimental example can be produced by a known method such as a biaxial stretching method.
  • Table 1 shows the absorption rate of the ultraviolet laser and the values of the opening diameters at various positions of the formed through-holes when the above-described ultraviolet laser is irradiated onto various carrier films of this experimental example.
  • the absorption rate of the ultraviolet laser is divided into a component having a wavelength ⁇ of 300 nm or more and less than 355 nm, a component having a wavelength ⁇ of 355 nm or more and less than 375 nm, and a component having a wavelength ⁇ of 375 nm or more and less than 425 nm.
  • the absorptance of each wavelength component of the ultraviolet laser is measured by a spectrophotometer.
  • “film” represents a carrier film
  • sheet represents a sheet member.
  • sample 1 When sample 1 has a low absorptance with respect to most of the wavelength distribution, it was difficult to form a through hole within a predetermined time. Also, as in Sample 2, there was a component having an absorption rate of less than 50% among components having a wavelength ⁇ of less than 375 nm, and the component having a wavelength ⁇ of 375 nm or more was formed when the absorption rate was 50% or more. The shape of the through hole became irregular. This is thought to be because the processing from the one main surface side and the sheet member side of the carrier film progressed, and the processing from the other main surface side of the carrier film was hindered by the gas generated by the thermal decomposition of the carrier film and the sheet member. It is done.
  • the values of the opening diameters on the emission side of the ultraviolet laser in the carrier film and the incidence side of the ultraviolet laser in the sheet member are both 100 ⁇ m or more.
  • the absorption rate of the component having the wavelength ⁇ of less than 375 nm is 50% or more and the absorption rate of the component having the wavelength ⁇ of 375 nm or more is less than 50% as in the samples 3 to 5,
  • the value of the opening diameter at the position was less than 100 ⁇ m.
  • the weight ratio of PEN to the sum of the weights of PEN and PET is 0.05
  • the weight ratio of PEN to the sum of the weights of PEN and PET is 0.14
  • sample 5 PEN
  • the weight ratio of PEN to the sum of PET and PET is 0.25. Therefore, in the carrier film, when the weight ratio of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less, good processing results can be obtained.
  • FIG. 1 is a drawing for explaining an example of a method for manufacturing an electronic component using a carrier film according to the present invention.
  • FIGS. 1A to 1E show an example of a method for manufacturing an electronic component including a step of forming a hole that is at least one of a through hole and a bottomed hole in a sheet member formed on a carrier film. It is sectional drawing which represents each principal part of each process performed sequentially typically.
  • FIG. 1A is a cross-sectional view showing a step (first step) in which the carrier film 10 is produced or prepared.
  • the carrier film 10 is a carrier film according to the present invention, and includes PEN and PET in the weight ratio described above. That is, the ratio of the weight of PEN to the sum of the weight of PET and the weight of PEN is 0.05 or more and 0.25 or less.
  • the carrier film 10 has a thickness of, for example, 25 ⁇ m to 100 ⁇ m by considering the time required for forming the through hole and the handling of the sheet member 20 formed thereon in the second step described later. It is produced as follows.
  • the release layer is formed using a silicone resin or a fluororesin.
  • inorganic material powder may be added to the carrier film 10 in order to adjust the thermal expansion coefficient, improve the mechanical strength, and prevent winding slippage.
  • the material of the inorganic material powder is at least one selected from oxides such as aluminum oxide, nitrides such as silicon nitride, and carbides such as silicon carbide.
  • the shape of the inorganic material powder is spherical or flaky. From the viewpoint of filling properties, a spherical shape is preferable.
  • FIG. 1B is a cross-sectional view showing a step (second step) in which the sheet member 20 is formed on one main surface of the carrier film 10.
  • the sheet member 20 is a ceramic green sheet containing a low-temperature fired ceramic material.
  • a slurry in which a ceramic material powder, a binder, a plasticizer, and an organic solvent are mixed is applied onto one main surface of the carrier film 10 using a lip coater or the like, thereby forming the sheet member 20.
  • the sheet member 20 is formed to have a thickness between 5 ⁇ m and 100 ⁇ m, for example.
  • FIG. 1C is a cross-sectional view showing a step (third step) in which through holes 30 are formed in the carrier film 10 and the sheet member 20 formed on one main surface thereof by irradiation with the ultraviolet laser B. is there.
  • the ultraviolet laser B is irradiated from the other main surface side of the carrier film 10.
  • the ultraviolet laser B has a wavelength distribution including a central wavelength of 355 nm to 365 nm and a wavelength of 375 nm or more.
  • the through hole 30 is opened in both the carrier film 10 and the sheet member 20.
  • the diameter of the through hole 30 is set between 20 ⁇ m and 200 ⁇ m, for example.
  • the carrier film 10 is a carrier film according to the present invention as described above. That is, when the ultraviolet laser B is irradiated from the other main surface side to the carrier film 10 having the sheet member 20 formed on one main surface, absorption of components having a wavelength of 375 nm or more from the one main surface side is suppressed. . Therefore, when the through hole 30 is formed by the ultraviolet laser in the carrier film 10 and the sheet member 20 formed thereon, excessive processing in the vicinity of the interface between the two is suppressed.
  • FIG. 1D is a cross-sectional view showing a step (fourth step) in which the through-hole 30 formed in the carrier film 10 and the sheet member 20 is filled with the conductive paste 40.
  • the material and filling method of the conductive paste 40 are not particularly limited.
  • a conductive paste 40 in which a metal powder such as copper, a binder, a plasticizer, and an organic solvent are mixed is filled in the through holes 30 using a screen printer or the like.
  • an inorganic material powder may be added to the conductive paste 40 in order to adjust the shrinkage rate during sintering.
  • a material of the inorganic material powder a ceramic material powder contained in the sheet member 20 is preferable.
  • FIG. 1E is a cross-sectional view showing a step (fifth step) in which the carrier film is peeled from the sheet member 20 in which the through-holes are filled with the conductive paste 40.
  • the protrusion of the conductive paste 40 from the through hole 30 on the sheet member 20 after the carrier film 10 is peeled off is suppressed. It has been. As a result, contact between adjacent via conductors (not shown) is suppressed.
  • the example of the electronic component manufacturing method described above is for the case where the sheet member is a ceramic green sheet. However, even if the sheet member is a resin sheet, the same process is performed and the same effect is obtained. It is done. Further, in this example, the case where the through hole is formed in the sheet member is described, but the case where the bottomed hole is formed by changing at least one of the irradiation time and energy of the ultraviolet laser. However, the same effect can be obtained.

