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WO2018120365A1 - Oled背板及其制作方法 - Google Patents

Oled背板及其制作方法 Download PDF

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Publication number
WO2018120365A1
WO2018120365A1 PCT/CN2017/073596 CN2017073596W WO2018120365A1 WO 2018120365 A1 WO2018120365 A1 WO 2018120365A1 CN 2017073596 W CN2017073596 W CN 2017073596W WO 2018120365 A1 WO2018120365 A1 WO 2018120365A1
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Prior art keywords
layer
source
contact region
drain
via hole
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PCT/CN2017/073596
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English (en)
French (fr)
Inventor
白丹
徐源竣
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深圳市华星光电技术有限公司
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Priority to US15/508,097 priority Critical patent/US10361256B2/en
Publication of WO2018120365A1 publication Critical patent/WO2018120365A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED backplane and a method of fabricating the same.
  • OLED Organic Light Emitting Display
  • OLED has self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast ratio, near 180° viewing angle, wide temperature range, and flexible display.
  • a large-area full-color display and many other advantages have been recognized by the industry as the most promising display device.
  • the OLED device generally includes a substrate, an anode disposed on the substrate, a hole injection layer disposed on the anode, a hole transport layer disposed on the hole injection layer, and a light-emitting layer disposed on the hole transport layer.
  • the principle of illumination of OLED devices is that semiconductor materials and organic luminescent materials are driven by electric fields, causing luminescence by carrier injection and recombination.
  • an OLED device generally uses an indium tin oxide (ITO) electrode and a metal electrode as anodes and cathodes of the device, respectively.
  • ITO indium tin oxide
  • electrons and holes are injected from the cathode and the anode to the electron transport layer and the hole transport layer, respectively.
  • the electrons and holes migrate to the light-emitting layer through the electron transport layer and the hole transport layer, respectively, and meet in the light-emitting layer to form excitons and excite the light-emitting molecules, and the latter emits visible light through radiation relaxation.
  • OLED can be divided into two types: passive matrix OLED (PMOLED) and active matrix OLED (AMOLED), namely direct addressing and thin film transistor matrix addressing.
  • PMOLED passive matrix OLED
  • AMOLED active matrix OLED
  • the AMOLED has pixels arranged in an array, belongs to an active display type, has high luminous efficiency, and is generally used as a high-definition large-sized display device.
  • the AMOLED display device usually includes an OLED backplane and an organic material layer disposed on the OLED backplane.
  • FIG. 1 is a schematic structural diagram of a conventional OLED backplane. As shown in FIG. 1, the OLED backplane includes a bottom-up sequence.
  • the substrate substrate 100, the buffer layer 200, the semiconductor layer 300, the gate insulating layer 400, the gate material layer 500, the interlayer dielectric layer 600, the source/drain material layer 800, the pixel defining layer 910, and the support layer are stacked.
  • the source and drain material layer 800 includes a first source 810 and a first drain 820 applied to the switching TFT T100 and a second source 830 and a second drain 840 applied to the driving TFT T200.
  • the second source 830 simultaneously serves as an OLED anode, and the pixel defining layer 910 is provided with an opening 915 corresponding to the second source 830.
  • the opening 915 defines an OLED light emitting region on the second source 830 for forming an OLED light emitting layer.
  • the surface flatness of the second source 830 is also poor, and the OLED light-emitting region generally selects a surface.
  • a region with a higher flatness, so that only a portion of the surface of the second source 830 having a relatively flat surface can be selected to form an OLED light-emitting region, so that the obtained OLED light-emitting region has a smaller area and a lower aperture ratio.
  • Another object of the present invention is to provide an OLED backplane, which has a large area of an OLED light-emitting area and a high aperture ratio.
  • the present invention first provides a method for fabricating an OLED backplane, comprising the following steps:
  • Step 1 providing a base substrate on which a buffer layer, a semiconductor layer, a gate insulating layer, a gate material layer and an interlayer dielectric layer are sequentially formed from bottom to top;
  • the semiconductor layer includes a first semiconductor pattern, a second semiconductor pattern and a first storage electrode disposed at intervals;
  • the gate material layer includes a first gate, a second gate and a second storage electrode which are disposed at intervals, and the first gate, the second gate and the second storage electrode respectively correspond to the first semiconductor pattern
  • the second semiconductor pattern is disposed above the first storage electrode; the first storage electrode and the second storage electrode constitute a storage capacitor;
  • Two ends of the first semiconductor pattern are respectively provided with a first source contact region and a first drain contact region, and two ends of the second semiconductor pattern are respectively provided with a second source contact region and a second drain contact. Area;
  • Step 2 forming a planarization layer on the interlayer dielectric layer, and forming a layer on the planarization layer and the interlayer dielectric layer corresponding to the first source contact region and the first drain contact region, respectively a source contact hole and a first drain contact hole, and a second source contact hole and a second drain contact hole respectively corresponding to the second source contact region and the second drain contact region;
  • Step 3 forming a source/drain material layer on the planar layer, and patterning the source/drain material layer to obtain a first source, a first drain, a second source, and a second interval.
  • a drain, the first source, the first drain, the second source, and the second drain respectively pass through the first source contact hole, the first drain contact hole, the second source contact hole, and the second drain a contact hole in contact with the first source
  • the region, the first drain contact region, the second source contact region, and the second drain contact region are in contact;
  • the first source, the first drain, the first semiconductor pattern and the first gate constitute a switching TFT;
  • the second source, the second drain, the second semiconductor pattern and the second gate constitute a driving TFT;
  • Step 4 forming a pixel defining layer on the source/drain material layer and the flat layer, and forming a support layer on the pixel defining layer;
  • the pixel defining layer is provided with an opening corresponding to the second source, the opening defining an OLED light emitting region on the second source; the second source simultaneously serving as an OLED anode.
  • the step 1 includes:
  • Step 11 Providing a substrate, and depositing a buffer layer on the substrate;
  • Step 12 depositing an amorphous silicon layer on the buffer layer, converting the amorphous silicon layer into a polysilicon layer by a crystallization process, and patterning the polysilicon layer to obtain a semiconductor layer, wherein the semiconductor layer includes a spacer a first semiconductor pattern, a second semiconductor pattern and a first storage electrode;
  • Step 13 depositing a gate insulating layer on the semiconductor layer and the buffer layer;
  • Step 14 forming a patterned photoresist layer on the gate insulating layer, the patterned photoresist layer exposing two ends of the gate insulating layer corresponding to the first semiconductor pattern and the second semiconductor pattern The end and the entire area of the first storage electrode;
  • Step 15 Stripping the patterned photoresist layer; depositing a gate material layer on the gate insulating layer, and patterning the gate material layer to obtain first gates and second gates spaced apart a pole and a second storage electrode;
  • Step 16 Deposit an interlayer dielectric layer on the gate material layer and the gate insulating layer.
  • the P-type ion implantation is performed on both ends of the first semiconductor pattern, the two ends of the second semiconductor pattern, and the entire first storage electrode to realize P-type ion heavy doping;
  • the first source contact region, the first drain contact region, the second source contact region, the second drain contact region, and the entire first storage electrode are all P-type ion heavily doped regions, and the P-type ions It is a boron ion.
  • the step 2 includes:
  • Step 21 coating an organic photoresist on the interlayer dielectric layer to form a flat layer, and the flat layer Patterning processing, forming first vias and second vias respectively corresponding to the first source contact regions and the first drain contact regions on the planar layer, and corresponding to the a third via and a fourth via above the second source contact region and the second drain contact region;
  • Step 22 etching the interlayer dielectric layer by using the patterned planar layer as a mask, and forming corresponding to the first via hole and the second via hole on the interlayer dielectric layer respectively a fifth via hole, a sixth via hole, a seventh via hole and an eighth via hole below the third via hole and the fourth via hole;
  • the first via hole and the fifth via hole constitute a first source contact hole
  • the second via hole and the sixth via hole constitute a first drain contact hole
  • the third via hole and the seventh via hole constitute a first via hole and a seventh via hole.