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un film de support dans lequel, lorsqu'un trou traversant et/ou un trou de fond sont formés au moyen d'un laser ultraviolet dans un élément de feuille moulé sur le film de support, un traitement excessif au voisinage d'une interface entre ceux-ci est supprimé, et un procédé de fabrication d'un composant électronique à l'aide du film de support. Le film de support (10) est utilisé pour mouler un élément de feuille (20) et, lorsqu'il est irradié par un laser ultraviolet (B) avec une distribution de longueur d'onde ayant une longueur d'onde centrale de 355 nm à 365 nm et comprenant une longueur d'onde supérieure ou égale à 375 nm, a un taux d'absorption de pas moins de 50 % par rapport à des composants de moins de 375 nm dans la distribution de longueur d'onde du laser ultraviolet (B) et un taux d'absorption inférieur à 50 % par rapport à des composants de pas moins de 375 nm.
PCT/JP2018/015898 2017-04-19 2018-04-17 Film de support et procédé de fabrication de composant électronique WO2018194066A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019513655A JP6760493B2 (ja) 2017-04-19 2018-04-17 キャリアフィルムおよび電子部品の製造方法
CN201880025656.5A CN110521291B (zh) 2017-04-19 2018-04-17 载体膜和电子零件的制造方法
KR1020197030062A KR102193968B1 (ko) 2017-04-19 2018-04-17 캐리어 필름 및 전자 부품의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-082613 2017-04-19
JP2017082613 2017-04-19

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WO2018194066A1 true WO2018194066A1 (fr) 2018-10-25

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KR (1) KR102193968B1 (fr)
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WO (1) WO2018194066A1 (fr)

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JPH06304774A (ja) * 1993-04-23 1994-11-01 Murata Mfg Co Ltd 積層型セラミック電子部品の製造方法
JP2001323075A (ja) * 1999-12-16 2001-11-20 Matsushita Electric Ind Co Ltd 離型性フィルム、フイルム付き基材、離型性フィルムの形成方法および回路基板の製造方法
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JP2014143221A (ja) * 2011-05-18 2014-08-07 Panasonic Corp 回路基板の製造方法、並びに、その製造方法で得られる回路基板

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JP6760493B2 (ja) 2020-09-23
CN110521291A (zh) 2019-11-29
KR20190129085A (ko) 2019-11-19
CN110521291B (zh) 2021-12-28
JPWO2018194066A1 (ja) 2019-12-19
KR102193968B1 (ko) 2020-12-22

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