  • the second source contact hole, the fourth via hole and the eighth via hole constitute a second drain contact hole.
  • the step 4 includes:
  • Step 41 applying an organic photoresist on the source/drain material layer and the flat layer to form an organic photoresist layer
  • Step 42 Exposing and developing the organic photoresist layer by using a halftone mask to obtain a pixel defining layer and a support layer.
  • the present invention also provides an OLED backplane comprising: a substrate substrate, a buffer layer, a semiconductor layer, a gate insulating layer, a gate material layer, an interlayer dielectric layer, a flat layer, and a source stacked in this order from bottom to top. a drain material layer, a pixel defining layer, and a support layer;
  • the semiconductor layer includes spaced apart first semiconductor patterns, second semiconductor patterns and first storage electrodes;
  • the gate material layer includes first gates, second gates and second storage electrodes spaced apart, The first gate, the second gate and the second storage electrode are respectively disposed corresponding to the first semiconductor pattern, the second semiconductor pattern and the first storage electrode;
  • the source/drain material layer includes a first source, a first drain, a second source, and a second drain;
  • Two ends of the first semiconductor pattern are respectively provided with a first source contact region and a first drain contact region, and two ends of the second semiconductor pattern are respectively provided with a second source contact region and a second drain contact. Area;
  • the flat layer and the interlayer dielectric layer are respectively provided with a first source contact hole and a first drain contact hole corresponding to the first source contact region and the first drain contact region, respectively, and correspondingly a second source contact hole and a second drain contact hole above the second source contact region and the second drain contact region;
  • the first source, the first drain, the second source, and the second drain respectively pass through the first source contact hole, the first drain contact hole, the second source contact hole, and the second drain contact hole Contacting the first source contact region, the first drain contact region, the second source contact region, and the second drain contact region;
  • the first source, the first drain, the first semiconductor pattern and the first gate constitute a switching TFT;
  • the second source, the second drain, the second semiconductor pattern and the second gate constitute a driving TFT;
  • the first storage electrode and the second storage electrode constitute a storage capacitor;
  • the pixel defining layer is provided with an opening corresponding to the second source, the opening defining an OLED light emitting region on the second source; the second source simultaneously serving as an OLED anode.
  • the first semiconductor pattern, the second semiconductor pattern and the material of the first storage electrode are both polysilicon, the first source contact region, the first drain contact region, the second source contact region, and the second drain contact
  • the region and the entire first storage electrode are both ion heavily doped regions.
  • the first source contact region, the first drain contact region, the second source contact region, the second drain contact region, and the entire first storage electrode are all P-type ion heavily doped regions, and the P-type ions It is a boron ion.
  • the flat layer is provided with a first via and a second via corresponding to the first source contact region and the first drain contact region, respectively, and corresponding to the second source contact region, respectively a third via and a fourth via above the second drain contact region;
  • the interlayer dielectric layer is provided with a fifth via hole, a sixth via hole, and a seventh via hole respectively corresponding to the first via hole, the second via hole, the third via hole, and the fourth via hole. And the eighth via;
  • the first via hole and the fifth via hole constitute a first source contact hole
  • the second via hole and the sixth via hole constitute a first drain contact hole
  • the third via hole and the seventh via hole constitute a first via hole and a seventh via hole.
  • the second source contact hole, the fourth via hole and the eighth via hole constitute a second drain contact hole.
  • the material of the pixel defining layer and the support layer are both organic photoresists, the materials of the two are the same, and are structurally integrated.
  • the present invention also provides an OLED backplane comprising: a substrate substrate, a buffer layer, a semiconductor layer, a gate insulating layer, a gate material layer, an interlayer dielectric layer, a flat layer, and a source stacked in this order from bottom to top. a drain material layer, a pixel defining layer, and a support layer;
  • the semiconductor layer includes spaced apart first semiconductor patterns, second semiconductor patterns and first storage electrodes;
  • the gate material layer includes first gates, second gates and second storage electrodes spaced apart, The first gate, the second gate and the second storage electrode are respectively disposed corresponding to the first semiconductor pattern, the second semiconductor pattern and the first storage electrode;
  • the source/drain material layer includes a first source, a first drain, a second source, and a second drain;
  • Two ends of the first semiconductor pattern are respectively provided with a first source contact region and a first drain contact region, and two ends of the second semiconductor pattern are respectively provided with a second source contact region and a second drain contact. Area;
  • the flat layer and the interlayer dielectric layer are respectively provided with a first source contact hole and a first drain contact hole corresponding to the first source contact region and the first drain contact region, respectively, and correspondingly Yu a second source contact hole and a second drain contact hole above the second drain contact region;
  • the first source, the first drain, the second source, and the second drain respectively pass through the first source contact hole, the first drain contact hole, the second source contact hole, and the second drain contact hole Contacting the first source contact region, the first drain contact region, the second source contact region, and the second drain contact region;
  • the first source, the first drain, the first semiconductor pattern and the first gate constitute a switching TFT;
  • the second source, the second drain, the second semiconductor pattern and the second gate constitute a driving TFT;
  • the first storage electrode and the second storage electrode constitute a storage capacitor;
  • the pixel defining layer is provided with an opening corresponding to the second source, the opening defining an OLED light emitting region on the second source; the second source simultaneously serving as an OLED anode;
  • the material of the first semiconductor pattern, the second semiconductor pattern and the first storage electrode are both polysilicon, the first source contact region, the first drain contact region, the second source contact region, and the second drain.
  • the polar contact region and the entire first storage electrode are ion heavily doped regions;
  • the material of the pixel defining layer and the support layer are both organic photoresists, the materials of the two are the same, and are structurally integrated.
  • the present invention provides a method for fabricating an OLED back sheet by forming a planar layer on an interlayer dielectric layer, which can serve as a mask for an interlayer dielectric layer etching process.
  • the surface of the second source prepared on the surface thereof can be flattened, which is advantageous for increasing the area of the OLED light-emitting area and increasing the aperture ratio.
  • the OLED back sheet provided by the invention provides a flat surface on the interlayer dielectric layer, so that the surface of the second source prepared on the surface of the flat layer is flat, the area of the OLED light-emitting area is large, and the aperture ratio is high.
  • FIG. 1 is a schematic structural view of a conventional OLED backplane
  • FIG. 2 is a flow chart of a method of fabricating an OLED backplane of the present invention
  • FIG. 10 are schematic diagrams showing the first step of the method for fabricating an OLED backplane according to the present invention.
  • FIG. 12 are schematic diagrams showing the second step of the method for fabricating an OLED backplane according to the present invention.
  • step 3 is a schematic diagram of step 3 of a method for fabricating an OLED backplane according to the present invention.
  • FIG. 14 and FIG. 15 are schematic diagrams showing the step 4 of the method for fabricating the OLED backplane of the present invention, and FIG. 15 is a schematic structural view of the OLED backplane of the present invention.
  • the present invention provides a method for fabricating an OLED backplane, including the following steps:
  • Step 1 as shown in FIG. 3 to FIG. 10, a base substrate 10 is provided on which a buffer layer 20, a semiconductor layer 30, a gate insulating layer 40, and a gate material layer are sequentially formed from bottom to top. 50 and interlayer dielectric layer 60;
  • the semiconductor layer 30 includes a first semiconductor pattern 31, a second semiconductor pattern 32 and a first storage electrode 33;
  • the gate material layer 50 includes a first gate electrode 51, a second gate electrode 52, and a second storage electrode 53.
  • the first gate electrode 51 and the second gate electrode 52 correspond to the second storage electrode 53 respectively.
  • the first semiconductor pattern 31, the second semiconductor pattern 32 and the first storage electrode 33 are disposed; the first storage electrode 33 and the second storage electrode 53 constitute a storage capacitor Cst;
  • Two ends of the first semiconductor pattern 31 are respectively provided with a first source contact region 311 and a first drain contact region 312, and two ends of the second semiconductor pattern 32 are respectively provided with a second source contact region 321 and Second drain contact region 322.
  • the first storage electrode 33 is disposed between the first semiconductor pattern 31 and the second semiconductor pattern 32, and the second storage electrode 53 is disposed at the first gate 51 and the second gate 52. between.
  • the step 1 includes:
  • Step 11 As shown in FIG. 3, a base substrate 10 is provided on which a buffer layer 20 is deposited.
  • the base substrate 10 is a glass substrate.
  • the buffer layer 20 includes a first silicon nitride (SiN x ) layer 21 disposed on the base substrate 10 and a first silicon oxide (SiO) disposed on the first silicon nitride layer 21 x ) Layer 22.
  • Step 12 depositing an amorphous silicon layer 25 on the buffer layer 20, converting the amorphous silicon layer 25 into a polysilicon layer 26 by a crystallization process, and performing the polysilicon layer 26
  • the semiconductor layer 30 is formed by patterning, and the semiconductor layer 30 includes a first semiconductor pattern 31, a second semiconductor pattern 32, and a first storage electrode 33 which are spaced apart from each other.
  • Step 13 As shown in FIG. 7, a gate insulating layer 40 is deposited on the semiconductor layer 30 and over.
  • the material of the gate insulating layer 40 includes at least one of silicon oxide and silicon nitride.
  • Step 14 as shown in FIG. 8 , forming a patterned photoresist layer 41 on the gate insulating layer 40 , the patterned photoresist layer 41 exposing the gate insulating layer 40 corresponding to the first semiconductor pattern Both ends of 31, both ends of the second semiconductor pattern 32, and the entire area of the first storage electrode 33;
  • ion implantation is performed on both ends of the first semiconductor pattern 31, both ends of the second semiconductor pattern 32, and the entire first storage electrode 33 to achieve ion heavy doping.
  • a first source contact region 311 and a first drain contact region 312 are formed at both ends of the first semiconductor pattern 31, and a second source contact region 321 is formed at both ends of the second semiconductor pattern 32.
  • the two drain contact regions 322, the first source contact region 311, the first drain contact region 312, the second source contact region 321, the second drain contact region 322, and the entire first storage electrode 33 are all ions. Heavy doped area.
  • the ion concentration in the ion heavily doped region ranges from 10 19 to 10 21 ions/cm 3 .
  • the P-type ion implantation is performed on both ends of the first semiconductor pattern 31, the two ends of the second semiconductor pattern 32, and the entire first storage electrode 33 to realize P-type ion heavy doping;
  • the first source contact region 311, the first drain contact region 312, the second source contact region 321, the second drain contact region 322, and the entire first storage electrode 33 are all P-type ion heavily doped regions.
  • the P-type ion is a boron ion.
  • Step 15 as shown in FIG. 9, the patterned photoresist layer 41 is peeled off; a gate material layer 50 is deposited on the gate insulating layer 40, and the gate material layer 50 is patterned to obtain an interval.
  • the first gate 51, the second gate 52, and the second storage electrode 53 are disposed.
  • the materials of the first gate 51, the second gate 52 and the second storage electrode 53 are both molybdenum (Mo).
  • Step 16 As shown in FIG. 10, an interlayer dielectric layer 60 is deposited on the gate material layer 50 and the gate insulating layer 40.
  • the interlayer dielectric layer 60 includes a second silicon dioxide layer 61 disposed on the gate material layer 50 and the gate insulating layer 40 and a second layer disposed on the second silicon oxide layer 61. Silicon nitride layer 62.
  • Step 2 as shown in FIG. 11 to FIG. 12, a planarization layer 70 is formed on the interlayer dielectric layer 60, and the planarization layer 70 and the interlayer dielectric layer 60 are respectively formed corresponding to the first source.
  • the step 2 includes:
  • Step 21 as shown in FIG. 11, applying an organic photoresist on the interlayer dielectric layer 60 to form
  • the flat layer 70 is patterned to form a first via 701 on the flat layer 70 corresponding to the first source contact region 311 and the first drain contact region 312, respectively.
  • a second via 702 and a third via 703 and a fourth via 704 respectively above the second source contact region 321 and the second drain contact region 322.
  • Step 22 as shown in FIG. 12, the interlayer dielectric layer 60 is etched by using the patterned planar layer 70 as a mask, and the interlayer dielectric layer 60 is formed on the interlayer dielectric layer 60 to correspond to the first a via 701, a second via 702, a third via 703, and a fifth via 605, a sixth via 606, a seventh via 607, and an eighth via 608 under the fourth via 704;
  • the first via hole 701 and the fifth via hole 605 constitute a first source contact hole 76a
  • the second via hole 702 and the sixth via hole 606 constitute a first drain contact hole 76b
  • the 703 and the seventh via 607 form a second source contact hole 76c
  • the fourth via 704 and the eighth via 608 constitute a second drain contact hole 76d.
  • Step 3 as shown in FIG. 13, a source/drain material layer 80 is formed on the flat layer 70, and the source/drain material layer 80 is patterned to obtain a first source 81 and a first interval.
  • the drain electrode 82, the second source electrode 83, and the second drain electrode 84, the first source electrode 81, the first drain electrode 82, the second source electrode 83, and the second drain electrode 84 pass through the first source contact hole 76a, respectively.
  • the first source 81, the first drain 82, the first semiconductor pattern 31, and the first gate 51 constitute a switching TFT T1; the second source 83, the second drain 84, and the second semiconductor pattern 32; The second gate electrode 52 constitutes a driving TFT T2.
  • the storage capacitor Cst is located between the switching TFT T1 and the driving TFT T2.
  • the first source 81, the first drain 82, the second source 83, and the second drain 84 each include a two-indium tin oxide layer and a silver layer interposed between the two indium tin oxide layers.
  • Step 4 as shown in FIG. 14 and FIG. 15, a pixel defining layer 91 is formed on the source and drain material layer 80 and the flat layer 70, and a support layer 92 is formed on the pixel defining layer 91;
  • An opening 911 corresponding to the upper side of the second source 83 is disposed on the pixel defining layer 91, and the opening 911 defines an OLED light emitting area on the second source 83; the second source 83 simultaneously serves as OLED anode.
  • the step 4 includes:
  • Step 41 as shown in Figure 14, the source and drain material layer 80 and the flat layer 70 is coated with an organic photoresist to form an organic photoresist layer 90;
  • Step 42 As shown in FIG. 15, the organic photoresist layer 90 is performed by using a halftone mask 95. Exposure, development, and at the same time, a pixel defining layer 91 and a support layer 92 are obtained.
  • the support layer 92 includes a plurality of spacers 921 disposed at intervals.
  • the shape of the support 921 is a column shape, and the support layer 92 is used for supporting steaming in the subsequent evaporation process of the OLED luminescent material. Masking plate.
  • the OLED backplane is fabricated by forming a planarization layer 70 on the interlayer dielectric layer 60, which can serve as a mask for the interlayer dielectric layer 60 etching process on the one hand, and can be prepared on the other hand.
  • the surface of the second source 83 of the surface is flat, which is advantageous for increasing the area of the OLED light-emitting area and increasing the aperture ratio.
  • the present invention further provides an OLED backplane, comprising: a substrate substrate 10, a buffer layer 20, a semiconductor layer 30, and a gate insulating layer stacked in this order from bottom to top.
  • the semiconductor layer 30 includes a first semiconductor pattern 31, a second semiconductor pattern 32 and a first storage electrode 33;
  • the gate material layer 50 includes a first gate 51 and a second gate 52 which are spaced apart from each other.
  • the second storage electrode 53, the first gate 51, the second gate 52, and the second storage electrode 53 are respectively disposed above the first semiconductor pattern 31, the second semiconductor pattern 32, and the first storage electrode 33. ;
  • the source/drain material layer 80 includes a first source 81, a first drain 82, a second source 83, and a second drain 84;
  • Two ends of the first semiconductor pattern 31 are respectively provided with a first source contact region 311 and a first drain contact region 312, and two ends of the second semiconductor pattern 32 are respectively provided with a second source contact region 321 and a second drain contact region 322;
  • the flat layer 70 and the interlayer dielectric layer 60 are respectively provided with the first source contact hole 76a corresponding to the first source contact region 311 and the first drain contact region 312, and the first drain contact hole 76a. a hole 76b, and a second source contact hole 76c and a second drain contact hole 76d corresponding to the second source contact region 321 and the second drain contact region 322, respectively;
  • the first source 81, the first drain 82, the second source 83, and the second drain 84 pass through the first source contact hole 76a, the first drain contact hole 76b, and the second source contact hole 76c, respectively.
  • the second drain contact hole 76d is in contact with the first source contact region 311, the first drain contact region 312, the second source contact region 321 and the second drain contact region 322;
  • the first source 81, the first drain 82, the first semiconductor pattern 31, and the first gate 51 constitute a switching TFT T1; the second source 83, the second drain 84, and the second semiconductor pattern 32;
  • the second gate 52 constitutes a driving TFT T2;
  • the first storage electrode 33 and the second storage electrode 53 constitute a storage capacitor Cst;
  • An opening 911 corresponding to the upper side of the second source 83 is disposed on the pixel defining layer 91, and the opening 911 defines an OLED light emitting area on the second source 83; the second source 83 simultaneously serves as OLED anode.
  • the base substrate 10 is a glass substrate.
  • the buffer layer 20 includes a first silicon nitride layer 21 disposed on the base substrate 10 and a second silicon oxide layer 22 disposed on the first silicon nitride layer 21.
  • the materials of the first semiconductor pattern 31, the second semiconductor pattern 32, and the first storage electrode 33 are both polysilicon, the first source contact region 311, the first drain contact region 312, and the second source.
  • the contact region 321, the second drain contact region 322, and the entire first storage electrode 33 are all ion heavily doped regions.
  • the ion concentration in the ion heavily doped region ranges from 10 19 to 10 21 ions/cm 3 .
  • the first source contact region 311, the first drain contact region 312, the second source contact region 321, the second drain contact region 322, and the entire first storage electrode 33 are all P-type ion heavily doped.
  • the P-type ion is a boron ion.
  • the material of the gate insulating layer 40 includes at least one of silicon oxide and silicon nitride.
  • the materials of the first gate 51, the second gate 52 and the second storage electrode 53 are both molybdenum.
  • the interlayer dielectric layer 60 includes a second silicon dioxide layer 61 disposed on the gate material layer 50 and the gate insulating layer 40 and a second layer disposed on the second silicon oxide layer 61. Silicon nitride layer 62.
  • the first source 81, the first drain 82, the second source 83, and the second drain 84 each include a two-indium tin oxide layer and a silver layer interposed between the two indium tin oxide layers.
  • the material of the pixel defining layer 91 and the support layer 92 are both organic photoresists, the materials are the same, and are structurally integrated.
  • the support layer 92 includes a plurality of supports 921 disposed at intervals, and the shape of the support 921 is cylindrical.
  • the flat layer 70 is provided with a first via 701 and a second via 702 respectively corresponding to the first source contact region 311 and the first drain contact region 312, and respectively corresponding to the a second via 703 and a fourth via 704 above the second source contact region 321 and the second drain contact region 322;
  • the interlayer dielectric layer 60 is provided with a fifth via 605 corresponding to the first via 701, the second via 702, the third via 703, and the fourth via 704, respectively. a hole 606, a seventh via 607 and an eighth via 608;
  • the first via 701 and the fifth via 605 form a first source contact hole 76a
  • the second The via 702 and the sixth via 606 form a first drain contact hole 76b
  • the third via 703 and the seventh via 607 form a second source contact hole 76c
  • the fourth via 704 and the eighth The via 608 constitutes a second drain contact hole 76d.
  • the first storage electrode 33 is disposed between the first semiconductor pattern 31 and the second semiconductor pattern 32, and the second storage electrode 53 is disposed at the first gate 51 and the second gate 52. Therefore, the storage capacitor Cst is located between the switching TFT T1 and the driving TFT T2.
  • the planarization layer 70 on the interlayer dielectric layer 60, the surface of the second source 83 prepared on the surface of the planarization layer 70 is flat, the area of the OLED illumination region is large, and the aperture ratio is high.
  • the present invention provides an OLED backplane and a method of fabricating the same.
  • the method for fabricating the OLED back sheet of the present invention is characterized in that a flat layer is formed on the interlayer dielectric layer, and the flat layer can serve as a mask for the interlayer dielectric layer etching process on the one hand, and can be prepared on the surface thereof on the other hand.
  • the surface of the second source is flat, which is beneficial to increase the area of the OLED light-emitting area and increase the aperture ratio.
  • the surface of the second source prepared on the surface of the flat layer is flat, the area of the OLED light-emitting area is large, and the aperture ratio is high.

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Abstract

本发明提供一种OLED背板及其制作方法。本发明的OLED背板的制作方法，通过在层间介电层上形成平坦层，所述平坦层一方面可以充当层间介电层蚀刻制程的掩膜，另一方面可以使制备于其表面的第二源极的表面平整，有利于增大OLED发光区的面积，提高开口率。本发明的OLED背板，通过在层间介电层上设置平坦层，使得制备于平坦层表面的第二源极的表面平整，OLED发光区的面积较大，开口率较高。

Description

OLED背板及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED背板及其制作方法。
背景技术
有机发光二极管显示装置(Organic Light Emitting Display，OLED)具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，被业界公认为是最有发展潜力的显示装置。
OLED器件通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层、设于空穴注入层上的空穴传输层、设于空穴传输层上的发光层、设于发光层上的电子传输层、设于电子传输层上的电子注入层、及设于电子注入层上的阴极。OLED器件的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED器件通常采用氧化铟锡(ITO)电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
OLED按照驱动方式可以分为无源矩阵型OLED(Passive Matrix OLED，PMOLED)和有源矩阵型OLED(Active Matrix OLED，AMOLED)两大类，即直接寻址和薄膜晶体管矩阵寻址两类。其中，AMOLED具有呈阵列式排布的像素，属于主动显示类型，发光效能高，通常用作高清晰度的大尺寸显示装置。
AMOLED显示装置通常包括OLED背板与设于OLED背板上的有机材料层，图1为现有的OLED背板的结构示意图，如图1所示，所述OLED背板包括从下到上依次层叠设置的衬底基板100、缓冲层200、半导体层300、栅极绝缘层400、栅极材料层500、层间介电层600、源漏极材料层800、像素定义层910与支撑物层920，其中，所述源漏极材料层800包括应用于开关TFT T100中的第一源极810与第一漏极820以及应用于驱动TFT T200中的第二源极830与第二漏极840，所述第二源极830同时同时充当OLED阳极，所述像素定义层910上设有对应于所述第二源极830上方的开口915， 该开口915在所述第二源极830上限定出OLED发光区，该OLED发光区中用来形成OLED发光层。
上述OLED背板中，由于第二源极830直接形成于表面平整度较差的层间介电层600上，因此第二源极830的表面平整度也较差，而OLED发光区通常选择表面平整度较高的区域，因此所述第二源极830表面只有部分较为平整的区域可被选用来形成OLED发光区，从而得到的OLED发光区的面积较小，开口率较低。
发明内容
本发明的目的在于提供一种OLED背板的制作方法，有利于增大OLED发光区的面积，提高开口率。
本发明的目的还在于提供一种OLED背板，OLED发光区的面积较大，开口率较高。
为实现上述目的，本发明首先提供一种OLED背板的制作方法，包括如下步骤：
步骤1、提供衬底基板，在所述衬底基板上从下到上依次形成缓冲层、半导体层、栅极绝缘层、栅极材料层及层间介电层；
所述半导体层包括间隔设置的第一半导体图案、第二半导体图案与第一存储电极；
所述栅极材料层包括间隔设置的第一栅极、第二栅极与第二存储电极，所述第一栅极、第二栅极与第二存储电极分别对应于所述第一半导体图案、第二半导体图案与第一存储电极的上方设置；所述第一存储电极与第二存储电极构成存储电容；
所述第一半导体图案的两端分别设有第一源极接触区与第一漏极接触区，所述第二半导体图案的两端分别设有第二源极接触区与第二漏极接触区；
步骤2、在所述层间介电层上形成平坦层，在所述平坦层与层间介电层上形成分别对应于所述第一源极接触区与第一漏极接触区上方的第一源极接触孔与第一漏极接触孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第二源极接触孔与第二漏极接触孔；
步骤3、在所述平坦层上形成源漏极材料层，对所述源漏极材料层进行图形化处理，得到间隔设置的第一源极、第一漏极、第二源极及第二漏极，所述第一源极、第一漏极、第二源极及第二漏极分别通过第一源极接触孔、第一漏极接触孔、第二源极接触孔及第二漏极接触孔与所述第一源极接触 区、第一漏极接触区、第二源极接触区及第二漏极接触区相接触；
所述第一源极、第一漏极、第一半导体图案及第一栅极构成开关TFT；所述第二源极、第二漏极、第二半导体图案及第二栅极构成驱动TFT；
步骤4、在所述源漏极材料层与平坦层上形成像素定义层，在像素定义层上形成支撑物层；
所述像素定义层上设有对应于所述第二源极上方的开口，该开口在所述第二源极上限定出OLED发光区；所述第二源极同时充当OLED阳极。
所述步骤1包括：
步骤11、提供衬底基板，在所述衬底基板上沉积缓冲层；
步骤12、在所述缓冲层上沉积非晶硅层，采用结晶制程使所述非晶硅层转化为多晶硅层，对所述多晶硅层进行图形化处理，得到半导体层，所述半导体层包括间隔设置的第一半导体图案、第二半导体图案与第一存储电极；
步骤13、在所述半导体层与缓冲层上沉积栅极绝缘层；
步骤14、在所述栅极绝缘层上形成图案化光阻层，所述图案化光阻层暴露出所述栅极绝缘层上对应于第一半导体图案的两端、第二半导体图案的两端以及整个第一存储电极的区域；
以所述图案化光阻层为掩膜，对所述第一半导体图案的两端、第二半导体图案的两端及整个第一存储电极进行离子注入，实现离子重掺杂，从而在所述第一半导体图案的两端形成第一源极接触区与第一漏极接触区，在所述第二半导体图案的两端形成第二源极接触区与第二漏极接触区，所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为离子重掺杂区；
步骤15、剥离所述图案化光阻层；在所述栅极绝缘层上沉积栅极材料层，对所述栅极材料层进行图形化处理，得到间隔设置的第一栅极、第二栅极与第二存储电极；
步骤16、在所述栅极材料层与栅极绝缘层上沉积层间介电层。
所述步骤14中，对所述第一半导体图案的两端、第二半导体图案的两端及整个第一存储电极进行P型离子注入，实现P型离子重掺杂；
所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为P型离子重掺杂区，所述P型离子为硼离子。
所述步骤2包括：
步骤21、在所述层间介电层上涂布有机光阻，形成平坦层，对所述平 坦层进行图案化处理，在所述平坦层上形成分别对应于所述第一源极接触区与第一漏极接触区上方的第一过孔与第二过孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第三过孔与第四过孔；
步骤22、以图案化的平坦层为掩膜，对所述层间介电层进行蚀刻处理，在所述层间介电层上形成分别对应于所述第一过孔、第二过孔、第三过孔及第四过孔下方的第五过孔、第六过孔、第七过孔及第八过孔；
所述第一过孔与第五过孔构成第一源极接触孔，所述第二过孔与第六过孔构成第一漏极接触孔，所述第三过孔与第七过孔构成第二源极接触孔，所述第四过孔与第八过孔构成第二漏极接触孔。
所述步骤4包括：
步骤41、在所述源漏极材料层与平坦层上涂布有机光阻，形成有机光阻层；
步骤42、采用半色调光罩对所述有机光阻层进行曝光、显影，同时得到像素定义层与支撑物层。
本发明还提供一种OLED背板，包括：从下到上依次层叠设置的衬底基板、缓冲层、半导体层、栅极绝缘层、栅极材料层、层间介电层、平坦层、源漏极材料层、像素定义层、以及支撑物层；
所述半导体层包括间隔设置的第一半导体图案、第二半导体图案与第一存储电极；所述栅极材料层包括间隔设置的第一栅极、第二栅极与第二存储电极，所述第一栅极、第二栅极与第二存储电极分别对应于所述第一半导体图案、第二半导体图案与第一存储电极的上方设置；
所述源漏极材料层包括间隔设置的第一源极、第一漏极、第二源极及第二漏极；
所述第一半导体图案的两端分别设有第一源极接触区与第一漏极接触区，所述第二半导体图案的两端分别设有第二源极接触区与第二漏极接触区；
所述平坦层与层间介电层上设有分别对应于所述第一源极接触区与第一漏极接触区上方的第一源极接触孔与第一漏极接触孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第二源极接触孔与第二漏极接触孔；
所述第一源极、第一漏极、第二源极及第二漏极分别通过第一源极接触孔、第一漏极接触孔、第二源极接触孔及第二漏极接触孔与所述第一源极接触区、第一漏极接触区、第二源极接触区及第二漏极接触区相接触；
所述第一源极、第一漏极、第一半导体图案及第一栅极构成开关TFT； 所述第二源极、第二漏极、第二半导体图案及第二栅极构成驱动TFT；所述第一存储电极与第二存储电极构成存储电容；
所述像素定义层上设有对应于所述第二源极上方的开口，该开口在所述第二源极上限定出OLED发光区；所述第二源极同时充当OLED阳极。
所述第一半导体图案、第二半导体图案与第一存储电极的材料均为多晶硅，所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为离子重掺杂区。
所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为P型离子重掺杂区，所述P型离子为硼离子。
所述平坦层上设有分别对应于所述第一源极接触区与第一漏极接触区上方的第一过孔与第二过孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第三过孔与第四过孔；
所述层间介电层上设有分别对应于所述第一过孔、第二过孔、第三过孔及第四过孔下方的第五过孔、第六过孔、第七过孔及第八过孔；
所述第一过孔与第五过孔构成第一源极接触孔，所述第二过孔与第六过孔构成第一漏极接触孔，所述第三过孔与第七过孔构成第二源极接触孔，所述第四过孔与第八过孔构成第二漏极接触孔。
所述像素定义层与支撑物层的材料均为有机光阻，二者材料相同，且在结构上为一体。
本发明还提供一种OLED背板，包括：从下到上依次层叠设置的衬底基板、缓冲层、半导体层、栅极绝缘层、栅极材料层、层间介电层、平坦层、源漏极材料层、像素定义层、以及支撑物层；
所述半导体层包括间隔设置的第一半导体图案、第二半导体图案与第一存储电极；所述栅极材料层包括间隔设置的第一栅极、第二栅极与第二存储电极，所述第一栅极、第二栅极与第二存储电极分别对应于所述第一半导体图案、第二半导体图案与第一存储电极的上方设置；
所述源漏极材料层包括间隔设置的第一源极、第一漏极、第二源极及第二漏极；
所述第一半导体图案的两端分别设有第一源极接触区与第一漏极接触区，所述第二半导体图案的两端分别设有第二源极接触区与第二漏极接触区；
所述平坦层与层间介电层上设有分别对应于所述第一源极接触区与第一漏极接触区上方的第一源极接触孔与第一漏极接触孔、以及分别对应于 所述第二源极接触区与第二漏极接触区上方的第二源极接触孔与第二漏极接触孔；
所述第一源极、第一漏极、第二源极及第二漏极分别通过第一源极接触孔、第一漏极接触孔、第二源极接触孔及第二漏极接触孔与所述第一源极接触区、第一漏极接触区、第二源极接触区及第二漏极接触区相接触；
所述第一源极、第一漏极、第一半导体图案及第一栅极构成开关TFT；所述第二源极、第二漏极、第二半导体图案及第二栅极构成驱动TFT；所述第一存储电极与第二存储电极构成存储电容；
所述像素定义层上设有对应于所述第二源极上方的开口，该开口在所述第二源极上限定出OLED发光区；所述第二源极同时充当OLED阳极；
其中，所述第一半导体图案、第二半导体图案与第一存储电极的材料均为多晶硅，所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为离子重掺杂区；
其中，所述像素定义层与支撑物层的材料均为有机光阻，二者材料相同，且在结构上为一体。
本发明的有益效果：本发明提供的一种OLED背板的制作方法，通过在层间介电层上形成平坦层，所述平坦层一方面可以充当层间介电层蚀刻制程的掩膜，另一方面可以使制备于其表面的第二源极的表面平整，有利于增大OLED发光区的面积，提高开口率。本发明提供的一种OLED背板，通过在层间介电层上设置平坦层，使得制备于平坦层表面的第二源极的表面平整，OLED发光区的面积较大，开口率较高。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的OLED背板的结构示意图；
图2为本发明的OLED背板的制作方法的流程图；
图3至图10为本发明的OLED背板的制作方法的步骤1的示意图；
图11至图12为本发明的OLED背板的制作方法的步骤2的示意图；
图13为本发明的OLED背板的制作方法的步骤3的示意图；
图14与图15为本发明的OLED背板的制作方法的步骤4的示意图且图15为本发明的OLED背板的结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种OLED背板的制作方法，包括如下步骤：
步骤1、如图3至图10所示，提供衬底基板10，在所述衬底基板10上从下到上依次形成缓冲层20、半导体层30、栅极绝缘层40、栅极材料层50及层间介电层60；
所述半导体层30包括间隔设置的第一半导体图案31、第二半导体图案32与第一存储电极33；
所述栅极材料层50包括间隔设置的第一栅极51、第二栅极52与第二存储电极53，所述第一栅极51、第二栅极52与第二存储电极53分别对应于所述第一半导体图案31、第二半导体图案32与第一存储电极33的上方设置；所述第一存储电极33与第二存储电极53构成存储电容Cst；
所述第一半导体图案31的两端分别设有第一源极接触区311与第一漏极接触区312，所述第二半导体图案32的两端分别设有第二源极接触区321与第二漏极接触区322。
具体的，所述第一存储电极33设于所述第一半导体图案31与第二半导体图案32之间，所述第二存储电极53设于所述第一栅极51与第二栅极52之间。
具体的，所述步骤1包括：
步骤11、如图3所示，提供衬底基板10，在所述衬底基板10上沉积缓冲层20。
具体的，所述衬底基板10为玻璃基板。
具体的，所述缓冲层20包括设于所述衬底基板10上的第一氮化硅(SiNx)层21与设于所述第一氮化硅层21上的第一氧化硅(SiOx)层22。
步骤12、如图4至图6所示，在所述缓冲层20上沉积非晶硅层25，采用结晶制程使所述非晶硅层25转化为多晶硅层26，对所述多晶硅层26进行图形化处理，得到半导体层30，所述半导体层30包括间隔设置的第一半导体图案31、第二半导体图案32与第一存储电极33。
步骤13、如图7所示，在所述半导体层30与上沉积栅极绝缘层40。
具体的，所述栅极绝缘层40的材料包括氧化硅与氮化硅中的至少一种。
步骤14、如图8所示，在所述栅极绝缘层40上形成图案化光阻层41，所述图案化光阻层41暴露出所述栅极绝缘层40上对应于第一半导体图案31的两端、第二半导体图案32的两端以及整个第一存储电极33的区域；
以所述图案化光阻层41为掩膜，对所述第一半导体图案31的两端、第二半导体图案32的两端及整个第一存储电极33进行离子注入，实现离子重掺杂，从而在所述第一半导体图案31的两端形成第一源极接触区311与第一漏极接触区312，在所述第二半导体图案32的两端形成第二源极接触区321与第二漏极接触区322，所述第一源极接触区311、第一漏极接触区312、第二源极接触区321、第二漏极接触区322及整个第一存储电极33均为离子重掺杂区。
具体的，所述离子重掺杂区中的离子浓度范围为1019～1021ions/cm3。
具体的，所述步骤14中，对所述第一半导体图案31的两端、第二半导体图案32的两端及整个第一存储电极33进行P型离子注入，实现P型离子重掺杂；
所述第一源极接触区311、第一漏极接触区312、第二源极接触区321、第二漏极接触区322及整个第一存储电极33均为P型离子重掺杂区，所述P型离子为硼离子。
步骤15、如图9所示，剥离所述图案化光阻层41；在所述栅极绝缘层40上沉积栅极材料层50，对所述栅极材料层50进行图形化处理，得到间隔设置的第一栅极51、第二栅极52与第二存储电极53。
具体的，所述第一栅极51、第二栅极52与第二存储电极53的材料均为钼(Mo)。
步骤16、如图10所示，在所述栅极材料层50与栅极绝缘层40上沉积层间介电层60。
具体的，所述层间介电层60包括设于所述栅极材料层50与栅极绝缘层40上的第二氧化硅层61与设于所述第二氧化硅层61上的第二氮化硅层62。
步骤2、如图11至图12所示，在所述层间介电层60上形成平坦层70，在所述平坦层70与层间介电层60上形成分别对应于所述第一源极接触区311与第一漏极接触区312上方的第一源极接触孔76a与第一漏极接触孔76b、以及分别对应于所述第二源极接触区321与第二漏极接触区322上方的第二源极接触孔76c与第二漏极接触孔76d。
具体的，所述步骤2包括：
步骤21、如图11所示，在所述层间介电层60上涂布有机光阻，形成 平坦层70，对所述平坦层70进行图案化处理，在所述平坦层70上形成分别对应于所述第一源极接触区311与第一漏极接触区312上方的第一过孔701与第二过孔702、以及分别对应于所述第二源极接触区321与第二漏极接触区322上方的第三过孔703与第四过孔704。
步骤22、如图12所示，以图案化的平坦层70为掩膜，对所述层间介电层60进行蚀刻处理，在所述层间介电层60上形成分别对应于所述第一过孔701、第二过孔702、第三过孔703及第四过孔704下方的第五过孔605、第六过孔606、第七过孔607及第八过孔608；
所述第一过孔701与第五过孔605构成第一源极接触孔76a，所述第二过孔702与第六过孔606构成第一漏极接触孔76b，所述第三过孔703与第七过孔607构成第二源极接触孔76c，所述第四过孔704与第八过孔608构成第二漏极接触孔76d。
步骤3、如图13所示，在所述平坦层70上形成源漏极材料层80，对所述源漏极材料层80进行图形化处理，得到间隔设置的第一源极81、第一漏极82、第二源极83及第二漏极84，所述第一源极81、第一漏极82、第二源极83及第二漏极84分别通过第一源极接触孔76a、第一漏极接触孔76b、第二源极接触孔76c及第二漏极接触孔76d与所述第一源极接触区311、第一漏极接触区312、第二源极接触区321及第二漏极接触区322相接触；
所述第一源极81、第一漏极82、第一半导体图案31及第一栅极51构成开关TFT T1；所述第二源极83、第二漏极84、第二半导体图案32及第二栅极52构成驱动TFT T2。
具体的，所述存储电容Cst位于所述开关TFT T1与驱动TFT T2之间。
具体的，所述第一源极81、第一漏极82、第二源极83及第二漏极84均包括两氧化铟锡层与夹设于两氧化铟锡层之间的银层。
步骤4、如图14与图15所示，在所述源漏极材料层80与平坦层70上形成像素定义层91，在像素定义层91上形成支撑物层92；
所述像素定义层91上设有对应于所述第二源极83上方的开口911，该开口911在所述第二源极83上限定出OLED发光区；所述第二源极83同时充当OLED阳极。
具体的，所述步骤4包括：
步骤41、如图14所示，在所述源漏极材料层80与平坦层70上涂布有机光阻，形成有机光阻层90；
步骤42、如图15所示，采用半色调光罩95对所述有机光阻层90进行 曝光、显影，同时得到像素定义层91与支撑物层92。
具体的，所述支撑物层92包括间隔设置的数个支撑物921，所述支撑物921的形状为柱形，所述支撑物层92用于后续的OLED发光材料的蒸镀制程中支撑蒸镀掩膜板。
上述OLED背板的制作方法，通过在层间介电层60上形成平坦层70，所述平坦层70一方面可以充当层间介电层60蚀刻制程的掩膜，另一方面可以使制备于其表面的第二源极83的表面平整，有利于增大OLED发光区的面积，提高开口率。
请参阅图15，基于上述OLED背板的制作方法，本发明还提供一种OLED背板，包括：从下到上依次层叠设置的衬底基板10、缓冲层20、半导体层30、栅极绝缘层40、栅极材料层50、层间介电层60、平坦层70、源漏极材料层80、像素定义层91、以及支撑物层92；
所述半导体层30包括间隔设置的第一半导体图案31、第二半导体图案32与第一存储电极33；所述栅极材料层50包括间隔设置的第一栅极51、第二栅极52与第二存储电极53，所述第一栅极51、第二栅极52与第二存储电极53分别对应于所述第一半导体图案31、第二半导体图案32与第一存储电极33的上方设置；
所述源漏极材料层80包括间隔设置的第一源极81、第一漏极82、第二源极83及第二漏极84；
所述第一半导体图案31的两端分别设有第一源极接触区311与第一漏极接触区312，所述第二半导体图案32的两端分别设有第二源极接触区321与第二漏极接触区322；
所述平坦层70与层间介电层60上设有分别对应于所述第一源极接触区311与第一漏极接触区312上方的第一源极接触孔76a与第一漏极接触孔76b、以及分别对应于所述第二源极接触区321与第二漏极接触区322上方的第二源极接触孔76c与第二漏极接触孔76d；
所述第一源极81、第一漏极82、第二源极83及第二漏极84分别通过第一源极接触孔76a、第一漏极接触孔76b、第二源极接触孔76c及第二漏极接触孔76d与所述第一源极接触区311、第一漏极接触区312、第二源极接触区321及第二漏极接触区322相接触；
所述第一源极81、第一漏极82、第一半导体图案31及第一栅极51构成开关TFT T1；所述第二源极83、第二漏极84、第二半导体图案32及第二栅极52构成驱动TFT T2；所述第一存储电极33与第二存储电极53构成存储电容Cst；
所述像素定义层91上设有对应于所述第二源极83上方的开口911，该开口911在所述第二源极83上限定出OLED发光区；所述第二源极83同时充当OLED阳极。
具体的，所述衬底基板10为玻璃基板。
具体的，所述缓冲层20包括设于所述衬底基板10上的第一氮化硅层21与设于所述第一氮化硅层21上的第二氧化硅层22。
具体的，所述第一半导体图案31、第二半导体图案32与第一存储电极33的材料均为多晶硅，所述第一源极接触区311、第一漏极接触区312、第二源极接触区321、第二漏极接触区322及整个第一存储电极33均为离子重掺杂区。
具体的，所述离子重掺杂区中的离子浓度范围为1019～1021ions/cm3。
优选的，所述第一源极接触区311、第一漏极接触区312、第二源极接触区321、第二漏极接触区322及整个第一存储电极33均为P型离子重掺杂区，所述P型离子为硼离子。
具体的，所述栅极绝缘层40的材料包括氧化硅与氮化硅中的至少一种。
具体的，所述第一栅极51、第二栅极52与第二存储电极53的材料均为钼。
具体的，所述层间介电层60包括设于所述栅极材料层50与栅极绝缘层40上的第二氧化硅层61与设于所述第二氧化硅层61上的第二氮化硅层62。
具体的，所述第一源极81、第一漏极82、第二源极83及第二漏极84均包括两氧化铟锡层与夹设于两氧化铟锡层之间的银层。
具体的，所述像素定义层91与支撑物层92的材料均为有机光阻，二者材料相同，且在结构上为一体。
具体的，所述支撑物层92包括间隔设置的数个支撑物921，所述支撑物921的形状为柱形。
具体的，所述平坦层70上设有分别对应于所述第一源极接触区311与第一漏极接触区312上方的第一过孔701与第二过孔702、以及分别对应于所述第二源极接触区321与第二漏极接触区322上方的第三过孔703与第四过孔704；
所述层间介电层60上设有分别对应于所述第一过孔701、第二过孔702、第三过孔703及第四过孔704下方的第五过孔605、第六过孔606、第七过孔607及第八过孔608；
所述第一过孔701与第五过孔605构成第一源极接触孔76a，所述第二 过孔702与第六过孔606构成第一漏极接触孔76b，所述第三过孔703与第七过孔607构成第二源极接触孔76c，所述第四过孔704与第八过孔608构成第二漏极接触孔76d。
具体的，所述第一存储电极33设于所述第一半导体图案31与第二半导体图案32之间，所述第二存储电极53设于所述第一栅极51与第二栅极52之间，从而使所述存储电容Cst位于所述开关TFT T1与驱动TFT T2之间。
上述OLED背板，通过在层间介电层60上设置平坦层70，使得制备于平坦层70表面的第二源极83的表面平整，OLED发光区的面积较大，开口率较高。
综上所述，本发明提供一种OLED背板及其制作方法。本发明的OLED背板的制作方法，通过在层间介电层上形成平坦层，所述平坦层一方面可以充当层间介电层蚀刻制程的掩膜，另一方面可以使制备于其表面的第二源极的表面平整，有利于增大OLED发光区的面积，提高开口率。本发明的OLED背板，通过在层间介电层上设置平坦层，使得制备于平坦层表面的第二源极的表面平整，OLED发光区的面积较大，开口率较高。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种OLED背板的制作方法，包括如下步骤：
    步骤1、提供衬底基板，在所述衬底基板上从下到上依次形成缓冲层、半导体层、栅极绝缘层、栅极材料层及层间介电层；
    所述半导体层包括间隔设置的第一半导体图案、第二半导体图案与第一存储电极；
    所述栅极材料层包括间隔设置的第一栅极、第二栅极与第二存储电极，所述第一栅极、第二栅极与第二存储电极分别对应于所述第一半导体图案、第二半导体图案与第一存储电极的上方设置；所述第一存储电极与第二存储电极构成存储电容；
    所述第一半导体图案的两端分别设有第一源极接触区与第一漏极接触区，所述第二半导体图案的两端分别设有第二源极接触区与第二漏极接触区；
    步骤2、在所述层间介电层上形成平坦层，在所述平坦层与层间介电层上形成分别对应于所述第一源极接触区与第一漏极接触区上方的第一源极接触孔与第一漏极接触孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第二源极接触孔与第二漏极接触孔；
    步骤3、在所述平坦层上形成源漏极材料层，对所述源漏极材料层进行图形化处理，得到间隔设置的第一源极、第一漏极、第二源极及第二漏极，所述第一源极、第一漏极、第二源极及第二漏极分别通过第一源极接触孔、第一漏极接触孔、第二源极接触孔及第二漏极接触孔与所述第一源极接触区、第一漏极接触区、第二源极接触区及第二漏极接触区相接触；
    所述第一源极、第一漏极、第一半导体图案及第一栅极构成开关TFT；所述第二源极、第二漏极、第二半导体图案及第二栅极构成驱动TFT；
    步骤4、在所述源漏极材料层与平坦层上形成像素定义层，在像素定义层上形成支撑物层；
    所述像素定义层上设有对应于所述第二源极上方的开口，该开口在所述第二源极上限定出OLED发光区；所述第二源极同时充当OLED阳极。
  2. 如权利要求1所述的OLED背板的制作方法，其中，所述步骤1包括：
    步骤11、提供衬底基板，在所述衬底基板上沉积缓冲层；
    步骤12、在所述缓冲层上沉积非晶硅层，采用结晶制程使所述非晶硅 层转化为多晶硅层，对所述多晶硅层进行图形化处理，得到半导体层，所述半导体层包括间隔设置的第一半导体图案、第二半导体图案与第一存储电极；
    步骤13、在所述半导体层与缓冲层上沉积栅极绝缘层；
    步骤14、在所述栅极绝缘层上形成图案化光阻层，所述图案化光阻层暴露出所述栅极绝缘层上对应于第一半导体图案的两端、第二半导体图案的两端以及整个第一存储电极的区域；
    以所述图案化光阻层为掩膜，对所述第一半导体图案的两端、第二半导体图案的两端及整个第一存储电极进行离子注入，实现离子重掺杂，从而在所述第一半导体图案的两端形成第一源极接触区与第一漏极接触区，在所述第二半导体图案的两端形成第二源极接触区与第二漏极接触区，所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为离子重掺杂区；
    步骤15、剥离所述图案化光阻层；在所述栅极绝缘层上沉积栅极材料层，对所述栅极材料层进行图形化处理，得到间隔设置的第一栅极、第二栅极与第二存储电极；
    步骤16、在所述栅极材料层与栅极绝缘层上沉积层间介电层。
  3. 如权利要求2所述的OLED背板的制作方法，其中，所述步骤14中，对所述第一半导体图案的两端、第二半导体图案的两端及整个第一存储电极进行P型离子注入，实现P型离子重掺杂；
    所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为P型离子重掺杂区，所述P型离子为硼离子。
  4. 如权利要求1所述的OLED背板的制作方法，其中，所述步骤2包括：
    步骤21、在所述层间介电层上涂布有机光阻，形成平坦层，对所述平坦层进行图案化处理，在所述平坦层上形成分别对应于所述第一源极接触区与第一漏极接触区上方的第一过孔与第二过孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第三过孔与第四过孔；
    步骤22、以图案化的平坦层为掩膜，对所述层间介电层进行蚀刻处理，在所述层间介电层上形成分别对应于所述第一过孔、第二过孔、第三过孔及第四过孔下方的第五过孔、第六过孔、第七过孔及第八过孔；
    所述第一过孔与第五过孔构成第一源极接触孔，所述第二过孔与第六过孔构成第一漏极接触孔，所述第三过孔与第七过孔构成第二源极接触孔， 所述第四过孔与第八过孔构成第二漏极接触孔。
  5. 如权利要求1所述的OLED背板的制作方法，其中，所述步骤4包括：
    步骤41、在所述源漏极材料层与平坦层上涂布有机光阻，形成有机光阻层；
    步骤42、采用半色调光罩对所述有机光阻层进行曝光、显影，同时得到像素定义层与支撑物层。
  6. 一种OLED背板，包括：从下到上依次层叠设置的衬底基板、缓冲层、半导体层、栅极绝缘层、栅极材料层、层间介电层、平坦层、源漏极材料层、像素定义层、以及支撑物层；
    所述半导体层包括间隔设置的第一半导体图案、第二半导体图案与第一存储电极；所述栅极材料层包括间隔设置的第一栅极、第二栅极与第二存储电极，所述第一栅极、第二栅极与第二存储电极分别对应于所述第一半导体图案、第二半导体图案与第一存储电极的上方设置；
    所述源漏极材料层包括间隔设置的第一源极、第一漏极、第二源极及第二漏极；
    所述第一半导体图案的两端分别设有第一源极接触区与第一漏极接触区，所述第二半导体图案的两端分别设有第二源极接触区与第二漏极接触区；
    所述平坦层与层间介电层上设有分别对应于所述第一源极接触区与第一漏极接触区上方的第一源极接触孔与第一漏极接触孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第二源极接触孔与第二漏极接触孔；
    所述第一源极、第一漏极、第二源极及第二漏极分别通过第一源极接触孔、第一漏极接触孔、第二源极接触孔及第二漏极接触孔与所述第一源极接触区、第一漏极接触区、第二源极接触区及第二漏极接触区相接触；
    所述第一源极、第一漏极、第一半导体图案及第一栅极构成开关TFT；所述第二源极、第二漏极、第二半导体图案及第二栅极构成驱动TFT；所述第一存储电极与第二存储电极构成存储电容；
    所述像素定义层上设有对应于所述第二源极上方的开口，该开口在所述第二源极上限定出OLED发光区；所述第二源极同时充当OLED阳极。
  7. 如权利要求6所述的OLED背板，其中，所述第一半导体图案、第二半导体图案与第一存储电极的材料均为多晶硅，所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极 均为离子重掺杂区。
  8. 如权利要求7所述的OLED背板，其中，所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为P型离子重掺杂区，所述P型离子为硼离子。
  9. 如权利要求6所述的OLED背板，其中，所述平坦层上设有分别对应于所述第一源极接触区与第一漏极接触区上方的第一过孔与第二过孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第三过孔与第四过孔；
    所述层间介电层上设有分别对应于所述第一过孔、第二过孔、第三过孔及第四过孔下方的第五过孔、第六过孔、第七过孔及第八过孔；
    所述第一过孔与第五过孔构成第一源极接触孔，所述第二过孔与第六过孔构成第一漏极接触孔，所述第三过孔与第七过孔构成第二源极接触孔，所述第四过孔与第八过孔构成第二漏极接触孔。
  10. 如权利要求6所述的OLED背板，其中，所述像素定义层与支撑物层的材料均为有机光阻，二者材料相同，且在结构上为一体。
  11. 一种OLED背板，包括：从下到上依次层叠设置的衬底基板、缓冲层、半导体层、栅极绝缘层、栅极材料层、层间介电层、平坦层、源漏极材料层、像素定义层、以及支撑物层；
    所述半导体层包括间隔设置的第一半导体图案、第二半导体图案与第一存储电极；所述栅极材料层包括间隔设置的第一栅极、第二栅极与第二存储电极，所述第一栅极、第二栅极与第二存储电极分别对应于所述第一半导体图案、第二半导体图案与第一存储电极的上方设置；
    所述源漏极材料层包括间隔设置的第一源极、第一漏极、第二源极及第二漏极；
    所述第一半导体图案的两端分别设有第一源极接触区与第一漏极接触区，所述第二半导体图案的两端分别设有第二源极接触区与第二漏极接触区；
    所述平坦层与层间介电层上设有分别对应于所述第一源极接触区与第一漏极接触区上方的第一源极接触孔与第一漏极接触孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第二源极接触孔与第二漏极接触孔；
    所述第一源极、第一漏极、第二源极及第二漏极分别通过第一源极接触孔、第一漏极接触孔、第二源极接触孔及第二漏极接触孔与所述第一源极接触区、第一漏极接触区、第二源极接触区及第二漏极接触区相接触；
    所述第一源极、第一漏极、第一半导体图案及第一栅极构成开关TFT；所述第二源极、第二漏极、第二半导体图案及第二栅极构成驱动TFT；所述第一存储电极与第二存储电极构成存储电容；
    所述像素定义层上设有对应于所述第二源极上方的开口，该开口在所述第二源极上限定出OLED发光区；所述第二源极同时充当OLED阳极；
    其中，所述第一半导体图案、第二半导体图案与第一存储电极的材料均为多晶硅，所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为离子重掺杂区；
    其中，所述像素定义层与支撑物层的材料均为有机光阻，二者材料相同，且在结构上为一体。
  12. 如权利要求11所述的OLED背板，其中，所述第一源极接触区、第一漏极接触区、第二源极接触区、第二漏极接触区及整个第一存储电极均为P型离子重掺杂区，所述P型离子为硼离子。
  13. 如权利要求11所述的OLED背板，其中，所述平坦层上设有分别对应于所述第一源极接触区与第一漏极接触区上方的第一过孔与第二过孔、以及分别对应于所述第二源极接触区与第二漏极接触区上方的第三过孔与第四过孔；
    所述层间介电层上设有分别对应于所述第一过孔、第二过孔、第三过孔及第四过孔下方的第五过孔、第六过孔、第七过孔及第八过孔；
    所述第一过孔与第五过孔构成第一源极接触孔，所述第二过孔与第六过孔构成第一漏极接触孔，所述第三过孔与第七过孔构成第二源极接触孔，所述第四过孔与第八过孔构成第二漏极接触孔。
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